DE69708773D1 - Automatisches Messgerät - Google Patents

Automatisches Messgerät

Info

Publication number
DE69708773D1
DE69708773D1 DE69708773T DE69708773T DE69708773D1 DE 69708773 D1 DE69708773 D1 DE 69708773D1 DE 69708773 T DE69708773 T DE 69708773T DE 69708773 T DE69708773 T DE 69708773T DE 69708773 D1 DE69708773 D1 DE 69708773D1
Authority
DE
Germany
Prior art keywords
measuring device
automatic measuring
automatic
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69708773T
Other languages
English (en)
Other versions
DE69708773T2 (de
Inventor
Tamotsu Kurita
Manabu Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Speedfam Corp
Original Assignee
SpeedFam Co Ltd
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd, Speedfam Corp filed Critical SpeedFam Co Ltd
Application granted granted Critical
Publication of DE69708773D1 publication Critical patent/DE69708773D1/de
Publication of DE69708773T2 publication Critical patent/DE69708773T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69708773T 1996-07-18 1997-07-16 Automatisches Messgerät Expired - Fee Related DE69708773T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20639196A JPH1034529A (ja) 1996-07-18 1996-07-18 自動定寸装置

Publications (2)

Publication Number Publication Date
DE69708773D1 true DE69708773D1 (de) 2002-01-17
DE69708773T2 DE69708773T2 (de) 2002-08-08

Family

ID=16522579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69708773T Expired - Fee Related DE69708773T2 (de) 1996-07-18 1997-07-16 Automatisches Messgerät

Country Status (6)

Country Link
US (1) US5969521A (de)
EP (1) EP0819500B1 (de)
JP (1) JPH1034529A (de)
KR (1) KR100263786B1 (de)
DE (1) DE69708773T2 (de)
TW (1) TW404874B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY123230A (en) * 1998-10-16 2006-05-31 Tokyo Seimitsu Co Ltd Wafer grinder and method of detecting grinding amount
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
KR100718737B1 (ko) * 2000-01-17 2007-05-15 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6887127B2 (en) * 2001-04-02 2005-05-03 Murata Manufacturing Co., Ltd. Polishing apparatus
US6736720B2 (en) 2001-12-26 2004-05-18 Lam Research Corporation Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
US6937915B1 (en) 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
JP2006231471A (ja) 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機とその定寸制御方法
JP2006231470A (ja) 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機の定寸方法及び定寸装置
US9170234B2 (en) * 2006-11-01 2015-10-27 Industry-Academic Cooperation Foundation, Chosun University Magnetic sensor array and apparatus for detecting defect using the magnetic sensor array
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
DE102009024125B4 (de) * 2009-06-06 2023-07-27 Lapmaster Wolters Gmbh Verfahren zum Bearbeiten von flachen Werkstücken
JP5099111B2 (ja) * 2009-12-24 2012-12-12 信越半導体株式会社 両面研磨装置
KR101436485B1 (ko) * 2010-12-27 2014-09-01 가부시키가이샤 사무코 작업물의 연마방법 및 연마장치
CN102269577A (zh) * 2011-07-19 2011-12-07 浙江佳贝思绿色能源有限公司 测厚仪
CN103983181A (zh) * 2014-05-15 2014-08-13 中国科学院长春光学精密机械与物理研究所 高精度快速检测光栅副间隙的装置及方法
DE202014004244U1 (de) * 2014-05-21 2014-07-25 Reuter Messtechnik Gmbh Einrichtung zur Bestimmung des Abstandes zweier Bauteile zueinander, umfassend einen Wirbelstromaufnehmer mit einem durch eine Kabelverbindung daran angeschlossenen Messumformer
JP6309868B2 (ja) * 2014-09-26 2018-04-11 株式会社神戸製鋼所 形状測定装置および形状測定方法
KR101660900B1 (ko) * 2015-01-16 2016-10-10 주식회사 엘지실트론 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법
DE102016116012A1 (de) * 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2204581B2 (de) * 1972-02-01 1977-12-08 Wolters, Peter, 4020 Mettmann Steuereinrichtung fuer den bearbeitungsdruck einer laepp- oder honmaschine
JPS5151963A (en) * 1974-10-31 1976-05-07 Nippon Kokan Kk Kinzokuobijotaino jihakeijosokuteihoho oyobi sochi
JPS56146666A (en) * 1980-04-14 1981-11-14 Supiide Fuamu Kk Lapping device
JPS5715668A (en) * 1980-06-27 1982-01-27 Fujikoshi Kikai Kogyo Kk Lapping process and lapping device
JPS5776406A (en) * 1980-10-30 1982-05-13 Supiide Fuamu Kk Displacement detector in both side lapping plate
JPS57168109A (en) * 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate
US4407094A (en) * 1981-11-03 1983-10-04 Transat Corp. Apparatus for automatic lapping control
JPS58192747A (ja) * 1982-04-30 1983-11-10 Sumitomo Special Metals Co Ltd 精密寸法測定装置
US4814703A (en) * 1987-08-04 1989-03-21 The Boeing Company Method and apparatus for gap measurement between a graphite/epoxy structure and a metallic model
JPH03234468A (ja) * 1990-02-06 1991-10-18 Canon Inc スタンパの金型取付面の研磨方法およびその研磨機

Also Published As

Publication number Publication date
JPH1034529A (ja) 1998-02-10
KR100263786B1 (ko) 2000-12-01
US5969521A (en) 1999-10-19
EP0819500A1 (de) 1998-01-21
DE69708773T2 (de) 2002-08-08
EP0819500B1 (de) 2001-12-05
KR980008456A (ko) 1998-04-30
TW404874B (en) 2000-09-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee