DE69514213T2 - Oberflächenbehandlung eines gegenstandes - Google Patents

Oberflächenbehandlung eines gegenstandes

Info

Publication number
DE69514213T2
DE69514213T2 DE69514213T DE69514213T DE69514213T2 DE 69514213 T2 DE69514213 T2 DE 69514213T2 DE 69514213 T DE69514213 T DE 69514213T DE 69514213 T DE69514213 T DE 69514213T DE 69514213 T2 DE69514213 T2 DE 69514213T2
Authority
DE
Germany
Prior art keywords
etching
chemical etching
treating
electro
unmasked areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69514213T
Other languages
English (en)
Other versions
DE69514213D1 (de
Inventor
Jonathan Muhl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Edinburgh
Original Assignee
University of Edinburgh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Edinburgh filed Critical University of Edinburgh
Publication of DE69514213D1 publication Critical patent/DE69514213D1/de
Application granted granted Critical
Publication of DE69514213T2 publication Critical patent/DE69514213T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
DE69514213T 1994-02-25 1995-02-24 Oberflächenbehandlung eines gegenstandes Expired - Fee Related DE69514213T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9403682A GB9403682D0 (en) 1994-02-25 1994-02-25 Direct printing of etch masks under computer control
PCT/GB1995/000396 WO1995023244A1 (en) 1994-02-25 1995-02-24 Surface treatment of an object

Publications (2)

Publication Number Publication Date
DE69514213D1 DE69514213D1 (de) 2000-02-03
DE69514213T2 true DE69514213T2 (de) 2000-08-24

Family

ID=10750946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69514213T Expired - Fee Related DE69514213T2 (de) 1994-02-25 1995-02-24 Oberflächenbehandlung eines gegenstandes

Country Status (6)

Country Link
EP (1) EP0746638B1 (de)
AT (1) ATE188262T1 (de)
DE (1) DE69514213T2 (de)
ES (1) ES2144124T3 (de)
GB (1) GB9403682D0 (de)
WO (1) WO1995023244A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3974295A (en) * 1994-12-09 1996-06-26 Theophil-Johannes Melicher Direct and selective process for applying protective layers
EP1027723B1 (de) 1997-10-14 2009-06-17 Patterning Technologies Limited Methode zur Herstellung eines elektrischen Kondensators
US7323634B2 (en) 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
CA2375365A1 (en) 1999-05-27 2001-02-15 Patterning Technologies Limited Method of forming a masking pattern on a surface
AT500267B8 (de) 2001-05-22 2007-02-15 Berndorf Band Ges M B H Verfahren zum strukturieren von endlosen bändern für pressen
GB2379414A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate
US7217502B2 (en) 2003-03-27 2007-05-15 Eastman Kodak Company Nanopastes for use as patterning compositions
US7094503B2 (en) 2003-03-27 2006-08-22 Kodak Graphics Communications Canada Company Nanopastes for use as patterning compositions
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7081322B2 (en) 2003-03-27 2006-07-25 Kodak Graphics Communications Canada Company Nanopastes as ink-jet compositions for printing plates
JP4633727B2 (ja) * 2003-05-30 2011-02-16 フジフィルム・イメイジング・カラランツ・リミテッド 方法
GB0324947D0 (en) * 2003-10-25 2003-11-26 Avecia Ltd Process
DE102013108582A1 (de) * 2013-08-08 2015-02-12 Sandvik Surface Solutions Division Of Sandvik Materials Technology Deutschland Gmbh Verfahren zum Erzeugen von Strukturen auf einer umlaufenden Oberfläche
CN116732518A (zh) * 2023-06-06 2023-09-12 上海奢藏科技有限公司 一种异型多面铝材表面花纹蚀刻处理工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175050A (ja) * 1984-02-21 1985-09-09 Nec Corp 金属膜パタ−ン作成方法
US4588486A (en) * 1985-04-19 1986-05-13 Sprague Electric Company Etching of aluminum capacitor foil
US4767489A (en) * 1987-03-25 1988-08-30 Pc Proto, Inc. Computer aided printer-etcher
JPH0651913B2 (ja) * 1988-04-22 1994-07-06 川崎製鉄株式会社 圧延用ロールの表面加工方法及びその装置並びに該方法により製造されるプレス加工用金属薄板とその製造方法
JP2961159B2 (ja) * 1991-07-30 1999-10-12 新日本製鐵株式会社 圧延ロールの表面加工方法

Also Published As

Publication number Publication date
EP0746638B1 (de) 1999-12-29
DE69514213D1 (de) 2000-02-03
ATE188262T1 (de) 2000-01-15
GB9403682D0 (en) 1994-04-13
ES2144124T3 (es) 2000-06-01
EP0746638A1 (de) 1996-12-11
WO1995023244A1 (en) 1995-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee