DE69708814D1 - Dielectric material with low temperature coefficient and with high unstressed quality, manufacturing process and single / multilayer printed circuit board with this material - Google Patents

Dielectric material with low temperature coefficient and with high unstressed quality, manufacturing process and single / multilayer printed circuit board with this material

Info

Publication number
DE69708814D1
DE69708814D1 DE69708814T DE69708814T DE69708814D1 DE 69708814 D1 DE69708814 D1 DE 69708814D1 DE 69708814 T DE69708814 T DE 69708814T DE 69708814 T DE69708814 T DE 69708814T DE 69708814 D1 DE69708814 D1 DE 69708814D1
Authority
DE
Germany
Prior art keywords
unstressed
quality
circuit board
printed circuit
low temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69708814T
Other languages
German (de)
Other versions
DE69708814T2 (en
Inventor
Hitoshi Yokoi
Hidetoshi Mizutani
Motohiko Sato
Kazushige Ohbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Application granted granted Critical
Publication of DE69708814D1 publication Critical patent/DE69708814D1/en
Publication of DE69708814T2 publication Critical patent/DE69708814T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/08—Strip line resonators
    • H01P7/082—Microstripline resonators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/08—Strip line resonators
    • H01P7/084—Triplate line resonators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69708814T 1996-09-26 1997-09-25 Dielectric material with low temperature coefficient and with high unstressed quality, manufacturing process and single / multilayer printed circuit board with this material Expired - Fee Related DE69708814T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27761896 1996-09-26
JP18456797A JP3761289B2 (en) 1996-09-26 1997-06-24 Dielectric material, manufacturing method thereof, circuit board using the same, and multilayer circuit board

Publications (2)

Publication Number Publication Date
DE69708814D1 true DE69708814D1 (en) 2002-01-17
DE69708814T2 DE69708814T2 (en) 2002-04-11

Family

ID=26502568

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69708814T Expired - Fee Related DE69708814T2 (en) 1996-09-26 1997-09-25 Dielectric material with low temperature coefficient and with high unstressed quality, manufacturing process and single / multilayer printed circuit board with this material

Country Status (5)

Country Link
US (1) US6121174A (en)
EP (1) EP0832859B1 (en)
JP (1) JP3761289B2 (en)
DE (1) DE69708814T2 (en)
FI (1) FI973786A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232251B1 (en) * 1998-09-29 2001-05-15 Kyocera Corporation Dielectric ceramics
US6578959B1 (en) * 2000-06-30 2003-06-17 Hewlett-Packard Development Company, L.P. Printer including microwave dryer
WO2004052804A1 (en) * 2002-12-06 2004-06-24 Hitachi Metals, Ltd. Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same
JP4688013B2 (en) * 2002-12-06 2011-05-25 日立金属株式会社 Low-frequency firing dielectric material for high frequency and multilayer electronic component for high frequency
EP1758962B1 (en) * 2004-06-22 2013-10-30 Asahi Glass Company, Limited Polishing method for glass substrate, and glass substrate
KR20090066862A (en) * 2007-12-20 2009-06-24 삼성전기주식회사 Manufacturing method of multi-layer substrate
CN104944786B (en) * 2015-06-17 2017-06-16 电子科技大学 A kind of low Jie's glass ceramics composite substrate material of low-temperature sintering and preparation method thereof
CN105217958B (en) * 2015-09-06 2017-11-21 电子科技大学 Low Jie's glass ceramic material of a kind of low-temperature sintering and preparation method thereof
CN109348713A (en) 2015-12-28 2019-02-15 日立金属株式会社 The manufacturing method and dielectric ceramics of dielectric ceramics
JP6728859B2 (en) * 2016-03-25 2020-07-22 日立金属株式会社 Ceramic substrate and manufacturing method thereof
US10862408B2 (en) 2018-07-12 2020-12-08 Parker-Hannifin Corporation Electric motor regenerated energy management method
CN116462496B (en) * 2023-05-08 2024-02-27 苏州市职业大学（苏州开放大学） Preparation method and product of dielectric ceramic

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615987A (en) * 1985-04-15 1986-10-07 Corning Glass Works Reinforcement of alkaline earth aluminosilicate glass-ceramics
US4853349A (en) * 1988-05-26 1989-08-01 Corning Glass Works Glass-ceramics suitable for dielectric substrates
US5023207A (en) * 1990-03-12 1991-06-11 Corning Incorporated Slawsonite-containing glass-ceramics
JP2778815B2 (en) * 1990-07-25 1998-07-23 日本碍子株式会社 Dielectric porcelain composition, method for producing the same, and wiring board using the same
US5262595A (en) * 1990-07-25 1993-11-16 Ngk Insulators, Ltd. Dielectric ceramic body including TiO2 dispersion in crystallized cordierite matrix phase, method of producing the same, and circuit board using the same
JP2763664B2 (en) * 1990-07-25 1998-06-11 日本碍子株式会社 Wiring board for distributed constant circuit
JP2642253B2 (en) * 1991-02-27 1997-08-20 日本特殊陶業株式会社 Glass-ceramic composite
JPH04286181A (en) * 1991-03-14 1992-10-12 Matsushita Electric Ind Co Ltd Composition for ceramic board
JPH04292460A (en) * 1991-03-20 1992-10-16 Ngk Insulators Ltd Dielectric ceramic composition
JP3372061B2 (en) * 1991-08-09 2003-01-27 ティーディーケイ株式会社 High frequency dielectric material, resonator and method of manufacturing the same
DE69217033T2 (en) * 1991-08-09 1997-08-14 Tdk Corp DIELECTRIC MATERIAL FOR HIGH FREQUENCY AND RESONATOR MADE THEREOF AND THEIR PRODUCTION
JP3164664B2 (en) * 1992-09-29 2001-05-08 京セラ株式会社 Multilayer circuit board
JPH06314916A (en) * 1993-04-30 1994-11-08 Kyocera Corp Strip line resonator
JP3231892B2 (en) * 1993-05-31 2001-11-26 京セラ株式会社 Method for manufacturing multilayer substrate
JP3443436B2 (en) * 1993-08-31 2003-09-02 京セラ株式会社 Multilayer circuit board with built-in capacitance
JP3297569B2 (en) * 1995-10-30 2002-07-02 京セラ株式会社 Low temperature firing porcelain composition
US5821181A (en) * 1996-04-08 1998-10-13 Motorola Inc. Ceramic composition

Also Published As

Publication number Publication date
DE69708814T2 (en) 2002-04-11
FI973786A0 (en) 1997-09-25
EP0832859B1 (en) 2001-12-05
JP3761289B2 (en) 2006-03-29
FI973786A (en) 1998-03-27
JPH10152370A (en) 1998-06-09
US6121174A (en) 2000-09-19
EP0832859A1 (en) 1998-04-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee