DE69632020D1 - Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren - Google Patents
Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-BildsensorenInfo
- Publication number
- DE69632020D1 DE69632020D1 DE69632020T DE69632020T DE69632020D1 DE 69632020 D1 DE69632020 D1 DE 69632020D1 DE 69632020 T DE69632020 T DE 69632020T DE 69632020 T DE69632020 T DE 69632020T DE 69632020 D1 DE69632020 D1 DE 69632020D1
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- low noise
- image sensors
- metal lines
- film image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/580,094 US5616524A (en) | 1995-12-22 | 1995-12-22 | Repair method for low noise metal lines in thin film imager devices |
US580094 | 2000-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69632020D1 true DE69632020D1 (de) | 2004-05-06 |
DE69632020T2 DE69632020T2 (de) | 2004-11-18 |
Family
ID=24319673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996632020 Expired - Fee Related DE69632020T2 (de) | 1995-12-22 | 1996-12-17 | Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5616524A (de) |
EP (1) | EP0780720B1 (de) |
JP (1) | JPH09275203A (de) |
DE (1) | DE69632020T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19509231C2 (de) * | 1995-03-17 | 2000-02-17 | Ibm | Verfahren zum Aufbringen einer Metallisierung auf einem Isolator und zum Öffnen von Durchgangslöchern in diesem |
US5834321A (en) * | 1995-12-18 | 1998-11-10 | General Electric Company | Low noise address line repair method for thin film imager devices |
US6303488B1 (en) | 1997-02-12 | 2001-10-16 | Micron Technology, Inc. | Semiconductor processing methods of forming openings to devices and substrates, exposing material from which photoresist cannot be substantially selectively removed |
JPH10229174A (ja) * | 1997-02-18 | 1998-08-25 | Mitsubishi Electric Corp | 半導体記憶装置の製造方法 |
US6404828B2 (en) * | 1997-03-12 | 2002-06-11 | Interdigital Technology Corporation | Multichannel decoder |
US5932485A (en) * | 1997-10-21 | 1999-08-03 | Micron Technology, Inc. | Method of laser ablation of semiconductor structures |
US5976978A (en) * | 1997-12-22 | 1999-11-02 | General Electric Company | Process for repairing data transmission lines of imagers |
US6495468B2 (en) | 1998-12-22 | 2002-12-17 | Micron Technology, Inc. | Laser ablative removal of photoresist |
US6384461B1 (en) * | 1999-10-15 | 2002-05-07 | Xerox Corporation | Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays |
US6617561B1 (en) | 2000-03-09 | 2003-09-09 | General Electric Company | Low noise and high yield data line structure for imager |
US7125729B2 (en) * | 2001-11-02 | 2006-10-24 | Atmel Germany Gmbh | Method for opening the plastic housing of an electronic module |
US8450738B2 (en) * | 2007-12-19 | 2013-05-28 | Sharp Kabushiki Kaisha | Active matrix substrate, production method of the same, liquid crystal panel, liquid crystal display device, liquid crystal display unit, and television receiver |
IL197349A0 (en) * | 2009-03-02 | 2009-12-24 | Orbotech Ltd | A method and system for electrical circuit repair |
US9773836B1 (en) * | 2016-11-04 | 2017-09-26 | Dpix, Llc | Method and functional architecture for inline repair of defective lithographically masked layers |
CN108227324B (zh) * | 2018-01-15 | 2020-12-04 | 深圳市华星光电技术有限公司 | 用于断线修补的测试键和测试方法以及断线修补方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688896A (en) * | 1985-03-04 | 1987-08-25 | General Electric Company | Information conversion device with auxiliary address lines for enhancing manufacturing yield |
JPH02116849A (ja) * | 1988-10-26 | 1990-05-01 | Fujitsu Ltd | パターン修正方法 |
US5079070A (en) * | 1990-10-11 | 1992-01-07 | International Business Machines Corporation | Repair of open defects in thin film conductors |
US5153408A (en) * | 1990-10-31 | 1992-10-06 | International Business Machines Corporation | Method and structure for repairing electrical lines |
US5303074A (en) * | 1991-04-29 | 1994-04-12 | General Electric Company | Embedded repair lines for thin film electronic display or imager devices |
US5518956A (en) * | 1993-09-02 | 1996-05-21 | General Electric Company | Method of isolating vertical shorts in an electronic array using laser ablation |
WO1995017768A1 (en) * | 1993-12-20 | 1995-06-29 | General Electronic Company | Address line repair structure and method for thin film imager devices |
US5475246A (en) * | 1993-12-20 | 1995-12-12 | General Electric Company | Repair line structure for thin film electronic devices |
US5397607A (en) * | 1994-05-17 | 1995-03-14 | International Business Machines Corporation | Input/output (I/O) thin film repair process |
US5552607A (en) * | 1995-06-21 | 1996-09-03 | General Electric Company | Imager device with integral address line repair segments |
-
1995
- 1995-12-22 US US08/580,094 patent/US5616524A/en not_active Expired - Fee Related
-
1996
- 1996-12-16 JP JP8334347A patent/JPH09275203A/ja not_active Withdrawn
- 1996-12-17 DE DE1996632020 patent/DE69632020T2/de not_active Expired - Fee Related
- 1996-12-17 EP EP96309191A patent/EP0780720B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5616524A (en) | 1997-04-01 |
EP0780720B1 (de) | 2004-03-31 |
JPH09275203A (ja) | 1997-10-21 |
DE69632020T2 (de) | 2004-11-18 |
EP0780720A1 (de) | 1997-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69617086D1 (de) | Verfahren zum Ausbessern metallischer Einkristallgegenstände | |
DE69605280D1 (de) | Verfahren zum aufbringen diamantähnlicher kohlenstoff-filme | |
DE69514809D1 (de) | Verfahren zum reparieren von substraten | |
DE69635099D1 (de) | Verfahren und Vorrichtung für kontextempfindliches Pfadsende | |
DE69632020D1 (de) | Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren | |
DE69613584D1 (de) | Verfahren zum auftragen metallischer verbundschichten | |
DE69636740D1 (de) | Verfahren zum selbsttätigen mehrlagenschweissen | |
DE69508921D1 (de) | Verfahren zum nachweis von staphylokokken | |
DE69636330D1 (de) | Verfahren für On-line- und Echzeit-Datenmigration | |
DE69615484D1 (de) | Verfahren zum umlenken von rissen | |
DE69626360D1 (de) | Verfahren zur Bearbeitung eines Halbleiterkristallblocks | |
DE69636693D1 (de) | Verfahren zur Interferenz-Überwachung | |
DE59601882D1 (de) | Verfahren zur anzeige von mehreren informationen | |
DE69623949D1 (de) | Verfahren zum mehrschichtbeschichten | |
DE59609069D1 (de) | Verfahren zum ermitteln einer ziel-atm-adresse | |
DE69612913D1 (de) | Verfahren zum Innenbeschichten eines gebogenen Rohres | |
DE69628464D1 (de) | Reinigungsverfahren für stoffe | |
DE59502479D1 (de) | Verfahren zum Umformen von Metallblech | |
DE69630686D1 (de) | Verfahren zur echtheitsprüfung von münzen | |
ATE243789T1 (de) | Enzymatisches verfahren zum färben | |
DE59304051D1 (de) | Verfahren zur kurvenfahrterkennung | |
DE69632019D1 (de) | Verfahren zum Reparieren einer rauscharmen Adressenleitung für Dünnfilm-Bildsensoren | |
DE69726732D1 (de) | Verfahren zum durchführen einer mit doppelter unterschrift gesichterten elektronischen transaktion | |
DE69428555D1 (de) | Anti-aliasing-Verfahren für Trickfilm | |
DE69631812D1 (de) | System und Verfahren für ein hochadressierbares Drucksystem |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |