DE69507713T2 - Lasersystem und verfahren zum trimmen in funktion von filmen und vorrichtungen - Google Patents
Lasersystem und verfahren zum trimmen in funktion von filmen und vorrichtungenInfo
- Publication number
- DE69507713T2 DE69507713T2 DE69507713T DE69507713T DE69507713T2 DE 69507713 T2 DE69507713 T2 DE 69507713T2 DE 69507713 T DE69507713 T DE 69507713T DE 69507713 T DE69507713 T DE 69507713T DE 69507713 T2 DE69507713 T2 DE 69507713T2
- Authority
- DE
- Germany
- Prior art keywords
- films
- devices
- function
- laser system
- trimming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/343,779 US5569398A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively trimming films |
US08/538,073 US5685995A (en) | 1994-11-22 | 1995-10-02 | Method for laser functional trimming of films and devices |
PCT/US1995/015136 WO1996015870A1 (en) | 1994-11-22 | 1995-11-20 | Laser system and method for functional trimming of films and devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69507713D1 DE69507713D1 (de) | 1999-03-18 |
DE69507713T2 true DE69507713T2 (de) | 1999-09-02 |
Family
ID=26993621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69507713T Expired - Lifetime DE69507713T2 (de) | 1994-11-22 | 1995-11-20 | Lasersystem und verfahren zum trimmen in funktion von filmen und vorrichtungen |
Country Status (5)
Country | Link |
---|---|
US (2) | US5685995A (de) |
EP (1) | EP0793557B1 (de) |
JP (1) | JP3423000B2 (de) |
DE (1) | DE69507713T2 (de) |
WO (1) | WO1996015870A1 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5998759A (en) | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
WO1999040591A1 (en) * | 1998-02-06 | 1999-08-12 | Electro Scientific Industries, Inc. | Passive resistive component surface ablation trimming technique using q-switched, solid-state ultraviolet wavelength laser |
US5997985A (en) * | 1998-09-10 | 1999-12-07 | Northrop Grumman Corporation | Method of forming acoustic attenuation chambers using laser processing of multi-layered polymer films |
US6300590B1 (en) * | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
US6326256B1 (en) * | 1998-12-18 | 2001-12-04 | Texas Instruments Incorporated | Method of producing a laser trimmable thin film resistor in an integrated circuit |
US6771895B2 (en) | 1999-01-06 | 2004-08-03 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
DE19901540A1 (de) * | 1999-01-16 | 2000-07-20 | Philips Corp Intellectual Pty | Verfahren zur Feinabstimmung eines passiven, elektronischen Bauelementes |
US6329272B1 (en) | 1999-06-14 | 2001-12-11 | Technologies Ltrim Inc. | Method and apparatus for iteratively, selectively tuning the impedance of integrated semiconductor devices using a focussed heating source |
US6653593B2 (en) | 1999-10-08 | 2003-11-25 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
US7111423B2 (en) * | 1999-10-08 | 2006-09-26 | Identification Dynamics, Llc | Method and apparatus for reading firearm microstamping |
US6833911B2 (en) | 1999-10-08 | 2004-12-21 | Identification Dynamics, Inc. | Method and apparatus for reading firearm microstamping |
US6420675B1 (en) | 1999-10-08 | 2002-07-16 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
US6310701B1 (en) | 1999-10-08 | 2001-10-30 | Nanovia Lp | Method and apparatus for ablating high-density array of vias or indentation in surface of object |
US6256121B1 (en) | 1999-10-08 | 2001-07-03 | Nanovia, Lp | Apparatus for ablating high-density array of vias or indentation in surface of object |
US6886284B2 (en) * | 1999-10-08 | 2005-05-03 | Identification Dynamics, Llc | Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles |
US6388230B1 (en) * | 1999-10-13 | 2002-05-14 | Morton International, Inc. | Laser imaging of thin layer electronic circuitry material |
US6380506B1 (en) | 1999-11-22 | 2002-04-30 | Chartered Semiconductor Manufacturing Ltd. | Use of hot carrier effects to trim analog transistor pair |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US7671295B2 (en) | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
AU2001228239A1 (en) * | 2000-01-27 | 2001-08-07 | National Research Council Of Canada | Method and apparatus for repair of defects in materials with short laser pulses |
US6509546B1 (en) | 2000-03-15 | 2003-01-21 | International Business Machines Corporation | Laser excision of laminate chip carriers |
JP2002073129A (ja) * | 2000-08-30 | 2002-03-12 | Mitsubishi Electric Corp | レーザトリミング用プログラム作成装置、方法、記録媒体およびレーザトリミング装置 |
US6647614B1 (en) * | 2000-10-20 | 2003-11-18 | International Business Machines Corporation | Method for changing an electrical resistance of a resistor |
US6664500B2 (en) | 2000-12-16 | 2003-12-16 | Anadigics, Inc. | Laser-trimmable digital resistor |
US6534743B2 (en) * | 2001-02-01 | 2003-03-18 | Electro Scientific Industries, Inc. | Resistor trimming with small uniform spot from solid-state UV laser |
GB2389555A (en) * | 2001-02-01 | 2003-12-17 | Electro Scient Ind Inc | Resistor trimming with small uniform spot from solid-state UV laser |
US6777645B2 (en) | 2001-03-29 | 2004-08-17 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
EP1258891A2 (de) * | 2001-05-17 | 2002-11-20 | Shipley Co. L.L.C. | Widerstände |
KR20040035673A (ko) * | 2001-07-06 | 2004-04-29 | 비아시스템즈 그룹, 인코포레이티드 | 보드간 통신을 위한 pcb에의 광계층 집적 시스템 및집적방법 |
JP4728534B2 (ja) * | 2001-09-11 | 2011-07-20 | テイコクテーピングシステム株式会社 | シリコンウエハ保護フィルムのトリミング方法及びトリミング装置 |
US7563695B2 (en) * | 2002-03-27 | 2009-07-21 | Gsi Group Corporation | Method and system for high-speed precise laser trimming and scan lens for use therein |
US6951995B2 (en) * | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
JP2005523583A (ja) | 2002-04-19 | 2005-08-04 | エグシル テクノロジー リミテッド | パルスレーザを用いる、基板のプログラム制御ダイシング |
US7204419B2 (en) * | 2003-05-01 | 2007-04-17 | Identifcation Dynamics, Llc | Method and apparatus for reading firearm microstamping |
DE10310434A1 (de) | 2003-03-11 | 2004-09-30 | Krone Gmbh | Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte |
US20050241203A1 (en) * | 2003-05-01 | 2005-11-03 | Lizotte Todd E | Method and apparatus for cartridge identification imprinting in difficult contexts by recess protected indicia |
US7247503B2 (en) * | 2003-05-07 | 2007-07-24 | Macronix International Co., Ltd. | Method of laser annealing to form an epitaxial growth layer |
JP4063206B2 (ja) * | 2003-12-03 | 2008-03-19 | 株式会社デンソー | 半導体製造方法 |
US7020582B1 (en) | 2004-04-28 | 2006-03-28 | Altera Corporation | Methods and apparatus for laser marking of integrated circuit faults |
US20050267664A1 (en) * | 2004-05-14 | 2005-12-01 | Jiyuan Ouyang | Method for adjusting a control signal of an electronic sensor |
US20060039419A1 (en) * | 2004-08-16 | 2006-02-23 | Tan Deshi | Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths |
KR101225024B1 (ko) | 2004-09-13 | 2013-01-23 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 저항의 레이저 트리밍 동안 열전기적 전위 해소 |
DE102005004108B4 (de) * | 2005-01-28 | 2007-04-12 | Infineon Technologies Ag | Halbleiterschaltung sowie Anordnung und Verfahren zur Kontrolle von Schmelzelementen einer Halbleiterschaltung |
US7378936B2 (en) * | 2005-05-23 | 2008-05-27 | Tektronix, Inc. | Circuit element with laser trimmed component |
CA2533225C (en) * | 2006-01-19 | 2016-03-22 | Technologies Ltrim Inc. | A tunable semiconductor component provided with a current barrier |
US20070215575A1 (en) * | 2006-03-15 | 2007-09-20 | Bo Gu | Method and system for high-speed, precise, laser-based modification of one or more electrical elements |
US8198566B2 (en) * | 2006-05-24 | 2012-06-12 | Electro Scientific Industries, Inc. | Laser processing of workpieces containing low-k dielectric material |
US7759607B2 (en) * | 2006-06-20 | 2010-07-20 | Optical Analytics, Inc. | Method of direct Coulomb explosion in laser ablation of semiconductor structures |
US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
US7910597B2 (en) * | 2006-11-28 | 2011-03-22 | Shire Llc | Substituted quinazolines |
US7602562B2 (en) | 2007-05-21 | 2009-10-13 | Electro Scientific Industries, Inc. | Fluid counterbalance for a laser lens used to scribe an electronic component substrate |
US7725858B2 (en) * | 2007-06-27 | 2010-05-25 | Intel Corporation | Providing a moat capacitance |
US8240027B2 (en) * | 2008-01-16 | 2012-08-14 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates having film resistors as part thereof |
US8202128B2 (en) * | 2008-11-25 | 2012-06-19 | Adc Gmbh | Telecommunications jack with adjustable crosstalk compensation |
EP2387803B1 (de) * | 2009-01-14 | 2016-07-13 | Philips Lighting Holding B.V. | Verfahren zum auftragen von mindestens einem elektrischen leitenden film auf ein substrat |
US8461479B2 (en) * | 2009-12-23 | 2013-06-11 | Electro Scientific Industries, Inc. | Adaptive processing constraints for memory repair |
WO2012052985A1 (en) * | 2010-10-22 | 2012-04-26 | Highcon Ltd | Method and apparatus for laser cutting |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4172741A (en) * | 1977-09-06 | 1979-10-30 | National Semiconductor Corporation | Method for laser trimming of bi-FET circuits |
US4182024A (en) * | 1977-12-15 | 1980-01-08 | National Semiconductor Corporation | Automatic control of integrated circuit trimming |
US4217570A (en) * | 1978-05-30 | 1980-08-12 | Tektronix, Inc. | Thin-film microcircuits adapted for laser trimming |
US4228528B2 (en) * | 1979-02-09 | 1992-10-06 | Memory with redundant rows and columns | |
US4399345A (en) * | 1981-06-09 | 1983-08-16 | Analog Devices, Inc. | Laser trimming of circuit elements on semiconductive substrates |
US4713518A (en) * | 1984-06-08 | 1987-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
US4598039A (en) * | 1984-07-02 | 1986-07-01 | At&T Bell Laboratories | Formation of features in optical material |
US4761786A (en) * | 1986-12-23 | 1988-08-02 | Spectra-Physics, Inc. | Miniaturized Q-switched diode pumped solid state laser |
US4656635A (en) * | 1985-05-01 | 1987-04-07 | Spectra-Physics, Inc. | Laser diode pumped solid state laser |
US4731795A (en) * | 1986-06-26 | 1988-03-15 | Amoco Corporation | Solid state laser |
US4792779A (en) * | 1986-09-19 | 1988-12-20 | Hughes Aircraft Company | Trimming passive components buried in multilayer structures |
US4708747A (en) * | 1986-10-16 | 1987-11-24 | Harris Corporation | Dielectric for laser trimming |
US4705698A (en) * | 1986-10-27 | 1987-11-10 | Chronar Corporation | Isolation of semiconductor contacts |
US4810049A (en) * | 1987-04-02 | 1989-03-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Reducing bend and coupling losses in integrated optical waveguides |
US4853758A (en) * | 1987-08-12 | 1989-08-01 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser-blown links |
US4791631A (en) * | 1987-08-31 | 1988-12-13 | International Business Machines Corporation | Wide tolerance, modulated blue laser source |
US4930901A (en) * | 1988-12-23 | 1990-06-05 | Electro Scientific Industries, Inc. | Method of and apparatus for modulating a laser beam |
US4942582A (en) * | 1989-04-24 | 1990-07-17 | Spectra-Physics | Single frequency solid state laser |
US5066998A (en) * | 1989-06-30 | 1991-11-19 | At&T Bell Laboratories | Severable conductive path in an integrated-circuit device |
US5185291A (en) * | 1989-06-30 | 1993-02-09 | At&T Bell Laboratories | Method of making severable conductive path in an integrated-circuit device |
US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
US4987286A (en) * | 1989-10-30 | 1991-01-22 | University Of Iowa Research Foundation | Method and apparatus for removing minute particles from a surface |
US4965803A (en) * | 1990-03-30 | 1990-10-23 | The United Stats Of America As Represented By The Scretary Of The Navy | Room-temperature, laser diode-pumped, q-switched, 2 micron, thulium-doped, solid state laser |
US5091991A (en) * | 1991-02-25 | 1992-02-25 | Amp Incorporated | Optical fiber connector with alignment feature |
US5096850A (en) * | 1991-04-23 | 1992-03-17 | Harris Corporation | Method of laser trimming |
DE59103714D1 (de) * | 1991-10-07 | 1995-01-12 | Siemens Ag | Laserbearbeitungsverfahren für einen Dünnschichtaufbau. |
US5260963A (en) * | 1992-04-24 | 1993-11-09 | Electro Scientific Industries, Inc. | Method and apparatus for efficient operationof a solid-state laser optically pumped by an unstable resonator semiconductor laser |
US5420515A (en) * | 1992-08-28 | 1995-05-30 | Hewlett-Packard Company | Active circuit trimming with AC and DC response trims relative to a known response |
US5265114C1 (en) * | 1992-09-10 | 2001-08-21 | Electro Scient Ind Inc | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
US5611946A (en) * | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
US5623449A (en) * | 1995-08-11 | 1997-04-22 | Lucent Technologies Inc. | Flag detection for first-in-first-out memories |
-
1995
- 1995-10-02 US US08/538,073 patent/US5685995A/en not_active Expired - Lifetime
- 1995-11-20 JP JP51703996A patent/JP3423000B2/ja not_active Expired - Lifetime
- 1995-11-20 WO PCT/US1995/015136 patent/WO1996015870A1/en active IP Right Grant
- 1995-11-20 DE DE69507713T patent/DE69507713T2/de not_active Expired - Lifetime
- 1995-11-20 EP EP95940776A patent/EP0793557B1/de not_active Expired - Lifetime
-
1997
- 1997-10-28 US US08/959,140 patent/US5808272A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5808272A (en) | 1998-09-15 |
EP0793557B1 (de) | 1999-02-03 |
JP2001520583A (ja) | 2001-10-30 |
EP0793557A1 (de) | 1997-09-10 |
US5685995A (en) | 1997-11-11 |
JP3423000B2 (ja) | 2003-07-07 |
WO1996015870A1 (en) | 1996-05-30 |
DE69507713D1 (de) | 1999-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |