DE69701785T2 - Elektronisches Bauteil-Saugverfahren - Google Patents

Elektronisches Bauteil-Saugverfahren

Info

Publication number
DE69701785T2
DE69701785T2 DE69701785T DE69701785T DE69701785T2 DE 69701785 T2 DE69701785 T2 DE 69701785T2 DE 69701785 T DE69701785 T DE 69701785T DE 69701785 T DE69701785 T DE 69701785T DE 69701785 T2 DE69701785 T2 DE 69701785T2
Authority
DE
Germany
Prior art keywords
electronic component
component suction
suction process
electronic
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69701785T
Other languages
English (en)
Other versions
DE69701785D1 (de
Inventor
Takao Kashiwazaki
Toko Shirakawa
Kouichi Yasunaga
Hironori Konno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69701785D1 publication Critical patent/DE69701785D1/de
Application granted granted Critical
Publication of DE69701785T2 publication Critical patent/DE69701785T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69701785T 1996-09-26 1997-09-25 Elektronisches Bauteil-Saugverfahren Expired - Lifetime DE69701785T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8254032A JPH10107493A (ja) 1996-09-26 1996-09-26 電子部品吸着方法

Publications (2)

Publication Number Publication Date
DE69701785D1 DE69701785D1 (de) 2000-05-31
DE69701785T2 true DE69701785T2 (de) 2000-08-17

Family

ID=17259298

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69701785T Expired - Lifetime DE69701785T2 (de) 1996-09-26 1997-09-25 Elektronisches Bauteil-Saugverfahren

Country Status (3)

Country Link
EP (1) EP0833556B1 (de)
JP (1) JPH10107493A (de)
DE (1) DE69701785T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19919922A1 (de) * 1999-04-30 2000-11-16 Siemens Ag Vorrichtung und Verfahren zum Bestücken von Substraten mit Bauelementen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1091341C (zh) * 1995-02-17 2002-09-18 松下电器产业株式会社 电子元件装配方法及装置

Also Published As

Publication number Publication date
EP0833556B1 (de) 2000-04-26
DE69701785D1 (de) 2000-05-31
EP0833556A3 (de) 1998-07-01
EP0833556A2 (de) 1998-04-01
JPH10107493A (ja) 1998-04-24

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Free format text: KASHIWAZAKI, TAKAO, 1006, OSAKA-FU, JP SHIRAKAWA, TOKIO, 1006, OSAKA-FU, JP YASUNAGA, KOUICHI, 1006,OSAKA-FU, JP KONNO, HIRONORI, 1006, OSAKA-FU, JP

Free format text: KASHIWAZAKI, TAKAO, 1006, OSAKA-FU, JP SHIRAKAWA, TOKIO, 1006, OSAKA-FU, JP YASUNAGA, KOUICHI, 1006, OSAKA-FU, JP KONNO, HIRONORI, 1006, OSAKA-FU, JP

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)