DE69611282D1 - Optische Unteranordnung mit niedriger Abmessung - Google Patents

Optische Unteranordnung mit niedriger Abmessung

Info

Publication number
DE69611282D1
DE69611282D1 DE69611282T DE69611282T DE69611282D1 DE 69611282 D1 DE69611282 D1 DE 69611282D1 DE 69611282 T DE69611282 T DE 69611282T DE 69611282 T DE69611282 T DE 69611282T DE 69611282 D1 DE69611282 D1 DE 69611282D1
Authority
DE
Germany
Prior art keywords
optical subassembly
low dimension
dimension optical
low
subassembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69611282T
Other languages
English (en)
Other versions
DE69611282T2 (de
Inventor
Felix Anigbo
Mindaugas Fernand Dautartas
William Michael Macdonald
Edward A Pitman
David Andrew Ramsey
Dominic Paul Rinaudo
Yiu-Huen Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of DE69611282D1 publication Critical patent/DE69611282D1/de
Application granted granted Critical
Publication of DE69611282T2 publication Critical patent/DE69611282T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
DE69611282T 1995-12-22 1996-12-13 Optische Unteranordnung mit niedriger Abmessung Expired - Lifetime DE69611282T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US911695P 1995-12-22 1995-12-22

Publications (2)

Publication Number Publication Date
DE69611282D1 true DE69611282D1 (de) 2001-01-25
DE69611282T2 DE69611282T2 (de) 2001-04-26

Family

ID=21735672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69611282T Expired - Lifetime DE69611282T2 (de) 1995-12-22 1996-12-13 Optische Unteranordnung mit niedriger Abmessung

Country Status (6)

Country Link
US (2) US5881193A (de)
EP (1) EP0782224B1 (de)
JP (1) JPH09222540A (de)
KR (1) KR970048629A (de)
CN (1) CN1156913A (de)
DE (1) DE69611282T2 (de)

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EP0895111A1 (de) * 1997-07-22 1999-02-03 Lucent Technologies Inc. Verfahren zum Verbinden von Aluminiumoxid und Siliziumsubstraten
EP0899781A3 (de) * 1997-08-28 2000-03-08 Lucent Technologies Inc. Korrosionsschutz in der Fabrikation optoelektronischer Module
US6618407B1 (en) * 1998-08-27 2003-09-09 Triquint Technology Holding Co. Uncooled universal laser module
US6385224B1 (en) * 1999-03-29 2002-05-07 The Whitaker Corporation Regrown notch laser
GB2352558B (en) * 1999-06-23 2001-11-07 Bookham Technology Ltd Optical transmitter with back facet monitor
US6371665B1 (en) 1999-06-25 2002-04-16 Lucent Technologies Inc. Plastic packaged optoelectronic device
JP2001034983A (ja) * 1999-07-14 2001-02-09 Sankyo Seiki Mfg Co Ltd 光ピックアップ装置用受発光素子
US6206276B1 (en) 1999-09-13 2001-03-27 Lucent Technologies Inc. Direct-placement fluxless soldering using inert gas environment
US6196446B1 (en) 1999-09-13 2001-03-06 Lucent Technologies Inc. Automated fluxless soldering using inert gas
US6193135B1 (en) 1999-09-13 2001-02-27 Lucent Technologies Inc. System for providing back-lighting of components during fluxless soldering
JP4582489B2 (ja) * 2000-01-21 2010-11-17 住友電気工業株式会社 発光装置
US6513991B1 (en) 2000-01-28 2003-02-04 Agere Systems, Inc. Semiconductor optical device package
US6920168B1 (en) 2000-02-22 2005-07-19 Triquint Technology Holding Co. Optical assembly
JP3770075B2 (ja) * 2000-11-13 2006-04-26 住友電気工業株式会社 発光装置
US6549550B2 (en) * 2001-02-14 2003-04-15 Triquint Technology Holding Co. Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
US6584250B2 (en) * 2001-02-20 2003-06-24 Industrial Technology Research Institute Optical fiber alignment element using integrated micro ball lens
US6715936B2 (en) * 2002-01-22 2004-04-06 Megasense, Inc. Photonic component package and method of packaging
JP2003303975A (ja) 2002-04-08 2003-10-24 Opnext Japan Inc モニタ用フォトダイオード付光モジュール。
US6804440B2 (en) * 2002-07-26 2004-10-12 Lnl Technologies, Inc. Integrated mode converter, waveguide, and on-chip function
JP4088779B2 (ja) * 2003-04-25 2008-05-21 セイコーエプソン株式会社 光ファイバ間の結合構造および結合方法
EP2937897A3 (de) * 2003-09-15 2016-03-23 Nuvotronics LLC Vorrichtungspaket und verfahren zur herstellung und prüfung davon
JP4225179B2 (ja) * 2003-10-17 2009-02-18 株式会社日立製作所 光学素子実装用基板およびその製造方法
TW200714949A (en) * 2005-08-15 2007-04-16 Rohm & Haas Elect Mat Bonding methods and optical assemblies
JP2020101735A (ja) * 2018-12-25 2020-07-02 エルジー ディスプレイ カンパニー リミテッド 光電変換モジュール
JP2021196478A (ja) * 2020-06-12 2021-12-27 住友電気工業株式会社 光モジュール

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
JPS6195591A (ja) * 1984-10-16 1986-05-14 Sony Corp 半導体レ−ザ
GB8729253D0 (en) * 1987-12-15 1988-01-27 Stc Plc Ridge waveguide to photodetector coupling
US4945400A (en) * 1988-03-03 1990-07-31 At&T Bell Laboratories Subassembly for optoelectronic devices
US5124281A (en) * 1990-08-27 1992-06-23 At&T Bell Laboratories Method of fabricating a photonics module comprising a spherical lens
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods
US5194105A (en) * 1991-08-29 1993-03-16 American Telephone And Telegraph Company Placement and bonding technique for optical elements
US5257336A (en) * 1992-08-21 1993-10-26 At&T Bell Laboratories Optical subassembly with passive optical alignment
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
US5567981A (en) * 1993-03-31 1996-10-22 Intel Corporation Bonding pad structure having an interposed rigid layer
DE4313492C1 (de) * 1993-04-24 1994-07-21 Ant Nachrichtentech Anordnung zur Ankopplung eines optoelektronischen Empfangselementes an ein optoelektronisches Sendeelement
JPH0829638A (ja) * 1994-05-12 1996-02-02 Fujitsu Ltd 光導波路・光ファイバ接続構造及び光導波路・光ファイバ接続方法並びに光導波路・光ファイバ接続に使用される光導波路基板及び同基板の製造方法並びに光導波路・光ファイバ接続に使用されるファイバ基板付き光ファイバ
JPH08107252A (ja) * 1994-10-06 1996-04-23 Mitsubishi Electric Corp 半導体レーザ装置，及び半導体レーザアレイ装置

Also Published As

Publication number Publication date
US5881193A (en) 1999-03-09
EP0782224A1 (de) 1997-07-02
JPH09222540A (ja) 1997-08-26
US6034405A (en) 2000-03-07
EP0782224B1 (de) 2000-12-20
DE69611282T2 (de) 2001-04-26
CN1156913A (zh) 1997-08-13
KR970048629A (ko) 1997-07-29

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