CN101472390B - 补强板及包括该补强板的补强软性电路板 - Google Patents
补强板及包括该补强板的补强软性电路板 Download PDFInfo
- Publication number
- CN101472390B CN101472390B CN2007102035039A CN200710203503A CN101472390B CN 101472390 B CN101472390 B CN 101472390B CN 2007102035039 A CN2007102035039 A CN 2007102035039A CN 200710203503 A CN200710203503 A CN 200710203503A CN 101472390 B CN101472390 B CN 101472390B
- Authority
- CN
- China
- Prior art keywords
- layer
- stiffening plate
- circuit board
- flexible circuit
- polyetherimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003014 reinforcing effect Effects 0.000 title description 3
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 61
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 33
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- 239000004642 Polyimide Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 71
- 239000012790 adhesive layer Substances 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- -1 ether imide Chemical class 0.000 claims description 4
- 150000003949 imides Chemical class 0.000 claims description 4
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 7
- 230000002787 reinforcement Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102035039A CN101472390B (zh) | 2007-12-28 | 2007-12-28 | 补强板及包括该补强板的补强软性电路板 |
US12/144,254 US20090166063A1 (en) | 2007-12-28 | 2008-06-23 | Stiffener and strengthened flexible printed circuit board having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102035039A CN101472390B (zh) | 2007-12-28 | 2007-12-28 | 补强板及包括该补强板的补强软性电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101472390A CN101472390A (zh) | 2009-07-01 |
CN101472390B true CN101472390B (zh) | 2010-12-08 |
Family
ID=40796720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102035039A Expired - Fee Related CN101472390B (zh) | 2007-12-28 | 2007-12-28 | 补强板及包括该补强板的补强软性电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090166063A1 (zh) |
CN (1) | CN101472390B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100188778A1 (en) * | 2009-01-29 | 2010-07-29 | Castagna Joseph T | Disk Drive Assembly Having Flexible Support for Flexible Printed Circuit Board |
CN103857183B (zh) * | 2012-12-05 | 2017-05-03 | 昆山雅森电子材料科技有限公司 | 复合式软性印刷电路板结构 |
US9965856B2 (en) * | 2013-10-22 | 2018-05-08 | Seegrid Corporation | Ranging cameras using a common substrate |
JP6561638B2 (ja) * | 2015-07-09 | 2019-08-21 | 住友電気工業株式会社 | フレキシブルプリント配線板、集光型太陽光発電モジュール、及び、集光型太陽光発電パネル |
CN110730562B (zh) * | 2019-10-12 | 2021-09-07 | Oppo(重庆)智能科技有限公司 | 电路基板、电路板和显示屏组件 |
CN113286417B (zh) * | 2021-05-28 | 2022-09-23 | 昆山工研院新型平板显示技术中心有限公司 | 柔性印刷电路板及显示设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1279157A (zh) * | 1999-06-29 | 2001-01-10 | 索尼化学株式会社 | 多层基板 |
CN1402959A (zh) * | 1999-12-06 | 2003-03-12 | 出光石油化学株式会社 | 多层印刷线路板 |
CN1410471A (zh) * | 2002-11-22 | 2003-04-16 | 中国科学院长春应用化学研究所 | 聚醚酰亚胺柔性印刷线路基材的制备方法 |
CN1649962A (zh) * | 2002-08-07 | 2005-08-03 | 三菱树脂株式会社 | 耐热性薄膜及其金属积层体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4858073A (en) * | 1986-12-10 | 1989-08-15 | Akzo America Inc. | Metal substrated printed circuit |
US5514449A (en) * | 1990-07-27 | 1996-05-07 | Minnesota Mining And Manufacturing Company | Multi-chip substrate |
WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
US5991160A (en) * | 1995-12-27 | 1999-11-23 | Infineon Technologies Corporation | Surface mount LED alphanumeric display |
US20070298260A1 (en) * | 2006-06-22 | 2007-12-27 | Kuppusamy Kanakarajan | Multi-layer laminate substrates useful in electronic type applications |
US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
-
2007
- 2007-12-28 CN CN2007102035039A patent/CN101472390B/zh not_active Expired - Fee Related
-
2008
- 2008-06-23 US US12/144,254 patent/US20090166063A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1279157A (zh) * | 1999-06-29 | 2001-01-10 | 索尼化学株式会社 | 多层基板 |
CN1402959A (zh) * | 1999-12-06 | 2003-03-12 | 出光石油化学株式会社 | 多层印刷线路板 |
CN1649962A (zh) * | 2002-08-07 | 2005-08-03 | 三菱树脂株式会社 | 耐热性薄膜及其金属积层体 |
CN1410471A (zh) * | 2002-11-22 | 2003-04-16 | 中国科学院长春应用化学研究所 | 聚醚酰亚胺柔性印刷线路基材的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101472390A (zh) | 2009-07-01 |
US20090166063A1 (en) | 2009-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101208 |
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CF01 | Termination of patent right due to non-payment of annual fee |