AU1182295A - Metallurgically bonded polymer vias - Google Patents

Metallurgically bonded polymer vias

Info

Publication number
AU1182295A
AU1182295A AU11822/95A AU1182295A AU1182295A AU 1182295 A AU1182295 A AU 1182295A AU 11822/95 A AU11822/95 A AU 11822/95A AU 1182295 A AU1182295 A AU 1182295A AU 1182295 A AU1182295 A AU 1182295A
Authority
AU
Australia
Prior art keywords
metallurgically bonded
bonded polymer
polymer vias
vias
metallurgically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU11822/95A
Inventor
Kathy Allen
Craig N Ernsberger
Sarah E Leach
Richard C Meyer
Ralph J Wenzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Publication of AU1182295A publication Critical patent/AU1182295A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU11822/95A 1993-11-19 1994-11-18 Metallurgically bonded polymer vias Abandoned AU1182295A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US154862 1988-02-10
US15486293A 1993-11-19 1993-11-19
PCT/US1994/013361 WO1995013901A1 (en) 1993-11-19 1994-11-18 Metallurgically bonded polymer vias

Publications (1)

Publication Number Publication Date
AU1182295A true AU1182295A (en) 1995-06-06

Family

ID=22553125

Family Applications (1)

Application Number Title Priority Date Filing Date
AU11822/95A Abandoned AU1182295A (en) 1993-11-19 1994-11-18 Metallurgically bonded polymer vias

Country Status (2)

Country Link
AU (1) AU1182295A (en)
WO (1) WO1995013901A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
CA2196024A1 (en) * 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
US7022266B1 (en) 1996-08-16 2006-04-04 Dow Corning Corporation Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
WO1998008362A1 (en) * 1996-08-16 1998-02-26 Craig Hugh P Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6312621B1 (en) 1998-11-17 2001-11-06 Johnson Matthey Electronics, Inc. Via fill formulations which are electrically and/or thermally conductive, or non-conductive
JP2000286549A (en) 1999-03-24 2000-10-13 Fujitsu Ltd Manufacture of substrate provided with via connection

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
US3184830A (en) * 1961-08-01 1965-05-25 Weldon V Lane Multilayer printed circuit board fabrication technique
US3335489A (en) * 1962-09-24 1967-08-15 North American Aviation Inc Interconnecting circuits with a gallium and indium eutectic
US3311966A (en) * 1962-09-24 1967-04-04 North American Aviation Inc Method of fabricating multilayer printed-wiring boards
US3187846A (en) * 1963-05-21 1965-06-08 Ford Motor Co Pivoted pawl parking brake mechanism
US3340600A (en) * 1964-11-02 1967-09-12 Western Electric Co Method of interconnecting conductors located on opposite sides of an insulating base
JPS58180094A (en) * 1982-04-16 1983-10-21 株式会社日立製作所 Method of producing multilayer printed circuit board
US4679122A (en) * 1984-10-09 1987-07-07 General Electric Company Metal core printed circuit board
US4874721A (en) * 1985-11-11 1989-10-17 Nec Corporation Method of manufacturing a multichip package with increased adhesive strength
US4919970A (en) * 1986-09-15 1990-04-24 International Business Machines Corporation Solder deposition control
US5117069A (en) * 1988-03-28 1992-05-26 Prime Computer, Inc. Circuit board fabrication
US4902857A (en) * 1988-12-27 1990-02-20 American Telephone And Telegraph Company, At&T Bell Laboratories Polymer interconnect structure
US5062896A (en) * 1990-03-30 1991-11-05 International Business Machines Corporation Solder/polymer composite paste and method
US5280414A (en) * 1990-06-11 1994-01-18 International Business Machines Corp. Au-Sn transient liquid bonding in high performance laminates
US5147084A (en) * 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties

Also Published As

Publication number Publication date
WO1995013901A1 (en) 1995-05-26

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