DE69701299D1 - 1,2-n-Acyl-n-Methylen-Ethylendiamin und diese enthaltende elektroleitende Paste - Google Patents
1,2-n-Acyl-n-Methylen-Ethylendiamin und diese enthaltende elektroleitende PasteInfo
- Publication number
- DE69701299D1 DE69701299D1 DE69701299T DE69701299T DE69701299D1 DE 69701299 D1 DE69701299 D1 DE 69701299D1 DE 69701299 T DE69701299 T DE 69701299T DE 69701299 T DE69701299 T DE 69701299T DE 69701299 D1 DE69701299 D1 DE 69701299D1
- Authority
- DE
- Germany
- Prior art keywords
- ethylenediamine
- acyl
- methylene
- paste containing
- electroconductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C233/00—Carboxylic acid amides
- C07C233/01—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C233/34—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups
- C07C233/35—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom
- C07C233/36—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of an acyclic saturated carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
- C07C251/02—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups
- C07C251/04—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10695896 | 1996-04-26 | ||
JP10695796 | 1996-04-26 | ||
JP28629296 | 1996-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69701299D1 true DE69701299D1 (de) | 2000-03-23 |
DE69701299T2 DE69701299T2 (de) | 2000-08-24 |
Family
ID=27310875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69701299T Expired - Fee Related DE69701299T2 (de) | 1996-04-26 | 1997-04-25 | 1,2-n-Acyl-n-Methylen-Ethylendiamin und diese enthaltende elektroleitende Paste |
Country Status (7)
Country | Link |
---|---|
US (1) | US5779941A (de) |
EP (1) | EP0803499B1 (de) |
KR (1) | KR100297519B1 (de) |
CA (1) | CA2203723C (de) |
DE (1) | DE69701299T2 (de) |
SG (1) | SG52961A1 (de) |
TW (1) | TW363078B (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003105160A1 (ja) * | 2002-05-31 | 2003-12-18 | タツタ電線株式会社 | 導電性ペースト、これを用いた多層基板及びその製造方法 |
KR100719993B1 (ko) * | 2003-09-26 | 2007-05-21 | 히다치 가세고교 가부시끼가이샤 | 혼합 도전 분말 및 그의 이용 |
JP6884692B2 (ja) * | 2015-03-26 | 2021-06-09 | 三井金属鉱業株式会社 | 銅粉及びそれを含む導電性組成物 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1311019A (en) * | 1969-12-28 | 1973-03-21 | Matsushita Electric Works Ltd | Copper-clad laminate and production thereof |
US4326067A (en) * | 1980-12-03 | 1982-04-20 | The Dow Chemical Company | Process for making N-(2-aminoethyl)amides |
US4855497A (en) * | 1985-04-02 | 1989-08-08 | Chugai Seiyaku Kabushiki Kaisha | Novel diamine derivatives |
EP0239901B1 (de) * | 1986-03-31 | 1992-11-11 | Tatsuta Electric Wire & Cable Co., Ltd | Leitfähige Kupferpastenzusammensetzung |
JPH0412595A (ja) * | 1990-05-02 | 1992-01-17 | Mitsubishi Petrochem Co Ltd | 導電性ペースト組成物 |
US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
JPH0649272A (ja) * | 1992-07-31 | 1994-02-22 | Nippon Oil & Fats Co Ltd | 導電性組成物 |
-
1997
- 1997-04-22 US US08/844,817 patent/US5779941A/en not_active Expired - Fee Related
- 1997-04-24 TW TW086105334A patent/TW363078B/zh active
- 1997-04-25 DE DE69701299T patent/DE69701299T2/de not_active Expired - Fee Related
- 1997-04-25 EP EP97302869A patent/EP0803499B1/de not_active Expired - Lifetime
- 1997-04-25 KR KR1019970015478A patent/KR100297519B1/ko not_active IP Right Cessation
- 1997-04-25 CA CA002203723A patent/CA2203723C/en not_active Expired - Fee Related
- 1997-04-26 SG SG1997001320A patent/SG52961A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG52961A1 (en) | 1998-09-28 |
US5779941A (en) | 1998-07-14 |
TW363078B (en) | 1999-07-01 |
EP0803499B1 (de) | 2000-02-16 |
CA2203723A1 (en) | 1997-10-26 |
CA2203723C (en) | 2002-03-26 |
KR19980032087A (ko) | 1998-07-25 |
EP0803499A1 (de) | 1997-10-29 |
KR100297519B1 (ko) | 2001-09-03 |
DE69701299T2 (de) | 2000-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |