DE69622122T2 - Verfahren zur Projektionsbelichtung eines mit rückseitigen Ausrichtmarken versehenen Werkstücks und Vorrichtung zur Durchführung des Verfahrens - Google Patents

Verfahren zur Projektionsbelichtung eines mit rückseitigen Ausrichtmarken versehenen Werkstücks und Vorrichtung zur Durchführung des Verfahrens

Info

Publication number
DE69622122T2
DE69622122T2 DE69622122T DE69622122T DE69622122T2 DE 69622122 T2 DE69622122 T2 DE 69622122T2 DE 69622122 T DE69622122 T DE 69622122T DE 69622122 T DE69622122 T DE 69622122T DE 69622122 T2 DE69622122 T2 DE 69622122T2
Authority
DE
Germany
Prior art keywords
carrying
alignment marks
projection exposure
rear alignment
workpiece provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69622122T
Other languages
English (en)
Other versions
DE69622122D1 (de
Inventor
Yoneta Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of DE69622122D1 publication Critical patent/DE69622122D1/de
Application granted granted Critical
Publication of DE69622122T2 publication Critical patent/DE69622122T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
DE69622122T 1995-10-20 1996-10-18 Verfahren zur Projektionsbelichtung eines mit rückseitigen Ausrichtmarken versehenen Werkstücks und Vorrichtung zur Durchführung des Verfahrens Expired - Lifetime DE69622122T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27237495A JP3201233B2 (ja) 1995-10-20 1995-10-20 裏面にアライメント・マークが設けられたワークの投影露光方法

Publications (2)

Publication Number Publication Date
DE69622122D1 DE69622122D1 (de) 2002-08-08
DE69622122T2 true DE69622122T2 (de) 2003-02-06

Family

ID=17513005

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622122T Expired - Lifetime DE69622122T2 (de) 1995-10-20 1996-10-18 Verfahren zur Projektionsbelichtung eines mit rückseitigen Ausrichtmarken versehenen Werkstücks und Vorrichtung zur Durchführung des Verfahrens

Country Status (6)

Country Link
US (1) US5874190A (de)
EP (1) EP0769726B1 (de)
JP (1) JP3201233B2 (de)
KR (1) KR100427097B1 (de)
DE (1) DE69622122T2 (de)
TW (1) TW392093B (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312635A (ja) * 1998-04-28 1999-11-09 Ushio Inc コンタクト露光方法
US6117599A (en) * 1999-05-07 2000-09-12 United Microelectronics Corp. Alignment and exposure process utilizing split beam for exposure and alignment
JP3802309B2 (ja) * 2000-03-28 2006-07-26 株式会社アドテックエンジニアリング 多層回路基板製造における位置合わせ装置及び露光装置
US6768539B2 (en) * 2001-01-15 2004-07-27 Asml Netherlands B.V. Lithographic apparatus
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
JP3961311B2 (ja) * 2001-01-19 2007-08-22 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイスの製造方法
US6525805B2 (en) * 2001-05-14 2003-02-25 Ultratech Stepper, Inc. Backside alignment system and method
US6856029B1 (en) * 2001-06-22 2005-02-15 Lsi Logic Corporation Process independent alignment marks
JP4862238B2 (ja) * 2001-09-06 2012-01-25 東レ株式会社 回路基板の製造方法
TW594431B (en) 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
EP1341046A3 (de) * 2002-03-01 2004-12-15 ASML Netherlands B.V. Kalibrationsverfahren, Kalibrationssubstrate, lithographischer Apparat und Verfahren zur Herstellung von Artikeln
EP1396761A3 (de) * 2002-08-29 2008-12-10 ASML Netherlands B.V. Ausrichtgerät, lithographisches Gerät, Ausrichtungsverfahren und Verfahren zur Herstellung einer Vorrichtung
JP2004354909A (ja) 2003-05-30 2004-12-16 Orc Mfg Co Ltd 投影露光装置および投影露光方法
WO2006024908A2 (en) 2004-08-10 2006-03-09 Asml Netherlands B.V. Imprint lithographic apparatus, device manufacturing method and device manufactured thereby
JP4641779B2 (ja) * 2004-10-20 2011-03-02 ウシオ電機株式会社 露光装置
KR100825785B1 (ko) * 2006-10-20 2008-04-29 삼성전자주식회사 칩 위치 식별장치 및 이를 이용한 칩 위치 식별 방법
US20080292177A1 (en) * 2007-05-23 2008-11-27 Sheets Ronald E System and Method for Providing Backside Alignment in a Lithographic Projection System
US7847938B2 (en) * 2007-10-01 2010-12-07 Maskless Lithography, Inc. Alignment system for optical lithography
US8482732B2 (en) * 2007-10-01 2013-07-09 Maskless Lithography, Inc. Alignment system for various materials and material flows
GB2458463B (en) * 2008-03-17 2013-02-20 Dek Int Gmbh Imaging system and method
JP2010245123A (ja) * 2009-04-01 2010-10-28 Mitsuboshi Diamond Industrial Co Ltd 透過照明付きテーブル
JP5257699B2 (ja) * 2009-07-14 2013-08-07 ウシオ電機株式会社 露光装置
WO2011099563A1 (ja) * 2010-02-12 2011-08-18 株式会社ニコン 基板処理装置
US8354678B1 (en) 2011-07-11 2013-01-15 International Business Machines Corporation Structure and method for forming a light detecting diode and a light emitting diode on a silicon-on-insulator wafer backside
JP5556774B2 (ja) * 2011-09-16 2014-07-23 ウシオ電機株式会社 露光装置
CN106547143B (zh) * 2017-01-24 2019-10-15 京东方科技集团股份有限公司 显示基板的制作方法、显示基板及显示装置
CN109884860B (zh) * 2019-03-22 2020-12-04 上海微电子装备（集团）股份有限公司 多工位柔性卷带曝光装置及曝光方法
CN116000391A (zh) * 2023-01-07 2023-04-25 中国航空制造技术研究院 一种电液束加工电极光影校准调节装置及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2013101A1 (de) * 1970-03-19 1971-10-07 IBM Deutschland Internationale Büro Maschinen GmbH, 7032 Sindelfingen Anordnung zur periodischen Scharf einstellung
JPS5636566B2 (de) * 1973-06-18 1981-08-25
JPS6083329A (ja) * 1983-10-13 1985-05-11 Fujitsu Ltd パタ−ン露光装置
US4798470A (en) * 1985-11-14 1989-01-17 Hitachi, Ltd. Pattern printing method and apparatus
JPH0650714B2 (ja) * 1986-07-17 1994-06-29 キヤノン株式会社 露光方法
JPH01164032A (ja) * 1987-12-21 1989-06-28 Olympus Optical Co Ltd 半導体露光装置のアライメント装置
JP2915051B2 (ja) * 1990-02-26 1999-07-05 株式会社日立製作所 パターン形成方法及びその装置
JP3111556B2 (ja) * 1991-11-18 2000-11-27 株式会社日立製作所 微細パターンの形成装置
US5204739A (en) * 1992-02-07 1993-04-20 Karl Suss America, Inc. Proximity mask alignment using a stored video image

Also Published As

Publication number Publication date
EP0769726A3 (de) 1997-11-26
KR100427097B1 (ko) 2005-05-31
DE69622122D1 (de) 2002-08-08
JPH09115812A (ja) 1997-05-02
US5874190A (en) 1999-02-23
JP3201233B2 (ja) 2001-08-20
TW392093B (en) 2000-06-01
KR970022577A (ko) 1997-05-30
EP0769726A2 (de) 1997-04-23
EP0769726B1 (de) 2002-07-03

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