DE69620026T2 - Oberflächenmontierte alphanumerische led anzeige - Google Patents

Oberflächenmontierte alphanumerische led anzeige

Info

Publication number
DE69620026T2
DE69620026T2 DE69620026T DE69620026T DE69620026T2 DE 69620026 T2 DE69620026 T2 DE 69620026T2 DE 69620026 T DE69620026 T DE 69620026T DE 69620026 T DE69620026 T DE 69620026T DE 69620026 T2 DE69620026 T2 DE 69620026T2
Authority
DE
Germany
Prior art keywords
led display
surface mounted
alphanumeric led
alphanumeric
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69620026T
Other languages
English (en)
Other versions
DE69620026D1 (de
Inventor
Marvin Lumbard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Application granted granted Critical
Publication of DE69620026D1 publication Critical patent/DE69620026D1/de
Publication of DE69620026T2 publication Critical patent/DE69620026T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
DE69620026T 1995-12-27 1996-12-17 Oberflächenmontierte alphanumerische led anzeige Expired - Fee Related DE69620026T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/579,538 US5991160A (en) 1995-12-27 1995-12-27 Surface mount LED alphanumeric display
PCT/US1996/019790 WO1997024770A1 (en) 1995-12-27 1996-12-17 Surface mount led alphanumeric display

Publications (2)

Publication Number Publication Date
DE69620026D1 DE69620026D1 (de) 2002-04-25
DE69620026T2 true DE69620026T2 (de) 2002-09-26

Family

ID=24317325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69620026T Expired - Fee Related DE69620026T2 (de) 1995-12-27 1996-12-17 Oberflächenmontierte alphanumerische led anzeige

Country Status (6)

Country Link
US (1) US5991160A (de)
EP (1) EP0870336B1 (de)
JP (1) JP3398712B2 (de)
KR (1) KR19990076803A (de)
DE (1) DE69620026T2 (de)
WO (1) WO1997024770A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
US5882459A (en) * 1996-11-08 1999-03-16 W. L. Gore & Associates, Inc. Method for aligning and laminating substrates to stiffeners in electrical circuits
EP1014455B1 (de) 1997-07-25 2006-07-12 Nichia Corporation Halbleitervorrichtung aus einer nitridverbindung
US6317331B1 (en) * 1998-08-19 2001-11-13 Kulicke & Soffa Holdings, Inc. Wiring substrate with thermal insert
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
WO2000052796A1 (fr) 1999-03-04 2000-09-08 Nichia Corporation Element de laser semiconducteur au nitrure
WO2003030132A1 (en) * 2001-09-29 2003-04-10 Agilent Technologies, Inc. A display and method of manufacture
TW200509329A (en) * 2003-08-26 2005-03-01 Yung-Shu Yang LED package material and process
WO2005043637A1 (ja) * 2003-10-31 2005-05-12 Toyoda Gosei Co., Ltd. 発光装置
CN100438093C (zh) * 2003-10-31 2008-11-26 丰田合成株式会社 发光器件
KR100593919B1 (ko) * 2004-07-01 2006-06-30 삼성전기주식회사 차량 전조등용 발광 다이오드 모듈 및 이를 구비한 차량전조등
DE102008021618A1 (de) * 2007-11-28 2009-06-04 Osram Opto Semiconductors Gmbh Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung
CN101472390B (zh) * 2007-12-28 2010-12-08 富葵精密组件(深圳)有限公司 补强板及包括该补强板的补强软性电路板
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
DE102011016308A1 (de) 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
CN107548573A (zh) 2015-07-31 2018-01-05 惠普发展公司，有限责任合伙企业 印刷电路板至模制化合物的接合部

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151443A (ja) * 1983-02-17 1984-08-29 Fujitsu Ltd 半導体装置
JPS63181439A (ja) * 1987-01-23 1988-07-26 Seiko Instr & Electronics Ltd 密着型イメ−ジセンサ
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
JPH01297870A (ja) * 1988-05-25 1989-11-30 Nippon Chemicon Corp 発光ダイオードおよびその製造方法
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
DE4237107C2 (de) * 1992-11-03 1994-10-06 Wustlich Holding Gmbh Beleuchtungsvorrichtung zur Ausleuchtung von Hintergrundflächen
US5463229A (en) * 1993-04-07 1995-10-31 Mitsui Toatsu Chemicals, Incorporated Circuit board for optical devices
JPH0870200A (ja) * 1995-09-19 1996-03-12 Seiko Epson Corp 回路の接続方法
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant

Also Published As

Publication number Publication date
EP0870336B1 (de) 2002-03-20
EP0870336A1 (de) 1998-10-14
WO1997024770A1 (en) 1997-07-10
DE69620026D1 (de) 2002-04-25
US5991160A (en) 1999-11-23
KR19990076803A (ko) 1999-10-15
JP2000503131A (ja) 2000-03-14
JP3398712B2 (ja) 2003-04-21

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, 93049 REGENSBURG,

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee