DE69632020D1 - Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren - Google Patents

Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren

Info

Publication number
DE69632020D1
DE69632020D1 DE69632020T DE69632020T DE69632020D1 DE 69632020 D1 DE69632020 D1 DE 69632020D1 DE 69632020 T DE69632020 T DE 69632020T DE 69632020 T DE69632020 T DE 69632020T DE 69632020 D1 DE69632020 D1 DE 69632020D1
Authority
DE
Germany
Prior art keywords
thin film
low noise
image sensors
metal lines
film image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69632020T
Other languages
English (en)
Other versions
DE69632020T2 (de
Inventor
Ching-Yeu Wei
Jianqiang Liu
Roger Stephen Salisbury
Robert Forrest Kwasnick
George Edward Possin
Douglas Albagli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE69632020D1 publication Critical patent/DE69632020D1/de
Application granted granted Critical
Publication of DE69632020T2 publication Critical patent/DE69632020T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE1996632020 1995-12-22 1996-12-17 Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren Expired - Fee Related DE69632020T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/580,094 US5616524A (en) 1995-12-22 1995-12-22 Repair method for low noise metal lines in thin film imager devices
US580094 1995-12-22

Publications (2)

Publication Number Publication Date
DE69632020D1 true DE69632020D1 (de) 2004-05-06
DE69632020T2 DE69632020T2 (de) 2004-11-18

Family

ID=24319673

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996632020 Expired - Fee Related DE69632020T2 (de) 1995-12-22 1996-12-17 Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren

Country Status (4)

Country Link
US (1) US5616524A (de)
EP (1) EP0780720B1 (de)
JP (1) JPH09275203A (de)
DE (1) DE69632020T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19509231C2 (de) * 1995-03-17 2000-02-17 Ibm Verfahren zum Aufbringen einer Metallisierung auf einem Isolator und zum Öffnen von Durchgangslöchern in diesem
US5834321A (en) * 1995-12-18 1998-11-10 General Electric Company Low noise address line repair method for thin film imager devices
US6303488B1 (en) 1997-02-12 2001-10-16 Micron Technology, Inc. Semiconductor processing methods of forming openings to devices and substrates, exposing material from which photoresist cannot be substantially selectively removed
JPH10229174A (ja) * 1997-02-18 1998-08-25 Mitsubishi Electric Corp 半導体記憶装置の製造方法
US6404828B2 (en) * 1997-03-12 2002-06-11 Interdigital Technology Corporation Multichannel decoder
US5932485A (en) * 1997-10-21 1999-08-03 Micron Technology, Inc. Method of laser ablation of semiconductor structures
US5976978A (en) * 1997-12-22 1999-11-02 General Electric Company Process for repairing data transmission lines of imagers
US6495468B2 (en) 1998-12-22 2002-12-17 Micron Technology, Inc. Laser ablative removal of photoresist
US6384461B1 (en) * 1999-10-15 2002-05-07 Xerox Corporation Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays
US6617561B1 (en) 2000-03-09 2003-09-09 General Electric Company Low noise and high yield data line structure for imager
EP1440608B1 (de) * 2001-11-02 2006-02-15 ATMEL Germany GmbH Verfahren zum offnen eines kunststoffgehauses einer elektronischen baugruppe
CN101903826A (zh) * 2007-12-19 2010-12-01 夏普株式会社 有源矩阵基板、有源矩阵基板的制造方法、液晶面板、液晶显示装置、液晶显示单元、电视接收机
IL197349A0 (en) * 2009-03-02 2009-12-24 Orbotech Ltd A method and system for electrical circuit repair
US9773836B1 (en) * 2016-11-04 2017-09-26 Dpix, Llc Method and functional architecture for inline repair of defective lithographically masked layers
CN108227324B (zh) * 2018-01-15 2020-12-04 深圳市华星光电技术有限公司 用于断线修补的测试键和测试方法以及断线修补方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688896A (en) * 1985-03-04 1987-08-25 General Electric Company Information conversion device with auxiliary address lines for enhancing manufacturing yield
JPH02116849A (ja) * 1988-10-26 1990-05-01 Fujitsu Ltd パターン修正方法
US5079070A (en) * 1990-10-11 1992-01-07 International Business Machines Corporation Repair of open defects in thin film conductors
US5153408A (en) * 1990-10-31 1992-10-06 International Business Machines Corporation Method and structure for repairing electrical lines
US5303074A (en) * 1991-04-29 1994-04-12 General Electric Company Embedded repair lines for thin film electronic display or imager devices
US5518956A (en) * 1993-09-02 1996-05-21 General Electric Company Method of isolating vertical shorts in an electronic array using laser ablation
WO1995017768A1 (en) * 1993-12-20 1995-06-29 General Electronic Company Address line repair structure and method for thin film imager devices
US5475246A (en) * 1993-12-20 1995-12-12 General Electric Company Repair line structure for thin film electronic devices
US5397607A (en) * 1994-05-17 1995-03-14 International Business Machines Corporation Input/output (I/O) thin film repair process
US5552607A (en) * 1995-06-21 1996-09-03 General Electric Company Imager device with integral address line repair segments

Also Published As

Publication number Publication date
EP0780720B1 (de) 2004-03-31
US5616524A (en) 1997-04-01
JPH09275203A (ja) 1997-10-21
EP0780720A1 (de) 1997-06-25
DE69632020T2 (de) 2004-11-18

Similar Documents

Publication Publication Date Title
DE69617086D1 (de) Verfahren zum Ausbessern metallischer Einkristallgegenstände
DE69605280D1 (de) Verfahren zum aufbringen diamantähnlicher kohlenstoff-filme
DE69514809D1 (de) Verfahren zum reparieren von substraten
DE69635099D1 (de) Verfahren und Vorrichtung für kontextempfindliches Pfadsende
DE69632020D1 (de) Verfahren zum Reparieren von rauscharmen Metallleitungen für Dünnfilm-Bildsensoren
DE69613584D1 (de) Verfahren zum auftragen metallischer verbundschichten
DE69636740D1 (de) Verfahren zum selbsttätigen mehrlagenschweissen
DE19681602T1 (de) Verfahren zum Entfernen von Metall
DE69508921D1 (de) Verfahren zum nachweis von staphylokokken
DE69615484D1 (de) Verfahren zum umlenken von rissen
DE69626360D1 (de) Verfahren zur Bearbeitung eines Halbleiterkristallblocks
DE69516118D1 (de) Verfahren zum superplastischen Strangpressen
DE69623949D1 (de) Verfahren zum mehrschichtbeschichten
DE59609069D1 (de) Verfahren zum ermitteln einer ziel-atm-adresse
DE69612913D1 (de) Verfahren zum Innenbeschichten eines gebogenen Rohres
DE69628464D1 (de) Reinigungsverfahren für stoffe
DE59502479D1 (de) Verfahren zum Umformen von Metallblech
DE69630686D1 (de) Verfahren zur echtheitsprüfung von münzen
DE69632019D1 (de) Verfahren zum Reparieren einer rauscharmen Adressenleitung für Dünnfilm-Bildsensoren
DE69726732D1 (de) Verfahren zum durchführen einer mit doppelter unterschrift gesichterten elektronischen transaktion
DE69428555D1 (de) Anti-aliasing-Verfahren für Trickfilm
DE69631812D1 (de) System und Verfahren für ein hochadressierbares Drucksystem
DE69602398D1 (de) Verfahren zum Flüssigkeitstransport
DE69630559D1 (de) Verfahren zum Beschichten von Flachglas
DE69415731D1 (de) Verfahren zur Prädiktion eines Bildes

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee