DE69624107D1 - Flash-EEPROM-Zelle mit einziger Polysiliziumschicht und Verfahren zur Herstellung - Google Patents

Flash-EEPROM-Zelle mit einziger Polysiliziumschicht und Verfahren zur Herstellung

Info

Publication number
DE69624107D1
DE69624107D1 DE69624107T DE69624107T DE69624107D1 DE 69624107 D1 DE69624107 D1 DE 69624107D1 DE 69624107 T DE69624107 T DE 69624107T DE 69624107 T DE69624107 T DE 69624107T DE 69624107 D1 DE69624107 D1 DE 69624107D1
Authority
DE
Germany
Prior art keywords
manufacturing
polysilicon layer
flash eeprom
eeprom cell
single polysilicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69624107T
Other languages
English (en)
Other versions
DE69624107T2 (de
Inventor
Alfonso Maurelli
Carlo Riva
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Publication of DE69624107D1 publication Critical patent/DE69624107D1/de
Application granted granted Critical
Publication of DE69624107T2 publication Critical patent/DE69624107T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885—Hot carrier injection from the channel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
DE69624107T 1996-07-18 1996-07-18 Flash-EEPROM-Zelle mit einziger Polysiliziumschicht und Verfahren zur Herstellung Expired - Fee Related DE69624107T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP96830398A EP0820103B1 (de) 1996-07-18 1996-07-18 Flash-EEPROM-Zelle mit einziger Polysiliziumschicht und Verfahren zur Herstellung

Publications (2)

Publication Number Publication Date
DE69624107D1 true DE69624107D1 (de) 2002-11-07
DE69624107T2 DE69624107T2 (de) 2003-06-05

Family

ID=8225963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624107T Expired - Fee Related DE69624107T2 (de) 1996-07-18 1996-07-18 Flash-EEPROM-Zelle mit einziger Polysiliziumschicht und Verfahren zur Herstellung

Country Status (4)

Country Link
US (2) US5936276A (de)
EP (1) EP0820103B1 (de)
JP (1) JPH1070204A (de)
DE (1) DE69624107T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002541669A (ja) * 1999-03-31 2002-12-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 不揮発性メモリセルを有する半導体デバイス
EP1091408A1 (de) 1999-10-07 2001-04-11 STMicroelectronics S.r.l. Festwertspeicherzelle mit einer Polysiliziumebene
EP1096575A1 (de) 1999-10-07 2001-05-02 STMicroelectronics S.r.l. Nichtflüchtige Speicherzelle mit einer Polysiliziumsschicht und Verfahren zur Herstellung
EP1376698A1 (de) * 2002-06-25 2004-01-02 STMicroelectronics S.r.l. Elektrisch lösch- und programmierbare nicht flüchtige Speicherzelle
US20040051162A1 (en) * 2002-09-13 2004-03-18 International Business Machines Corporation Structure and method of providing reduced programming voltage antifuse
JP2004200553A (ja) * 2002-12-20 2004-07-15 Fujitsu Ltd 半導体装置及びその製造方法
US7405442B2 (en) * 2004-11-02 2008-07-29 United Microelectronics Corp. Electrically erasable programmable read-only memory cell and memory device
US7405123B2 (en) * 2004-09-16 2008-07-29 United Microelectronics Corp. Electrically erasable programmable read-only memory cell and memory device and manufacturing method thereof
US8558278B2 (en) 2007-01-16 2013-10-15 Taiwan Semiconductor Manufacturing Company, Ltd. Strained transistor with optimized drive current and method of forming
US7943961B2 (en) 2008-03-13 2011-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Strain bars in stressed layers of MOS devices
US7808051B2 (en) * 2008-09-29 2010-10-05 Taiwan Semiconductor Manufacturing Company, Ltd. Standard cell without OD space effect in Y-direction
US8901615B2 (en) 2012-06-13 2014-12-02 Synopsys, Inc. N-channel and P-channel end-to-end finfet cell architecture
ITTO20120682A1 (it) 2012-07-31 2014-02-01 St Microelectronics Pvt Ltd Dispositivo di memoria non volatile con celle raggruppate
US11600628B2 (en) * 2020-01-15 2023-03-07 Globalfoundries U.S. Inc. Floating gate memory cell and memory array structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7500550A (nl) * 1975-01-17 1976-07-20 Philips Nv Halfgeleider-geheugeninrichting.
JPS59155968A (ja) * 1983-02-25 1984-09-05 Toshiba Corp 半導体記憶装置
JPS6068658A (ja) * 1983-09-26 1985-04-19 Fujitsu Ltd 半導体装置の製造方法
IT1232354B (it) * 1989-09-04 1992-01-28 Sgs Thomson Microelectronics Procedimento per la realizzazione di celle di memoria eeprom a singolo livello di polisilicio e ossido sottile utilizzando ossidazione differenziale.
DE69032937T2 (de) * 1990-07-24 1999-06-17 St Microelectronics Srl Verfahren zur Herstellung einer N-Kanal-EPROM-Zelle mit einer einzigen Polysiliziumschicht
DE69630107D1 (de) * 1996-04-15 2003-10-30 St Microelectronics Srl Mit einem EEPROM integrierter FLASH-EPROM
US5753954A (en) * 1996-07-19 1998-05-19 National Semiconductor Corporation Single-poly neuron MOS transistor
US5786614A (en) * 1997-04-08 1998-07-28 Taiwan Semiconductor Manufacturing Co., Ltd. Separated floating gate for EEPROM application

Also Published As

Publication number Publication date
EP0820103B1 (de) 2002-10-02
EP0820103A1 (de) 1998-01-21
US6355523B1 (en) 2002-03-12
US5936276A (en) 1999-08-10
JPH1070204A (ja) 1998-03-10
DE69624107T2 (de) 2003-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee