DE69610652D1 - Verfahren zur Entfernung von Oberflächenkontamination - Google Patents
Verfahren zur Entfernung von OberflächenkontaminationInfo
- Publication number
- DE69610652D1 DE69610652D1 DE69610652T DE69610652T DE69610652D1 DE 69610652 D1 DE69610652 D1 DE 69610652D1 DE 69610652 T DE69610652 T DE 69610652T DE 69610652 T DE69610652 T DE 69610652T DE 69610652 D1 DE69610652 D1 DE 69610652D1
- Authority
- DE
- Germany
- Prior art keywords
- methods
- surface contamination
- removing surface
- contamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37843895A | 1995-01-26 | 1995-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69610652D1 true DE69610652D1 (de) | 2000-11-23 |
DE69610652T2 DE69610652T2 (de) | 2001-05-10 |
Family
ID=23493142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996610652 Expired - Lifetime DE69610652T2 (de) | 1995-01-26 | 1996-01-17 | Verfahren zur Entfernung von Oberflächenkontamination |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0726099B1 (de) |
JP (1) | JPH08252549A (de) |
DE (1) | DE69610652T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5908510A (en) * | 1996-10-16 | 1999-06-01 | International Business Machines Corporation | Residue removal by supercritical fluids |
US6306564B1 (en) | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
US6500605B1 (en) | 1997-05-27 | 2002-12-31 | Tokyo Electron Limited | Removal of photoresist and residue from substrate using supercritical carbon dioxide process |
US6277753B1 (en) | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
US6748960B1 (en) | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
US6425956B1 (en) | 2001-01-05 | 2002-07-30 | International Business Machines Corporation | Process for removing chemical mechanical polishing residual slurry |
US6905555B2 (en) * | 2001-02-15 | 2005-06-14 | Micell Technologies, Inc. | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
JP2002324778A (ja) * | 2001-04-25 | 2002-11-08 | Sony Corp | 表面処理方法 |
US6782900B2 (en) * | 2001-09-13 | 2004-08-31 | Micell Technologies, Inc. | Methods and apparatus for cleaning and/or treating a substrate using CO2 |
JP3883929B2 (ja) | 2001-09-25 | 2007-02-21 | 大日本スクリーン製造株式会社 | 薄膜形成装置および薄膜形成方法 |
CN1741863A (zh) * | 2002-01-07 | 2006-03-01 | 普莱克斯技术有限公司 | 清洁物体的方法 |
US6846380B2 (en) | 2002-06-13 | 2005-01-25 | The Boc Group, Inc. | Substrate processing apparatus and related systems and methods |
US7282099B2 (en) | 2002-09-24 | 2007-10-16 | Air Products And Chemicals, Inc. | Dense phase processing fluids for microelectronic component manufacture |
JP2004363404A (ja) * | 2003-06-05 | 2004-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 超臨界乾燥方法 |
US20050183740A1 (en) * | 2004-02-19 | 2005-08-25 | Fulton John L. | Process and apparatus for removing residues from semiconductor substrates |
US7190512B2 (en) | 2004-04-29 | 2007-03-13 | Mitsubishi Heavy Industries, Ltd. | Optical properties restoration apparatus, the restoration method, and an optical system used in the apparatus |
DE102004021336B4 (de) * | 2004-04-30 | 2008-11-27 | Mitsubishi Heavy Industries, Ltd. | Vorrichtung und Verfahren zur Verbesserung optischer Eigenschaften und in der Vorrichtung verwendetes optisches System |
US7767145B2 (en) | 2005-03-28 | 2010-08-03 | Toyko Electron Limited | High pressure fourier transform infrared cell |
US7789971B2 (en) | 2005-05-13 | 2010-09-07 | Tokyo Electron Limited | Treatment of substrate using functionalizing agent in supercritical carbon dioxide |
FR2929138A1 (fr) * | 2008-09-24 | 2009-10-02 | Air Liquide | Procede de nettoyage d'un support notamment d'un dispositif de type semi-conducteur. |
CN106733836B (zh) * | 2016-12-20 | 2023-05-23 | 重庆科本科技股份有限公司 | 一种清洗工艺及清洗系统 |
CN113731937B (zh) * | 2021-09-10 | 2023-04-14 | 山东新华医疗器械股份有限公司 | 真空超声波清洗机压力控制优化方法 |
CN117782878B (zh) * | 2024-02-26 | 2024-04-26 | 太原理工大学 | 一种实时测量气体在液体中溶解参数的恒压装置及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5013366A (en) * | 1988-12-07 | 1991-05-07 | Hughes Aircraft Company | Cleaning process using phase shifting of dense phase gases |
US5267455A (en) * | 1992-07-13 | 1993-12-07 | The Clorox Company | Liquid/supercritical carbon dioxide dry cleaning system |
-
1996
- 1996-01-17 DE DE1996610652 patent/DE69610652T2/de not_active Expired - Lifetime
- 1996-01-17 EP EP19960100661 patent/EP0726099B1/de not_active Expired - Lifetime
- 1996-01-25 JP JP1064196A patent/JPH08252549A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0726099A3 (de) | 1996-09-11 |
EP0726099A2 (de) | 1996-08-14 |
JPH08252549A (ja) | 1996-10-01 |
DE69610652T2 (de) | 2001-05-10 |
EP0726099B1 (de) | 2000-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |