DE69624889T2 - Apparat zum Scheibenätzen - Google Patents

Apparat zum Scheibenätzen

Info

Publication number
DE69624889T2
DE69624889T2 DE69624889T DE69624889T DE69624889T2 DE 69624889 T2 DE69624889 T2 DE 69624889T2 DE 69624889 T DE69624889 T DE 69624889T DE 69624889 T DE69624889 T DE 69624889T DE 69624889 T2 DE69624889 T2 DE 69624889T2
Authority
DE
Germany
Prior art keywords
etching apparatus
disk etching
disk
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69624889T
Other languages
English (en)
Other versions
DE69624889D1 (de
Inventor
Tatsuo Abe
Makoto Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69624889D1 publication Critical patent/DE69624889D1/de
Application granted granted Critical
Publication of DE69624889T2 publication Critical patent/DE69624889T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69624889T 1995-08-30 1996-08-30 Apparat zum Scheibenätzen Expired - Fee Related DE69624889T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24540295A JP3183123B2 (ja) 1995-08-30 1995-08-30 エッチング装置

Publications (2)

Publication Number Publication Date
DE69624889D1 DE69624889D1 (de) 2003-01-02
DE69624889T2 true DE69624889T2 (de) 2003-08-28

Family

ID=17133124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624889T Expired - Fee Related DE69624889T2 (de) 1995-08-30 1996-08-30 Apparat zum Scheibenätzen

Country Status (4)

Country Link
US (1) US5914281A (de)
EP (1) EP0762482B1 (de)
JP (1) JP3183123B2 (de)
DE (1) DE69624889T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132523A (en) * 1997-09-19 2000-10-17 Sharp Kabushiki Kaisha Method of cleaning a substrate in a cleaning tank using plural fluid flows
JP3070676B2 (ja) * 1997-12-26 2000-07-31 直江津電子工業株式会社 シリコン半導体ウエハのウエットエッチング方法
KR100792774B1 (ko) * 2000-06-29 2008-01-11 신에쯔 한도타이 가부시키가이샤 반도체 웨이퍼의 가공방법 및 반도체 웨이퍼
KR100595302B1 (ko) * 2000-12-30 2006-07-03 엘지.필립스 엘시디 주식회사 액정표시소자 제조를 위한 유리기판 식각장치
US20040094268A1 (en) * 2002-11-20 2004-05-20 Brask Justin K. Oxidation inhibitor for wet etching processes
JP2006332215A (ja) * 2005-05-25 2006-12-07 Hitachi High-Tech Science Systems Corp 微細構造処理方法及びその装置
US9562291B2 (en) 2014-01-14 2017-02-07 Mei, Llc Metal etch system
WO2020171124A1 (ja) * 2019-02-20 2020-08-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677848A (en) * 1970-07-15 1972-07-18 Rca Corp Method and material for etching semiconductor bodies
US3640792A (en) * 1970-08-07 1972-02-08 Rca Corp Apparatus for chemically etching surfaces
US3799179A (en) * 1972-03-20 1974-03-26 G Thomas Processing apparatus with precisely controlled agitation
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
US4251317A (en) * 1979-04-30 1981-02-17 Fairchild Camera And Instrument Corporation Method of preventing etch masking during wafer etching
US4817652A (en) * 1987-03-26 1989-04-04 Regents Of The University Of Minnesota System for surface and fluid cleaning
GB2207890B (en) * 1987-08-14 1991-05-01 Stc Plc Etching apparatus
JPH01184926A (ja) * 1988-01-20 1989-07-24 Matsushita Electric Ind Co Ltd 洗浄装置および洗浄方法
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
CA2036533C (en) * 1990-02-19 1995-07-04 Yoshio Ichikawa Transmission and reception of pager signals without useless sampling operation
US5340437A (en) * 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers

Also Published As

Publication number Publication date
DE69624889D1 (de) 2003-01-02
US5914281A (en) 1999-06-22
JPH0969510A (ja) 1997-03-11
EP0762482B1 (de) 2002-11-20
EP0762482A1 (de) 1997-03-12
JP3183123B2 (ja) 2001-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee