DE69528222T2 - Multichip-modul Drosselspule - Google Patents

Multichip-modul Drosselspule

Info

Publication number
DE69528222T2
DE69528222T2 DE69528222T DE69528222T DE69528222T2 DE 69528222 T2 DE69528222 T2 DE 69528222T2 DE 69528222 T DE69528222 T DE 69528222T DE 69528222 T DE69528222 T DE 69528222T DE 69528222 T2 DE69528222 T2 DE 69528222T2
Authority
DE
Germany
Prior art keywords
multichip module
choke coil
metallisation
inductors
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69528222T
Other languages
English (en)
Other versions
DE69528222D1 (de
Inventor
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intarsia Corp
Original Assignee
Intarsia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intarsia Corp filed Critical Intarsia Corp
Publication of DE69528222D1 publication Critical patent/DE69528222D1/de
Application granted granted Critical
Publication of DE69528222T2 publication Critical patent/DE69528222T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69528222T 1994-06-30 1995-06-09 Multichip-modul Drosselspule Expired - Fee Related DE69528222T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9413145A GB2290913B (en) 1994-06-30 1994-06-30 Multi-chip module inductor structure

Publications (2)

Publication Number Publication Date
DE69528222D1 DE69528222D1 (de) 2002-10-24
DE69528222T2 true DE69528222T2 (de) 2003-05-08

Family

ID=10757574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69528222T Expired - Fee Related DE69528222T2 (de) 1994-06-30 1995-06-09 Multichip-modul Drosselspule

Country Status (6)

Country Link
US (1) US5747870A (de)
EP (1) EP0690460B1 (de)
JP (1) JPH0831646A (de)
AT (1) ATE224579T1 (de)
DE (1) DE69528222T2 (de)
GB (1) GB2290913B (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292015B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Trimmable inductor structure
US5936299A (en) * 1997-03-13 1999-08-10 International Business Machines Corporation Substrate contact for integrated spiral inductors
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
US6310386B1 (en) * 1998-12-17 2001-10-30 Philips Electronics North America Corp. High performance chip/package inductor integration
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
US6310387B1 (en) * 1999-05-03 2001-10-30 Silicon Wave, Inc. Integrated circuit inductor with high self-resonance frequency
DE19963292A1 (de) * 1999-12-27 2001-06-28 Tridonic Bauelemente Elektronisches Vorschaltgerät
US6180445B1 (en) 2000-04-24 2001-01-30 Taiwan Semiconductor Manufacturing Company Method to fabricate high Q inductor by redistribution layer when flip-chip package is employed
US6437653B1 (en) * 2000-09-28 2002-08-20 Sun Microsystems, Inc. Method and apparatus for providing a variable inductor on a semiconductor chip
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
DE10057606B4 (de) * 2000-11-21 2004-04-29 Vogt Electronic Ag Anordnung zur Verbindung des Ferritkerns eines Planartransformators mit Masse
US6883977B2 (en) 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
KR100416264B1 (ko) 2001-12-06 2004-01-24 삼성전자주식회사 저손실 인덕터소자
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
JP2007528120A (ja) * 2003-07-03 2007-10-04 テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ 集積回路装置をパッケージングする方法及び装置
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
US20050085016A1 (en) * 2003-09-26 2005-04-21 Tessera, Inc. Structure and method of making capped chips using sacrificial layer
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
US7436281B2 (en) * 2004-07-30 2008-10-14 Texas Instruments Incorporated Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
JP4843611B2 (ja) 2004-10-01 2011-12-21 デ，ロシェモント，エル．，ピエール セラミックアンテナモジュール及びその製造方法
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
EP1964159A4 (de) 2005-06-30 2017-09-27 L. Pierre De Rochemont Elektrische komponenten und verfahren zur herstellung
US8350657B2 (en) * 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US8354294B2 (en) 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
US7541251B2 (en) * 2006-02-10 2009-06-02 California Micro Devices Wire bond and redistribution layer process
US20080002460A1 (en) * 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
US20080158840A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation DC power plane structure
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
US8058960B2 (en) * 2007-03-27 2011-11-15 Alpha And Omega Semiconductor Incorporated Chip scale power converter package having an inductor substrate
US7948346B2 (en) * 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
US8779489B2 (en) 2010-08-23 2014-07-15 L. Pierre de Rochemont Power FET with a resonant transistor gate
WO2012061656A2 (en) 2010-11-03 2012-05-10 De Rochemont L Pierre Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof
US9633772B2 (en) 2013-03-14 2017-04-25 Gentex Corporation Solderable planar magnetic components
EP3374905A1 (de) 2016-01-13 2018-09-19 Bigfoot Biomedical, Inc. Benutzerschnittstelle für diabetesmanagementsystem
EP3453414A1 (de) 2016-01-14 2019-03-13 Bigfoot Biomedical, Inc. Anpassung von insulinabgaberaten
WO2018132765A1 (en) 2017-01-13 2018-07-19 Mazlish Bryan Insulin delivery methods, systems and devices
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
US10454163B2 (en) * 2017-09-22 2019-10-22 Intel Corporation Ground layer design in a printed circuit board (PCB)
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
US11367557B2 (en) 2019-12-16 2022-06-21 International Business Machines Corporation Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614554A (en) * 1968-10-24 1971-10-19 Texas Instruments Inc Miniaturized thin film inductors for use in integrated circuits
US3798059A (en) * 1970-04-20 1974-03-19 Rca Corp Thick film inductor with ferromagnetic core
JPS56150807A (en) * 1980-04-22 1981-11-21 Tdk Corp Coil device
KR890004585B1 (ko) * 1980-09-11 1989-11-16 아사히가세이고교가부시키가이샤 마이크로코일(microcoil)
JPS58134409A (ja) * 1982-02-03 1983-08-10 Mitsubishi Electric Corp 回路素子
JPS6041312A (ja) * 1983-08-16 1985-03-05 Tdk Corp 回路素子
JPS6215850A (ja) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd マルチチツプパツケ−ジ基板
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
JPS6412510A (en) * 1987-07-07 1989-01-17 Matsushita Electric Ind Co Ltd Lc composite component and manufacture thereof
JPS6491118A (en) * 1987-10-02 1989-04-10 Alps Electric Co Ltd Liquid crystal display element mounting flip chip
JPH023959A (ja) * 1988-06-20 1990-01-09 Mitsubishi Electric Corp モノリシックマイクロ波集積回路
EP0398485B1 (de) * 1989-05-16 1995-08-09 Gec-Marconi Limited Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
JPH0513240A (ja) * 1991-07-02 1993-01-22 Matsushita Electric Ind Co Ltd チツプ形フエライトビーズコアおよびその製造方法
EP0529503A1 (de) * 1991-08-22 1993-03-03 Hewlett-Packard Company Flip-chip-Vorrichtung mit flexibler Befestigung
JP2867196B2 (ja) * 1992-03-10 1999-03-08 ティーディーケイ株式会社 セラミックインダクタ部品および複合積層部品
JPH06215850A (ja) * 1993-01-13 1994-08-05 Sumitomo Wiring Syst Ltd ロック検知コネクタの検査装置
US5313361A (en) * 1993-03-29 1994-05-17 The Charles Stark Draper Laboratory, Inc. Ceramic substrate
JP3325351B2 (ja) * 1993-08-18 2002-09-17 株式会社東芝 半導体装置
US5416356A (en) * 1993-09-03 1995-05-16 Motorola, Inc. Integrated circuit having passive circuit elements
US5534837A (en) * 1994-07-28 1996-07-09 Rockwell International Orthogonal-field electrically variable magnetic device

Also Published As

Publication number Publication date
GB2290913B (en) 1998-03-11
GB9413145D0 (en) 1994-08-24
DE69528222D1 (de) 2002-10-24
GB2290913A (en) 1996-01-10
JPH0831646A (ja) 1996-02-02
US5747870A (en) 1998-05-05
EP0690460A1 (de) 1996-01-03
EP0690460B1 (de) 2002-09-18
ATE224579T1 (de) 2002-10-15

Similar Documents

Publication Publication Date Title
DE69528222D1 (de) Multichip-modul Drosselspule
US7796006B2 (en) Suspension inductor devices
US4785345A (en) Integrated transformer structure with primary winding in substrate
US8441332B2 (en) Inter-helix inductor devices
US20200266131A1 (en) Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies
US5353001A (en) Hybrid integrated circuit planar transformer
US6531784B1 (en) Semiconductor package with spacer strips
DE69527119T2 (de) Struktur einer abgleichbaren Drosselspule
US7884452B2 (en) Semiconductor power device package having a lead frame-based integrated inductor
US20100148911A1 (en) Miniature Transformers Adapted For Use In Galvanic Isolators And The like
US9852928B2 (en) Semiconductor packages and modules with integrated ferrite material
WO2002056245A3 (en) Radio frequency identification tag on a single layer substrate
US5839184A (en) Method for creating on-package inductors for use with integrated circuits
US7969002B2 (en) Integrated circuit packages incorporating an inductor and methods
JP2007081146A (ja) インダクタ付半導体装置
US6420954B1 (en) Coupled multilayer soft magnetic films for high frequency microtransformer for system-on-chip power supply
US8338920B2 (en) Package integrated soft magnetic film for improvement in on-chip inductor performance
ATE233428T1 (de) Drosselspuleanordnung
US6525385B2 (en) Semiconductor device with inductance element
US20040217442A1 (en) Semiconductor device
WO1996042110A1 (fr) Dispositif a semi-conducteurs
US20050167810A1 (en) Stacked semiconductor device
JP3195106B2 (ja) 平面型磁気素子の製造方法
JP2006324572A (ja) 実装基板モジュール、その製造方法、および半導体装置
JP2003068941A (ja) 半導体装置

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee