DE69623930T2 - Gläser mit niedrigem dielektrischem verlust - Google Patents
Gläser mit niedrigem dielektrischem verlustInfo
- Publication number
- DE69623930T2 DE69623930T2 DE69623930T DE69623930T DE69623930T2 DE 69623930 T2 DE69623930 T2 DE 69623930T2 DE 69623930 T DE69623930 T DE 69623930T DE 69623930 T DE69623930 T DE 69623930T DE 69623930 T2 DE69623930 T2 DE 69623930T2
- Authority
- DE
- Germany
- Prior art keywords
- low dielectric
- dielectric loss
- loss glasses
- glasses
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
- C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
- Y10T428/12604—Film [e.g., glaze, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37926695A | 1995-01-27 | 1995-01-27 | |
PCT/US1996/000314 WO1996022949A1 (en) | 1995-01-27 | 1996-01-29 | Low dielectric loss glasses |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69623930D1 DE69623930D1 (de) | 2002-10-31 |
DE69623930T2 true DE69623930T2 (de) | 2003-05-15 |
Family
ID=23496533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69623930T Expired - Fee Related DE69623930T2 (de) | 1995-01-27 | 1996-01-29 | Gläser mit niedrigem dielektrischem verlust |
Country Status (7)
Country | Link |
---|---|
US (2) | US6017642A (de) |
EP (1) | EP0805785B1 (de) |
JP (1) | JP3327556B2 (de) |
KR (1) | KR100320630B1 (de) |
CA (1) | CA2211875C (de) |
DE (1) | DE69623930T2 (de) |
WO (1) | WO1996022949A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW353762B (en) * | 1996-10-21 | 1999-03-01 | Dainippon Printing Co Ltd | Transfer sheet, and pattern-forming method |
NO310348B1 (no) * | 1997-04-14 | 2001-06-25 | Norsk Hydro As | Glasskeramisk materiale og dets anvendelse som middel for sammenfoyning av forskjellige typer materiale og som understottelse |
US6168490B1 (en) * | 1997-12-19 | 2001-01-02 | Sarnoff Corporation | Back panel for a plasma display device |
US6191934B1 (en) * | 1998-10-02 | 2001-02-20 | Sarnoff Corporation & Co., Ltd. | High dielectric constant embedded capacitors |
US6233817B1 (en) * | 1999-01-17 | 2001-05-22 | Delphi Technologies, Inc. | Method of forming thick-film hybrid circuit on a metal circuit board |
JP4284763B2 (ja) * | 1999-07-14 | 2009-06-24 | コニカミノルタオプト株式会社 | ガラス組成 |
JP2001026456A (ja) * | 1999-07-14 | 2001-01-30 | Minolta Co Ltd | ガラス組成 |
JP4265035B2 (ja) * | 1999-07-14 | 2009-05-20 | コニカミノルタオプト株式会社 | 結晶化ガラス組成物 |
JP2001026445A (ja) * | 1999-07-14 | 2001-01-30 | Minolta Co Ltd | ガラス組成 |
JP2001026454A (ja) * | 1999-07-14 | 2001-01-30 | Minolta Co Ltd | ガラス組成 |
JP2001026446A (ja) * | 1999-07-14 | 2001-01-30 | Minolta Co Ltd | ガラス組成 |
JP2001026440A (ja) * | 1999-07-14 | 2001-01-30 | Minolta Co Ltd | ガラス組成 |
JP3630021B2 (ja) * | 1999-07-23 | 2005-03-16 | 株式会社村田製作所 | 結晶化ガラス組成物及びその焼結体、並びに、それを用いた回路基板 |
US6346744B1 (en) * | 1999-09-14 | 2002-02-12 | Sarnoff Corporation | Integrated RF M×N switch matrix |
US6660669B2 (en) | 1999-10-18 | 2003-12-09 | Corning Incorporated | Forsterite glass-ceramics of high crystallinity and chrome content |
WO2001028945A1 (en) * | 1999-10-18 | 2001-04-26 | Corning Incorporated | Transparent forsterite glass-ceramics |
US6300262B1 (en) | 1999-10-18 | 2001-10-09 | Corning Incorporated | Transparent forsterite glass-ceramics |
US6813903B2 (en) * | 1999-10-18 | 2004-11-09 | Corning Incorporated | Method of making forsterite glass-ceramics |
US6455930B1 (en) | 1999-12-13 | 2002-09-24 | Lamina Ceramics, Inc. | Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology |
US7183640B2 (en) | 1999-12-13 | 2007-02-27 | Lamina Ceramics, Inc. | Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
US6551720B2 (en) | 2000-05-02 | 2003-04-22 | Sarnoff Corporation | Materials to fabricate a high resolution plasma display back panel |
JP3591437B2 (ja) * | 2000-09-07 | 2004-11-17 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法ならびに電子装置 |
US7226653B2 (en) * | 2000-10-13 | 2007-06-05 | Ppc Electronic Ag | Printed circuit board and method for producing a printed circuit board |
US6553662B2 (en) | 2001-07-03 | 2003-04-29 | Max Levy Autograph, Inc. | Method of making a high-density electronic circuit |
JP2005535108A (ja) * | 2002-05-23 | 2005-11-17 | ショット アーゲー | 高周波用途に適した導体構成を有する構成要素を製造する方法 |
US6835682B2 (en) * | 2002-06-04 | 2004-12-28 | E. I. Du Pont De Nemours And Company | High thermal expansion glass and tape composition |
US6776861B2 (en) * | 2002-06-04 | 2004-08-17 | E. I. Du Pont De Nemours And Company | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic |
JP2005171075A (ja) * | 2003-12-11 | 2005-06-30 | Hitachi Chem Co Ltd | プリント配線板樹脂組成物、およびこれを用いた樹脂ワニス、プリプレグおよび積層板 |
US7387838B2 (en) * | 2004-05-27 | 2008-06-17 | Delaware Capital Formation, Inc. | Low loss glass-ceramic materials, method of making same and electronic packages including same |
US7186461B2 (en) * | 2004-05-27 | 2007-03-06 | Delaware Capital Formation, Inc. | Glass-ceramic materials and electronic packages including same |
US20080146108A1 (en) * | 2006-12-18 | 2008-06-19 | James Neal Singletary | Coated fabrics and laminates suitable for rigid armor applications and processes for making same |
WO2008133213A1 (ja) * | 2007-04-25 | 2008-11-06 | Asahi Glass Company, Limited | 積層誘電体製造方法 |
WO2011122406A1 (ja) | 2010-03-30 | 2011-10-06 | 株式会社村田製作所 | 金属ベース基板およびその製造方法 |
WO2017132310A1 (en) | 2016-01-28 | 2017-08-03 | Rogers Corporation | Thermosetting polymer formulations, circuit materials, and methods of use thereof |
KR20210035828A (ko) | 2018-07-23 | 2021-04-01 | 코닝 인코포레이티드 | 마그네슘 알루미노실리케이트 유리 세라믹 |
CN116854454B (zh) * | 2023-07-11 | 2024-01-26 | 上海大学 | 一种微波介质陶瓷组合物、微波介质陶瓷材料及其应用 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4256796A (en) * | 1979-11-05 | 1981-03-17 | Rca Corporation | Partially devitrified porcelain composition and articles prepared with same |
JPS60235744A (ja) * | 1984-05-04 | 1985-11-22 | Asahi Glass Co Ltd | セラミック基板用組成物 |
JPS62113758A (ja) * | 1985-10-25 | 1987-05-25 | 株式会社住友金属セラミックス | 低温焼成セラミツクス |
US4764486A (en) * | 1986-01-23 | 1988-08-16 | Matsushita Electric Works, Ltd. | Sintered glass-powder product |
JPS62278145A (ja) * | 1986-05-26 | 1987-12-03 | Matsushita Electric Works Ltd | ガラスセラミツク焼結体 |
CA1300648C (en) * | 1987-04-27 | 1992-05-12 | Francis Willis Martin | Glass-ceramics for electronic packaging |
US4997698A (en) * | 1987-05-04 | 1991-03-05 | Allied-Signal, Inc. | Ceramic coated metal substrates for electronic applications |
US4965229A (en) * | 1988-02-05 | 1990-10-23 | Matsushita Electric Industrial Co., Ltd. | Glass ceramic for coating metal substrate |
GB8816510D0 (en) * | 1988-07-12 | 1988-08-17 | Emi Plc Thorn | Improvements in/relating to discharge lamp arc tubes |
US5079194A (en) * | 1990-10-11 | 1992-01-07 | Aluminum Company Of America | Crystal growth inhibitor for glassy low dielectric inorganic composition |
US5250474A (en) * | 1991-02-07 | 1993-10-05 | Schott Glaswerke | Glass powder which is crystallizable to yield a sintered glass ceramic containing hexagonal cordierite as the principal crystalline phase |
US5216207A (en) * | 1991-02-27 | 1993-06-01 | David Sarnoff Research Center, Inc. | Low temperature co-fired multilayer ceramic circuit boards with silver conductors |
JP2642253B2 (ja) * | 1991-02-27 | 1997-08-20 | 日本特殊陶業株式会社 | ガラス−セラミックス複合体 |
US5277724A (en) * | 1991-12-18 | 1994-01-11 | General Electric Co. | Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board |
US5256469A (en) * | 1991-12-18 | 1993-10-26 | General Electric Company | Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging |
-
1996
- 1996-01-29 JP JP52287996A patent/JP3327556B2/ja not_active Expired - Fee Related
- 1996-01-29 EP EP96904444A patent/EP0805785B1/de not_active Expired - Lifetime
- 1996-01-29 CA CA002211875A patent/CA2211875C/en not_active Expired - Fee Related
- 1996-01-29 KR KR1019970705051A patent/KR100320630B1/ko not_active IP Right Cessation
- 1996-01-29 DE DE69623930T patent/DE69623930T2/de not_active Expired - Fee Related
- 1996-01-29 WO PCT/US1996/000314 patent/WO1996022949A1/en active IP Right Grant
-
1997
- 1997-06-18 US US08/878,176 patent/US6017642A/en not_active Expired - Lifetime
- 1997-07-01 US US08/874,926 patent/US5958807A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5958807A (en) | 1999-09-28 |
KR19980701655A (ko) | 1998-06-25 |
DE69623930D1 (de) | 2002-10-31 |
CA2211875A1 (en) | 1996-08-01 |
EP0805785A1 (de) | 1997-11-12 |
WO1996022949A1 (en) | 1996-08-01 |
CA2211875C (en) | 2007-10-02 |
JPH11511719A (ja) | 1999-10-12 |
EP0805785B1 (de) | 2002-09-25 |
US6017642A (en) | 2000-01-25 |
JP3327556B2 (ja) | 2002-09-24 |
KR100320630B1 (ko) | 2002-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: LAMINA CERAMICS, INC., WESTAMPTON, N.J., US |
|
8339 | Ceased/non-payment of the annual fee |