ATE188262T1 - Oberflächenbehandlung eines gegenstandes - Google Patents
Oberflächenbehandlung eines gegenstandesInfo
- Publication number
- ATE188262T1 ATE188262T1 AT95909055T AT95909055T ATE188262T1 AT E188262 T1 ATE188262 T1 AT E188262T1 AT 95909055 T AT95909055 T AT 95909055T AT 95909055 T AT95909055 T AT 95909055T AT E188262 T1 ATE188262 T1 AT E188262T1
- Authority
- AT
- Austria
- Prior art keywords
- etching
- chemical etching
- treating
- electro
- unmasked areas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- ing And Chemical Polishing (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Developing Agents For Electrophotography (AREA)
- Electron Beam Exposure (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9403682A GB9403682D0 (en) | 1994-02-25 | 1994-02-25 | Direct printing of etch masks under computer control |
PCT/GB1995/000396 WO1995023244A1 (en) | 1994-02-25 | 1995-02-24 | Surface treatment of an object |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE188262T1 true ATE188262T1 (de) | 2000-01-15 |
Family
ID=10750946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT95909055T ATE188262T1 (de) | 1994-02-25 | 1995-02-24 | Oberflächenbehandlung eines gegenstandes |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0746638B1 (de) |
AT (1) | ATE188262T1 (de) |
DE (1) | DE69514213T2 (de) |
ES (1) | ES2144124T3 (de) |
GB (1) | GB9403682D0 (de) |
WO (1) | WO1995023244A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996018285A1 (de) * | 1994-12-09 | 1996-06-13 | Wolfgang Stubenvoll | Verfahren zum direkten und selektiven aufbringen von schutzschichten |
ATE434259T1 (de) | 1997-10-14 | 2009-07-15 | Patterning Technologies Ltd | Methode zur herstellung eines elektrischen kondensators |
US7323634B2 (en) | 1998-10-14 | 2008-01-29 | Patterning Technologies Limited | Method of forming an electronic device |
GB2350321A (en) * | 1999-05-27 | 2000-11-29 | Patterning Technologies Ltd | Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition |
ATE248388T1 (de) | 1999-05-27 | 2003-09-15 | Patterning Technologies Ltd | Verfahren zur erzeugung einer maske auf einer oberfläche |
AT500267B8 (de) * | 2001-05-22 | 2007-02-15 | Berndorf Band Ges M B H | Verfahren zum strukturieren von endlosen bändern für pressen |
GB2379414A (en) * | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate |
US7081322B2 (en) | 2003-03-27 | 2006-07-25 | Kodak Graphics Communications Canada Company | Nanopastes as ink-jet compositions for printing plates |
US7094503B2 (en) | 2003-03-27 | 2006-08-22 | Kodak Graphics Communications Canada Company | Nanopastes for use as patterning compositions |
US7217502B2 (en) | 2003-03-27 | 2007-05-15 | Eastman Kodak Company | Nanopastes for use as patterning compositions |
US6921626B2 (en) | 2003-03-27 | 2005-07-26 | Kodak Polychrome Graphics Llc | Nanopastes as patterning compositions for electronic parts |
EP1633823B1 (de) * | 2003-05-30 | 2008-10-29 | FUJIFILM Imaging Colorants Limited | Verfahren zum ätzen einer metall- oder metalllegierung oberfläche |
GB0324947D0 (en) * | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
DE102013108582A1 (de) * | 2013-08-08 | 2015-02-12 | Sandvik Surface Solutions Division Of Sandvik Materials Technology Deutschland Gmbh | Verfahren zum Erzeugen von Strukturen auf einer umlaufenden Oberfläche |
CN116732518A (zh) * | 2023-06-06 | 2023-09-12 | 上海奢藏科技有限公司 | 一种异型多面铝材表面花纹蚀刻处理工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60175050A (ja) * | 1984-02-21 | 1985-09-09 | Nec Corp | 金属膜パタ−ン作成方法 |
US4588486A (en) * | 1985-04-19 | 1986-05-13 | Sprague Electric Company | Etching of aluminum capacitor foil |
US4767489A (en) * | 1987-03-25 | 1988-08-30 | Pc Proto, Inc. | Computer aided printer-etcher |
JPH0651913B2 (ja) * | 1988-04-22 | 1994-07-06 | 川崎製鉄株式会社 | 圧延用ロールの表面加工方法及びその装置並びに該方法により製造されるプレス加工用金属薄板とその製造方法 |
JP2961159B2 (ja) * | 1991-07-30 | 1999-10-12 | 新日本製鐵株式会社 | 圧延ロールの表面加工方法 |
-
1994
- 1994-02-25 GB GB9403682A patent/GB9403682D0/en active Pending
-
1995
- 1995-02-24 WO PCT/GB1995/000396 patent/WO1995023244A1/en active IP Right Grant
- 1995-02-24 ES ES95909055T patent/ES2144124T3/es not_active Expired - Lifetime
- 1995-02-24 EP EP95909055A patent/EP0746638B1/de not_active Expired - Lifetime
- 1995-02-24 DE DE69514213T patent/DE69514213T2/de not_active Expired - Fee Related
- 1995-02-24 AT AT95909055T patent/ATE188262T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB9403682D0 (en) | 1994-04-13 |
DE69514213D1 (de) | 2000-02-03 |
EP0746638A1 (de) | 1996-12-11 |
DE69514213T2 (de) | 2000-08-24 |
ES2144124T3 (es) | 2000-06-01 |
WO1995023244A1 (en) | 1995-08-31 |
EP0746638B1 (de) | 1999-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |