DE69528630D1 - Poliervorrichtung mit probenhalter - Google Patents

Poliervorrichtung mit probenhalter

Info

Publication number
DE69528630D1
DE69528630D1 DE69528630T DE69528630T DE69528630D1 DE 69528630 D1 DE69528630 D1 DE 69528630D1 DE 69528630 T DE69528630 T DE 69528630T DE 69528630 T DE69528630 T DE 69528630T DE 69528630 D1 DE69528630 D1 DE 69528630D1
Authority
DE
Germany
Prior art keywords
sample holder
polishing device
polishing
holder
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69528630T
Other languages
English (en)
Other versions
DE69528630T2 (de
Inventor
Jose Miragaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69528630D1 publication Critical patent/DE69528630D1/de
Application granted granted Critical
Publication of DE69528630T2 publication Critical patent/DE69528630T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE69528630T 1994-08-17 1995-08-16 Poliervorrichtung mit probenhalter Expired - Fee Related DE69528630T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9410079A FR2723704B1 (fr) 1994-08-17 1994-08-17 Dispositif de polissage avec porte-echantillons
PCT/FR1995/001085 WO1996005497A1 (fr) 1994-08-17 1995-08-16 Dispositif de polissage avec porte-echantillons

Publications (2)

Publication Number Publication Date
DE69528630D1 true DE69528630D1 (de) 2002-11-28
DE69528630T2 DE69528630T2 (de) 2003-07-10

Family

ID=9466345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69528630T Expired - Fee Related DE69528630T2 (de) 1994-08-17 1995-08-16 Poliervorrichtung mit probenhalter

Country Status (8)

Country Link
US (1) US5735992A (de)
EP (1) EP0723653B1 (de)
JP (1) JP3523264B2 (de)
CA (1) CA2174442C (de)
DE (1) DE69528630T2 (de)
ES (1) ES2184807T3 (de)
FR (1) FR2723704B1 (de)
WO (1) WO1996005497A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20204088U1 (de) 2002-03-13 2002-06-06 Müller, Heinrich, 57635 Wölmersen Oberflächenbearbeitungsvorrichtung für Probekörper
JP2004354333A (ja) * 2003-05-30 2004-12-16 Teruaki Ito 検体仕分けシステム
KR101134416B1 (ko) 2009-12-23 2012-04-09 강원대학교산학협력단 내마모성 및 편리성이 향상된 시편 제조 장치
DE102013003611A1 (de) 2013-03-01 2014-09-04 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Vorrichtung zur Zielpräparation
CN103940649B (zh) * 2014-04-03 2016-04-27 北京工业大学 带有预磨厚度控制装置的试样预磨机
CN105299047A (zh) * 2015-11-16 2016-02-03 耒阳新达微科技有限公司 一种新型轴承加工设备
CN106018021B (zh) * 2016-05-16 2018-10-30 安徽理工大学 一种用于不同尺寸岩石试样的制取装置及方法
CN106737085B (zh) * 2016-12-14 2018-09-11 上海奥龙星迪检测设备有限公司 磨抛机
US11397139B2 (en) 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
CN107081669B (zh) * 2017-05-22 2019-05-24 山东鲁发橡塑制品集团有限公司 一种塑胶件抛光装置
FR3070609B1 (fr) * 2017-09-01 2019-09-13 Sncf Mobilites Module de stockage d'une eprouvette micrographique
JP7104527B2 (ja) * 2018-03-02 2022-07-21 三菱重工業株式会社 皮膜のヤング率分布算出方法及び試料ホルダ
US11491611B2 (en) * 2018-08-14 2022-11-08 Illinois Tool Works Inc. Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards
DE102018126749A1 (de) 2018-10-26 2020-04-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Probenhaltervorrichtung für eine Schleifeinrichtung und Verfahren zum Herstellen einer mikroskopisch planen Ebene an einer Probe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549439A (en) * 1967-09-15 1970-12-22 North American Rockwell Chemical lapping method
US4534536A (en) * 1984-06-08 1985-08-13 Buehler Ltd. Apparatus for mounting samples for polishing
US4600469A (en) * 1984-12-21 1986-07-15 Honeywell Inc. Method for polishing detector material
DE9010700U1 (de) * 1990-07-18 1990-09-27 ANT Nachrichtentechnik GmbH, 7150 Backnang Haltevorrichtung für Proben, von denen ein Schliff angefertigt werden soll
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers

Also Published As

Publication number Publication date
FR2723704B1 (fr) 1996-09-20
JPH09504877A (ja) 1997-05-13
ES2184807T3 (es) 2003-04-16
WO1996005497A1 (fr) 1996-02-22
JP3523264B2 (ja) 2004-04-26
US5735992A (en) 1998-04-07
CA2174442A1 (en) 1996-02-22
FR2723704A1 (fr) 1996-02-23
EP0723653A1 (de) 1996-07-31
EP0723653B1 (de) 2002-10-23
DE69528630T2 (de) 2003-07-10
CA2174442C (en) 2005-07-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee