DE69629675D1 - Triangulationsverfahren und -system für eine 3d-abbildung mittels eines abgewinkelten abtast-energiestrahles - Google Patents
Triangulationsverfahren und -system für eine 3d-abbildung mittels eines abgewinkelten abtast-energiestrahlesInfo
- Publication number
- DE69629675D1 DE69629675D1 DE69629675T DE69629675T DE69629675D1 DE 69629675 D1 DE69629675 D1 DE 69629675D1 DE 69629675 T DE69629675 T DE 69629675T DE 69629675 T DE69629675 T DE 69629675T DE 69629675 D1 DE69629675 D1 DE 69629675D1
- Authority
- DE
- Germany
- Prior art keywords
- image
- energy ray
- triangulation method
- scan energy
- angled scan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/46—Indirect determination of position data
- G01S17/48—Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/497—Means for monitoring or calibrating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/429,543 US5617209A (en) | 1995-04-27 | 1995-04-27 | Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy |
PCT/US1996/005285 WO1996034253A1 (en) | 1995-04-27 | 1996-04-17 | Method and system for triangulation-based, 3-d imaging utilizing an angled scanning beam of radiant energy |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69629675D1 true DE69629675D1 (de) | 2003-10-02 |
Family
ID=23703711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69629675T Expired - Lifetime DE69629675D1 (de) | 1995-04-27 | 1996-04-17 | Triangulationsverfahren und -system für eine 3d-abbildung mittels eines abgewinkelten abtast-energiestrahles |
Country Status (6)
Country | Link |
---|---|
US (2) | US5617209A (de) |
EP (1) | EP0823037B1 (de) |
JP (1) | JP3020280B2 (de) |
KR (1) | KR100334862B1 (de) |
DE (1) | DE69629675D1 (de) |
WO (1) | WO1996034253A1 (de) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020014533A1 (en) * | 1995-12-18 | 2002-02-07 | Xiaxun Zhu | Automated object dimensioning system employing contour tracing, vertice detection, and forner point detection and reduction methods on 2-d range data maps |
JP3410280B2 (ja) * | 1996-02-16 | 2003-05-26 | 三井金属鉱業株式会社 | パターン検査装置 |
EP1985995A3 (de) * | 1996-08-16 | 2009-09-16 | GE Healthcare Niagara Inc. | Digitales Abbildungssystem für Assays in Bohrplatten, Gelen und Flecken |
US5912768A (en) * | 1996-12-31 | 1999-06-15 | Cognex Corporation | Depth-from-defocus optical apparatus with invariance to surface reflectance properties |
US6025905A (en) * | 1996-12-31 | 2000-02-15 | Cognex Corporation | System for obtaining a uniform illumination reflectance image during periodic structured illumination |
US6055054A (en) * | 1997-05-05 | 2000-04-25 | Beaty; Elwin M. | Three dimensional inspection system |
US5878152A (en) * | 1997-05-21 | 1999-03-02 | Cognex Corporation | Depth from focal gradient analysis using object texture removal by albedo normalization |
US6219461B1 (en) | 1997-07-29 | 2001-04-17 | Cognex Corporation | Determining a depth |
US6148120A (en) * | 1997-10-30 | 2000-11-14 | Cognex Corporation | Warping of focal images to correct correspondence error |
US6140827A (en) | 1997-12-18 | 2000-10-31 | Micron Technology, Inc. | Method and apparatus for testing bumped die |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6915007B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6098031A (en) * | 1998-03-05 | 2000-08-01 | Gsi Lumonics, Inc. | Versatile method and system for high speed, 3D imaging of microscopic targets |
US6366357B1 (en) * | 1998-03-05 | 2002-04-02 | General Scanning, Inc. | Method and system for high speed measuring of microscopic targets |
US5917655A (en) * | 1998-04-06 | 1999-06-29 | Motorola, Inc. | Method and apparatus for generating a stereoscopic image |
US6160906A (en) * | 1998-06-01 | 2000-12-12 | Motorola, Inc. | Method and apparatus for visually inspecting an object |
US5982493A (en) * | 1998-06-02 | 1999-11-09 | Motorola, Inc. | Apparatus and method for acquiring multiple images |
US6181472B1 (en) | 1998-06-10 | 2001-01-30 | Robotic Vision Systems, Inc. | Method and system for imaging an object with a plurality of optical beams |
TW412817B (en) | 1998-06-19 | 2000-11-21 | Matsushita Electric Ind Co Ltd | A bump bonding apparatus and method |
US6518997B1 (en) * | 1998-08-05 | 2003-02-11 | National Semiconductor Corporation | Grid array inspection system and method |
CA2267519A1 (en) | 1999-04-13 | 2000-10-13 | Inspeck Inc. | Optical full human body 3d digitizer |
US6198529B1 (en) | 1999-04-30 | 2001-03-06 | International Business Machines Corporation | Automated inspection system for metallic surfaces |
US7139421B1 (en) * | 1999-06-29 | 2006-11-21 | Cognex Corporation | Methods and apparatuses for detecting similar features within an image |
US7034272B1 (en) | 1999-10-05 | 2006-04-25 | Electro Scientific Industries, Inc. | Method and apparatus for evaluating integrated circuit packages having three dimensional features |
US6525331B1 (en) | 1999-12-01 | 2003-02-25 | Nanyang Technological University | Ball grid array (BGA) package on-line non-contact inspection method and system |
DE10194788T1 (de) | 2000-01-07 | 2003-02-27 | Cyberoptics Corp | Phasenprofilometriesystem mit telezentrischem Projektor |
US6593705B1 (en) | 2000-01-07 | 2003-07-15 | Cyberoptics Corporation | Rapid-firing flashlamp discharge circuit |
US6549647B1 (en) | 2000-01-07 | 2003-04-15 | Cyberoptics Corporation | Inspection system with vibration resistant video capture |
US6724489B2 (en) * | 2000-09-22 | 2004-04-20 | Daniel Freifeld | Three dimensional scanning camera |
US6870611B2 (en) * | 2001-07-26 | 2005-03-22 | Orbotech Ltd. | Electrical circuit conductor inspection |
US6452285B1 (en) * | 2000-10-17 | 2002-09-17 | Advanced Micro Devices, Inc. | Fabrication of standard defects in contacts |
JP4502496B2 (ja) * | 2000-11-16 | 2010-07-14 | 富士通株式会社 | Bga実装時におけるはんだ形状評価方法及びbga実装時におけるはんだ形状評価装置及びbga実装時におけるはんだ形状評価プログラムを収納したコンピュータ読み取り可能な記録媒体 |
EP1220596A1 (de) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente |
US6951995B2 (en) * | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
ATE490703T1 (de) * | 2002-04-04 | 2010-12-15 | Amfit Inc | Kompakter optischer konturdigitalisierer |
JP4493421B2 (ja) * | 2004-06-30 | 2010-06-30 | 株式会社リコー | プリント回路基板検査装置とプリント回路基板組み立て検査ラインシステムおよびプログラム |
US7593565B2 (en) * | 2004-12-08 | 2009-09-22 | Rudolph Technologies, Inc. | All surface data for use in substrate inspection |
CN101600978B (zh) * | 2005-08-26 | 2012-09-05 | 卡姆特有限公司 | 用于控制光束的角覆盖范围的设备和方法 |
US9052294B2 (en) * | 2006-05-31 | 2015-06-09 | The Boeing Company | Method and system for two-dimensional and three-dimensional inspection of a workpiece |
US8124429B2 (en) * | 2006-12-15 | 2012-02-28 | Richard Norman | Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
US20080199068A1 (en) * | 2007-01-10 | 2008-08-21 | Duquette David W | Inspection System |
EP2106529B1 (de) * | 2007-01-25 | 2013-07-31 | Trimble AB | Prädiktionsalgorithmus zum scannen eines objektes |
US7535560B2 (en) * | 2007-02-26 | 2009-05-19 | Aceris 3D Inspection Inc. | Method and system for the inspection of integrated circuit devices having leads |
CA2597891A1 (en) * | 2007-08-20 | 2009-02-20 | Marc Miousset | Multi-beam optical probe and system for dimensional measurement |
WO2009061458A1 (en) * | 2007-11-07 | 2009-05-14 | Amfit, Inc. | Impression foam digital scanner |
US8059280B2 (en) | 2008-01-31 | 2011-11-15 | Cyberoptics Corporation | Method for three-dimensional imaging using multi-phase structured light |
KR20120113245A (ko) * | 2009-12-30 | 2012-10-12 | 지에스아이 그룹 코포레이션 | 고속 빔 편향을 이용한 링크 처리 |
US8389255B2 (en) * | 2010-03-26 | 2013-03-05 | E.I. De Pont De Nemours And Company | Perhydrolase providing improved specific activity |
SG180036A1 (en) * | 2010-10-19 | 2012-05-30 | Azimuth Intellectual Products Pte Ltd | Apparatus and methods for acquiring an image of a goods package |
US8416403B2 (en) | 2010-10-29 | 2013-04-09 | GII Acquisitiom, LLC | Method and system for high-speed, high-resolution 3-D imaging of manufactured parts of various sizes |
GB201019537D0 (en) * | 2010-11-18 | 2010-12-29 | 20X20 Vision Ltd | PCB reflow inspection angled measurement |
CN103443802B (zh) | 2011-01-24 | 2016-12-14 | 数据逻辑Adc公司 | 用于读取光学代码的系统和方法 |
US9225793B2 (en) | 2011-01-28 | 2015-12-29 | Cisco Technology, Inc. | Aggregating sensor data |
US9171079B2 (en) | 2011-01-28 | 2015-10-27 | Cisco Technology, Inc. | Searching sensor data |
US9275093B2 (en) * | 2011-01-28 | 2016-03-01 | Cisco Technology, Inc. | Indexing sensor data |
US9697596B2 (en) | 2011-05-17 | 2017-07-04 | Gii Acquisition, Llc | Method and system for optically inspecting parts |
US9575013B2 (en) | 2011-05-17 | 2017-02-21 | Gii Acquisition, Llc | Non-contact method and system for inspecting a manufactured part at an inspection station having a measurement axis |
US10094785B2 (en) | 2011-05-17 | 2018-10-09 | Gii Acquisition, Llc | Method and system for optically inspecting headed manufactured parts |
US9370799B2 (en) | 2011-05-17 | 2016-06-21 | Gii Acquisition, Llc | Method and system for optically inspecting a manufactured part at a single inspection station having a measurement axis |
US9228957B2 (en) | 2013-05-24 | 2016-01-05 | Gii Acquisition, Llc | High speed method and system for inspecting a stream of parts |
US10088431B2 (en) | 2011-05-17 | 2018-10-02 | Gii Acquisition, Llc | Method and system for optically inspecting headed manufactured parts |
KR101614061B1 (ko) * | 2012-03-29 | 2016-04-20 | 주식회사 고영테크놀러지 | 조인트 검사 장치 |
US9486840B2 (en) | 2013-05-24 | 2016-11-08 | Gii Acquisition, Llc | High-speed, triangulation-based, 3-D method and system for inspecting manufactured parts and sorting the inspected parts |
US8993914B2 (en) | 2012-12-14 | 2015-03-31 | Gii Acquisition, Llc | High-speed, high-resolution, triangulation-based, 3-D method and system for inspecting manufactured parts and sorting the inspected parts |
US10126252B2 (en) | 2013-04-29 | 2018-11-13 | Cyberoptics Corporation | Enhanced illumination control for three-dimensional imaging |
US10207297B2 (en) | 2013-05-24 | 2019-02-19 | GII Inspection, LLC | Method and system for inspecting a manufactured part at an inspection station |
US9539619B2 (en) | 2013-05-24 | 2017-01-10 | Gii Acquisition, Llc | High speed method and system for inspecting a stream of parts at a pair of inspection stations |
US20150300962A1 (en) * | 2014-04-16 | 2015-10-22 | Texas Instruments Incorporated | Assembly For Inspecting Machine Parts Used In The Production Of Semiconductor Components |
US10300510B2 (en) | 2014-08-01 | 2019-05-28 | General Inspection Llc | High speed method and system for inspecting a stream of parts |
JP6507653B2 (ja) * | 2015-01-13 | 2019-05-08 | オムロン株式会社 | 検査装置及び検査装置の制御方法 |
CN104990926B (zh) * | 2015-06-25 | 2017-09-29 | 哈尔滨工业大学 | 一种基于视觉的tr元件定位和缺陷检测方法 |
CN105445752A (zh) * | 2015-12-16 | 2016-03-30 | 上海倍肯机电科技有限公司 | 基于激光三维成像的输电线路保护装置及方法 |
US10333632B2 (en) * | 2017-04-03 | 2019-06-25 | Ets-Lindgren, Inc. | Method and system for testing beam forming capabilities of wireless devices |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4700045A (en) * | 1985-04-30 | 1987-10-13 | Chesapeake Laser Systems, Inc. | Seam tracking system with acousto-optical scanner |
JPS6260075A (ja) * | 1985-09-10 | 1987-03-16 | Hitachi Ltd | 形状認識装置 |
SE457294B (sv) * | 1986-03-19 | 1988-12-12 | Svecia Silkscreen Maskiner Ab | Anordning foer faststaellande av ett applicerat trycks tjocklek |
US4728195A (en) * | 1986-03-19 | 1988-03-01 | Cognex Corporation | Method for imaging printed circuit board component leads |
US4811410A (en) * | 1986-12-08 | 1989-03-07 | American Telephone And Telegraph Company | Linescan inspection system for circuit boards |
DE69014505T2 (de) * | 1989-09-12 | 1995-05-04 | Matsushita Electric Ind Co Ltd | System zur optischen Inspektion von Bedingungen von Teilen, die auf einem Substrat angebracht sind. |
US5058178A (en) * | 1989-12-21 | 1991-10-15 | At&T Bell Laboratories | Method and apparatus for inspection of specular, three-dimensional features |
IT1238711B (it) * | 1990-04-13 | 1993-09-01 | Galileo Spa Off | Metodo ed impianto interferometrico a frange codificate per rivelazione del fronte d'onda in ottica. |
US5118192A (en) * | 1990-07-11 | 1992-06-02 | Robotic Vision Systems, Inc. | System for 3-D inspection of objects |
EP0471196A3 (en) * | 1990-08-13 | 1994-09-07 | Siemens Ag | Image analysis method |
US5371375A (en) * | 1992-06-24 | 1994-12-06 | Robotic Vision Systems, Inc. | Method for obtaining three-dimensional data from multiple parts or devices in a multi-pocketed tray |
US5546189A (en) * | 1994-05-19 | 1996-08-13 | View Engineering, Inc. | Triangulation-based 3D imaging and processing method and system |
-
1995
- 1995-04-27 US US08/429,543 patent/US5617209A/en not_active Expired - Lifetime
-
1996
- 1996-04-17 DE DE69629675T patent/DE69629675D1/de not_active Expired - Lifetime
- 1996-04-17 EP EP96912827A patent/EP0823037B1/de not_active Expired - Lifetime
- 1996-04-17 WO PCT/US1996/005285 patent/WO1996034253A1/en active IP Right Grant
- 1996-04-17 KR KR1019970707609A patent/KR100334862B1/ko not_active IP Right Cessation
- 1996-04-17 JP JP8532590A patent/JP3020280B2/ja not_active Expired - Fee Related
-
1997
- 1997-03-27 US US08/825,108 patent/US5815275A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR19990008085A (ko) | 1999-01-25 |
EP0823037B1 (de) | 2003-08-27 |
US5617209A (en) | 1997-04-01 |
US5815275A (en) | 1998-09-29 |
WO1996034253A1 (en) | 1996-10-31 |
EP0823037A4 (de) | 1998-08-19 |
JPH10510366A (ja) | 1998-10-06 |
EP0823037A1 (de) | 1998-02-11 |
JP3020280B2 (ja) | 2000-03-15 |
KR100334862B1 (ko) | 2002-10-19 |
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Legal Events
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