DE69701105D1 - Flüssigkeitskühlsystem für AM-Hochleistungshalbleitersender - Google Patents
Flüssigkeitskühlsystem für AM-HochleistungshalbleitersenderInfo
- Publication number
- DE69701105D1 DE69701105D1 DE69701105T DE69701105T DE69701105D1 DE 69701105 D1 DE69701105 D1 DE 69701105D1 DE 69701105 T DE69701105 T DE 69701105T DE 69701105 T DE69701105 T DE 69701105T DE 69701105 D1 DE69701105 D1 DE 69701105D1
- Authority
- DE
- Germany
- Prior art keywords
- cooling system
- power semiconductor
- liquid cooling
- transmitters
- semiconductor transmitters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Amplifiers (AREA)
- Transmitters (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/629,343 US5703536A (en) | 1996-04-08 | 1996-04-08 | Liquid cooling system for high power solid state AM transmitter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69701105D1 true DE69701105D1 (de) | 2000-02-17 |
DE69701105T2 DE69701105T2 (de) | 2000-06-29 |
Family
ID=24522593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69701105T Expired - Fee Related DE69701105T2 (de) | 1996-04-08 | 1997-03-05 | Flüssigkeitskühlsystem für AM-Hochleistungshalbleitersender |
Country Status (5)
Country | Link |
---|---|
US (1) | US5703536A (de) |
EP (1) | EP0803986B1 (de) |
JP (1) | JPH1084291A (de) |
CA (1) | CA2199654A1 (de) |
DE (1) | DE69701105T2 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6161612A (en) * | 1998-06-02 | 2000-12-19 | Ericsson Inc. | Cooling system and method for distributing cooled air |
US6305406B1 (en) | 1998-06-02 | 2001-10-23 | Emerson Electric Co. | Spray hood protector in a fluid-based cooling system |
US6252771B1 (en) | 1999-01-06 | 2001-06-26 | Southern Audio Services | Removable remote control amplifier |
US6307746B1 (en) | 1999-12-06 | 2001-10-23 | Gateway, Inc. | Power adapter having a thermal cooling assembly for a digital information appliance |
US7086452B1 (en) * | 2000-06-30 | 2006-08-08 | Intel Corporation | Method and an apparatus for cooling a computer |
US6404631B1 (en) * | 2000-11-08 | 2002-06-11 | Hyundai Electronics Industries, Co., Ltd. | Cooling device of linear power amplifier in mobile communication system |
KR100385134B1 (ko) * | 2001-04-16 | 2003-05-23 | 주식회사 동양에이티에스 | 이동통신시스템의 기지국 냉각장치 |
KR100397126B1 (ko) * | 2001-09-04 | 2003-09-06 | 주식회사 현대시스콤 | Lpa 냉각 장치 |
US6942018B2 (en) | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US7134486B2 (en) | 2001-09-28 | 2006-11-14 | The Board Of Trustees Of The Leeland Stanford Junior University | Control of electrolysis gases in electroosmotic pump systems |
US6606251B1 (en) | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US7086839B2 (en) | 2002-09-23 | 2006-08-08 | Cooligy, Inc. | Micro-fabricated electrokinetic pump with on-frit electrode |
US6881039B2 (en) * | 2002-09-23 | 2005-04-19 | Cooligy, Inc. | Micro-fabricated electrokinetic pump |
US7245183B2 (en) | 2002-11-14 | 2007-07-17 | M/A-Com Eurotec Bv | Apparatus, methods and articles of manufacture for processing an electromagnetic wave |
AU2003282499A1 (en) * | 2002-10-08 | 2004-05-04 | M/A-Com Eurotec Bv | Envelope elimination and restoration amplifier and method thereof |
US6994151B2 (en) | 2002-10-22 | 2006-02-07 | Cooligy, Inc. | Vapor escape microchannel heat exchanger |
TWI295726B (en) * | 2002-11-01 | 2008-04-11 | Cooligy Inc | Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device |
US6986382B2 (en) | 2002-11-01 | 2006-01-17 | Cooligy Inc. | Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
DE10393588T5 (de) | 2002-11-01 | 2006-02-23 | Cooligy, Inc., Mountain View | Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch |
US7000684B2 (en) | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7090001B2 (en) * | 2003-01-31 | 2006-08-15 | Cooligy, Inc. | Optimized multiple heat pipe blocks for electronics cooling |
US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
US7021369B2 (en) | 2003-07-23 | 2006-04-04 | Cooligy, Inc. | Hermetic closed loop fluid system |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US7073340B2 (en) * | 2003-10-20 | 2006-07-11 | Waukesha Electric Systems | Cryogenic compressor enclosure device and method |
US7296417B2 (en) * | 2004-12-23 | 2007-11-20 | Nanocoolers, Inc. | Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator |
US7913719B2 (en) | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
TW200810676A (en) | 2006-03-30 | 2008-02-16 | Cooligy Inc | Multi device cooling |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US7777130B2 (en) * | 2007-06-18 | 2010-08-17 | Vivant Medical, Inc. | Microwave cable cooling |
TW200912621A (en) | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
CN102171897A (zh) | 2008-08-05 | 2011-08-31 | 固利吉股份有限公司 | 用于激光二极管冷却的微型换热器 |
CN101835005B (zh) * | 2010-04-08 | 2013-07-17 | 福建三元达通讯股份有限公司 | 一种液冷发射机系统 |
CN103348185A (zh) * | 2010-06-01 | 2013-10-09 | 派拉斯科Ip有限责任公司 | 阵列半导体辐射发射装置的分布冷却 |
CN106100596A (zh) * | 2016-08-17 | 2016-11-09 | 北京北广科技股份有限公司 | 一种甚低频液冷固态发射机的功率放大系统 |
US11699634B2 (en) | 2019-05-03 | 2023-07-11 | Applied Materials, Inc. | Water cooled plate for heat management in power amplifiers |
US10939592B2 (en) * | 2019-06-14 | 2021-03-02 | Intel Corporation | Liquid cooling system with sub atmospheric pressure coolant |
CN217509346U (zh) * | 2022-03-16 | 2022-09-27 | 广运机械工程股份有限公司 | 热交换系统 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4037270A (en) * | 1976-05-24 | 1977-07-19 | Control Data Corporation | Circuit packaging and cooling |
US4580111A (en) * | 1981-12-24 | 1986-04-01 | Harris Corporation | Amplitude modulation using digitally selected carrier amplifiers |
EP0281404A3 (de) * | 1987-03-04 | 1989-11-23 | Nec Corporation | Kühlungsvorrichtung für elektronische Baugruppe |
CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
US4873613A (en) * | 1988-11-25 | 1989-10-10 | Iversen Arthur H | Compact high power modular RF semi-conductor systems packaging |
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
DE4007566C2 (de) * | 1990-03-09 | 1998-07-16 | Siemens Ag | Leistungsverstärker für die Speisung einer Induktivität mit geschalteten Transistoren |
US5070309A (en) * | 1991-01-28 | 1991-12-03 | Harris Corporation | RF power amplifier having improved amplifier protection |
US5218322A (en) * | 1992-04-07 | 1993-06-08 | Hughes Aircraft Company | Solid state microwave power amplifier module |
US5309114A (en) * | 1993-06-30 | 1994-05-03 | Harris Corporation | Pulse step modulator |
DE4401609C1 (de) * | 1994-01-20 | 1994-12-22 | Siemens Ag | Leistungsverstärker für die Speisung einer induktiven Last mit geschalteten Transistoren |
-
1996
- 1996-04-08 US US08/629,343 patent/US5703536A/en not_active Expired - Fee Related
-
1997
- 1997-03-05 EP EP97103631A patent/EP0803986B1/de not_active Expired - Lifetime
- 1997-03-05 DE DE69701105T patent/DE69701105T2/de not_active Expired - Fee Related
- 1997-03-11 CA CA002199654A patent/CA2199654A1/en not_active Abandoned
- 1997-04-04 JP JP9086838A patent/JPH1084291A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE69701105T2 (de) | 2000-06-29 |
EP0803986B1 (de) | 2000-01-12 |
JPH1084291A (ja) | 1998-03-31 |
CA2199654A1 (en) | 1997-10-08 |
EP0803986A1 (de) | 1997-10-29 |
US5703536A (en) | 1997-12-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |