DE69606669D1 - Vorrichtung zum abrichten eines polierkissen - Google Patents

Vorrichtung zum abrichten eines polierkissen

Info

Publication number
DE69606669D1
DE69606669D1 DE69606669T DE69606669T DE69606669D1 DE 69606669 D1 DE69606669 D1 DE 69606669D1 DE 69606669 T DE69606669 T DE 69606669T DE 69606669 T DE69606669 T DE 69606669T DE 69606669 D1 DE69606669 D1 DE 69606669D1
Authority
DE
Germany
Prior art keywords
dressing
polishing cushion
polishing
cushion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69606669T
Other languages
English (en)
Other versions
DE69606669T2 (de
Inventor
Hempel, Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69606669D1 publication Critical patent/DE69606669D1/de
Application granted granted Critical
Publication of DE69606669T2 publication Critical patent/DE69606669T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE69606669T 1995-06-26 1996-06-25 Vorrichtung zum abrichten eines polierkissen Expired - Fee Related DE69606669T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56495P 1995-06-26 1995-06-26

Publications (2)

Publication Number Publication Date
DE69606669D1 true DE69606669D1 (de) 2000-03-23
DE69606669T2 DE69606669T2 (de) 2000-08-17

Family

ID=21692057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69606669T Expired - Fee Related DE69606669T2 (de) 1995-06-26 1996-06-25 Vorrichtung zum abrichten eines polierkissen

Country Status (4)

Country Link
EP (1) EP0750968B1 (de)
JP (1) JPH0911120A (de)
KR (1) KR970003594A (de)
DE (1) DE69606669T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100456803B1 (ko) * 1996-02-05 2005-05-09 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치
KR100684196B1 (ko) * 1999-10-29 2007-02-20 삼성전자주식회사 반도체 웨이퍼의 평탄화 설비
DE10322496B4 (de) * 2003-05-18 2006-08-24 Susanne Schiegerl Vorrichtung zur automatischen Reinigung und Konditionierung von bei Polierprozessen eingesetzten Poliertüchern

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322920A (en) * 1979-10-29 1982-04-06 Wells Raymond E Rotary floor conditioning machine attachment
JPS642858A (en) * 1987-03-02 1989-01-06 Rodeele Nitta Kk Material and method for seasoning polishing pad
JPH05208361A (ja) * 1992-01-31 1993-08-20 Fuji Electric Co Ltd 鏡面仕上げ用パッドのドレッシング装置
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
JP3109558B2 (ja) * 1994-11-24 2000-11-20 住友金属工業株式会社 ウエハ保持具

Also Published As

Publication number Publication date
JPH0911120A (ja) 1997-01-14
EP0750968B1 (de) 2000-02-16
KR970003594A (ko) 1997-01-28
DE69606669T2 (de) 2000-08-17
EP0750968A1 (de) 1997-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee