DE69708021T2 - Baugruppen aus Substraten und elektronischen Bauteilen - Google Patents

Baugruppen aus Substraten und elektronischen Bauteilen

Info

Publication number
DE69708021T2
DE69708021T2 DE69708021T DE69708021T DE69708021T2 DE 69708021 T2 DE69708021 T2 DE 69708021T2 DE 69708021 T DE69708021 T DE 69708021T DE 69708021 T DE69708021 T DE 69708021T DE 69708021 T2 DE69708021 T2 DE 69708021T2
Authority
DE
Germany
Prior art keywords
substrates
electronic components
assemblies made
assemblies
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69708021T
Other languages
English (en)
Other versions
DE69708021D1 (de
Inventor
William P Trumble
Murray W Hamilton
David Bilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Nortel Networks Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nortel Networks Ltd filed Critical Nortel Networks Ltd
Publication of DE69708021D1 publication Critical patent/DE69708021D1/de
Application granted granted Critical
Publication of DE69708021T2 publication Critical patent/DE69708021T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69708021T 1996-09-19 1997-09-04 Baugruppen aus Substraten und elektronischen Bauteilen Expired - Fee Related DE69708021T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71930096A 1996-09-19 1996-09-19

Publications (2)

Publication Number Publication Date
DE69708021D1 DE69708021D1 (de) 2001-12-13
DE69708021T2 true DE69708021T2 (de) 2002-03-14

Family

ID=24889533

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69708021T Expired - Fee Related DE69708021T2 (de) 1996-09-19 1997-09-04 Baugruppen aus Substraten und elektronischen Bauteilen

Country Status (5)

Country Link
US (1) US6313412B1 (de)
EP (1) EP0831683B1 (de)
JP (1) JPH10107420A (de)
CA (1) CA2214130C (de)
DE (1) DE69708021T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000018536A1 (fr) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP3477692B2 (ja) 1998-12-18 2003-12-10 株式会社村田製作所 電子部品
WO2000042829A1 (en) * 1999-01-11 2000-07-20 Matsushita Electric Industrial Co., Ltd. Article having a circuit soldered with parts and method for recycling wastes of the same
FR2797554B1 (fr) * 1999-08-12 2001-11-02 Valeo Electronique Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procede
US6638847B1 (en) * 2000-04-19 2003-10-28 Advanced Interconnect Technology Ltd. Method of forming lead-free bump interconnections
JP3621365B2 (ja) * 2000-09-18 2005-02-16 第一電子工業株式会社 電気コネクタ
US7164585B2 (en) * 2003-03-31 2007-01-16 Intel Corporation Thermal interface apparatus, systems, and methods
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2007081235A (ja) * 2005-09-15 2007-03-29 Renesas Technology Corp 半導体装置の製造方法
WO2009051181A1 (ja) 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
CN107735834B (zh) 2015-06-30 2019-11-19 哈钦森技术股份有限公司 具有改进的可靠性的盘驱动器头部悬架结构
US9877399B2 (en) * 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
CN109560062B (zh) * 2017-09-26 2023-08-22 京瓷株式会社 接合构造及半导体封装
CN112958940B (zh) * 2021-03-23 2022-06-28 贵研铂业股份有限公司 银基/铜基/金基钎料焊膏、制备方法及焊接工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671844A (en) 1951-07-26 1954-03-09 Guenther W Laubmeyer Tin solder
GB2158459A (en) * 1984-05-05 1985-11-13 Imi Yorkshire Imperial Limited Solder
JPS62204558A (ja) * 1986-03-05 1987-09-09 Shinko Electric Ind Co Ltd リ−ドフレ−ム
US4778733A (en) 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework
US5297008A (en) 1991-12-31 1994-03-22 Compaq Computer Corporation (Compaq) Polymeric composite lead wire and method for making same
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
US5444293A (en) * 1993-09-22 1995-08-22 Opl Limited Structure and method for providing a lead frame with enhanced solder wetting leads
US5435968A (en) * 1994-01-21 1995-07-25 Touchstone, Inc. A lead-free solder composition
DE19512838C2 (de) * 1995-04-06 2000-09-14 Hella Kg Hueck & Co Elektrisches oder elektronisches Gerät
GB9701819D0 (en) * 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy

Also Published As

Publication number Publication date
DE69708021D1 (de) 2001-12-13
EP0831683B1 (de) 2001-11-07
US6313412B1 (en) 2001-11-06
JPH10107420A (ja) 1998-04-24
CA2214130C (en) 2003-12-02
EP0831683A1 (de) 1998-03-25
CA2214130A1 (en) 1998-03-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee