DE69617996T2 - Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen - Google Patents

Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen

Info

Publication number
DE69617996T2
DE69617996T2 DE69617996T DE69617996T DE69617996T2 DE 69617996 T2 DE69617996 T2 DE 69617996T2 DE 69617996 T DE69617996 T DE 69617996T DE 69617996 T DE69617996 T DE 69617996T DE 69617996 T2 DE69617996 T2 DE 69617996T2
Authority
DE
Germany
Prior art keywords
polymers
composite
adhesive applications
thermocuring
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69617996T
Other languages
German (de)
English (en)
Other versions
DE69617996D1 (de
Inventor
Jean Lee
Jack Boyd
Albert Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cytec Technology Corp
Original Assignee
Cytec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Technology Corp filed Critical Cytec Technology Corp
Publication of DE69617996D1 publication Critical patent/DE69617996D1/de
Application granted granted Critical
Publication of DE69617996T2 publication Critical patent/DE69617996T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C08F222/404—Imides, e.g. cyclic imides substituted imides comprising oxygen other than the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/123—Unsaturated polyimide precursors the unsaturated precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09D179/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
DE69617996T 1995-11-13 1996-10-30 Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen Expired - Lifetime DE69617996T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US644795P 1995-11-13 1995-11-13
PCT/US1996/017501 WO1997018255A1 (en) 1995-11-13 1996-10-30 Thermosetting polymers for composite and adhesive applications

Publications (2)

Publication Number Publication Date
DE69617996D1 DE69617996D1 (de) 2002-01-24
DE69617996T2 true DE69617996T2 (de) 2002-07-04

Family

ID=21720935

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69617996T Expired - Lifetime DE69617996T2 (de) 1995-11-13 1996-10-30 Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen

Country Status (9)

Country Link
US (1) US5955566A (es)
EP (1) EP0861280B1 (es)
JP (1) JP2000500795A (es)
AT (1) ATE210693T1 (es)
CA (1) CA2237331C (es)
DE (1) DE69617996T2 (es)
DK (1) DK0861280T3 (es)
ES (1) ES2164926T3 (es)
WO (1) WO1997018255A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
US6207739B1 (en) * 1997-11-20 2001-03-27 Kanegafuchi Kagaku Kogyo Kabushiki Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them
US20050042961A1 (en) * 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
US7129318B2 (en) * 2003-09-02 2006-10-31 I.S.T. (Ma) Corporation RTM and RI processable polyimide resins
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
CN101120027B (zh) * 2005-02-16 2011-09-28 Cytec技术有限公司 具有高温热稳定性的双马来酰亚胺树脂
AU2006240379B2 (en) * 2005-04-28 2011-01-06 Cytec Technology Corp. Bismaleimide resin system with improved manufacturing properties
CN101589127B (zh) * 2006-11-21 2012-10-10 汉高公司 用于预先加工的增韧粘合剂组合物
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
JP5451379B2 (ja) * 2007-03-29 2014-03-26 東邦テナックス株式会社 繊維強化プリプレグ及びそれから得られる複合材料
US8080313B2 (en) 2009-05-28 2011-12-20 Cytec Technology Corp. Particle-toughened fiber-reinforced polymer composites
US8268926B2 (en) * 2009-05-28 2012-09-18 Cytec Technology Corp. Particle-toughened polymer compositions
EP2794750B1 (en) 2011-12-22 2020-12-09 Cytec Industries Inc. Maleimide resins

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4175175A (en) * 1963-07-16 1979-11-20 Union Carbide Corporation Polyarylene polyethers
NL6609886A (es) * 1966-07-14 1968-01-15
FR2094607A5 (es) * 1970-06-26 1972-02-04 Rhone Poulenc Sa
CH615935A5 (es) * 1975-06-19 1980-02-29 Ciba Geigy Ag
US4564683A (en) * 1982-08-12 1986-01-14 The United States Of America As Represented By The United States Department Of Energy Bismaleimide compounds
US4546131A (en) * 1985-01-15 1985-10-08 The Dow Chemical Company Polymer modified cyanate mixture and epoxy resins thereof
US4568733A (en) * 1985-04-04 1986-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High performance mixed bisimide resins and composites based thereon
US4654407A (en) * 1985-08-02 1987-03-31 Amoco Corporation Aromatic bismaleimide and prepreg resin therefrom
US4689378A (en) * 1985-12-16 1987-08-25 Ciba-Geigy Corporation Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol
ES2058062T3 (es) * 1986-01-18 1994-11-01 Technochemie Gmbh Resinas curables.
CA1274048A (en) * 1986-07-15 1990-09-11 Linda A. Domeier Bismaleimide formulations containing olefinic ether modifiers
US4812511A (en) * 1986-07-15 1989-03-14 Amoco Corporation Ethylenically-unsaturated ethers of alkenyl phenols as reactive diluents for bismaleimides
EP0296112A3 (de) * 1987-06-18 1989-09-06 Ciba-Geigy Ag Lagerstabile härtbare Mischungen
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
DE3827120A1 (de) * 1988-08-10 1990-02-15 Basf Ag Hitzehaertbare bismaleinimid-copolymere sowie 2,6-disubstituierte pyridin-verbindungen als comonomere
DE3924867A1 (de) * 1989-07-27 1991-01-31 Basf Ag Bismaleinimid-harze
DE3929386A1 (de) * 1989-09-05 1991-03-07 Basf Ag Hitzehaertbare bismaleinimidharze
US5143969A (en) * 1991-06-24 1992-09-01 Basf Aktiengesellschaft Heat-curable bismaleimide molding compositions
JPH05155984A (ja) * 1991-12-04 1993-06-22 Meidensha Corp 耐熱性樹脂組成物

Also Published As

Publication number Publication date
EP0861280B1 (en) 2001-12-12
WO1997018255A1 (en) 1997-05-22
US5955566A (en) 1999-09-21
DK0861280T3 (da) 2002-04-08
DE69617996D1 (de) 2002-01-24
ATE210693T1 (de) 2001-12-15
CA2237331C (en) 2007-06-19
JP2000500795A (ja) 2000-01-25
ES2164926T3 (es) 2002-03-01
EP0861280A1 (en) 1998-09-02
CA2237331A1 (en) 1997-05-22

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