DE69507445D1 - Cleaning method for a semiconductor substrate - Google Patents

Cleaning method for a semiconductor substrate

Info

Publication number
DE69507445D1
DE69507445D1 DE69507445T DE69507445T DE69507445D1 DE 69507445 D1 DE69507445 D1 DE 69507445D1 DE 69507445 T DE69507445 T DE 69507445T DE 69507445 T DE69507445 T DE 69507445T DE 69507445 D1 DE69507445 D1 DE 69507445D1
Authority
DE
Germany
Prior art keywords
semiconductor substrate
cleaning method
cleaning
semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69507445T
Other languages
German (de)
Other versions
DE69507445T2 (en
Inventor
Yuka Hayami
Miki T Suzuki
Hiroki Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69507445D1 publication Critical patent/DE69507445D1/en
Application granted granted Critical
Publication of DE69507445T2 publication Critical patent/DE69507445T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
DE69507445T 1994-12-19 1995-08-14 Cleaning method for a semiconductor substrate Expired - Fee Related DE69507445T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6314392A JPH08172068A (en) 1994-12-19 1994-12-19 Cleaning method of semiconductor substrate and manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
DE69507445D1 true DE69507445D1 (en) 1999-03-04
DE69507445T2 DE69507445T2 (en) 1999-06-02

Family

ID=18052798

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507445T Expired - Fee Related DE69507445T2 (en) 1994-12-19 1995-08-14 Cleaning method for a semiconductor substrate

Country Status (6)

Country Link
US (1) US5795494A (en)
EP (1) EP0718872B1 (en)
JP (1) JPH08172068A (en)
KR (1) KR0185463B1 (en)
CN (1) CN1079579C (en)
DE (1) DE69507445T2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3662111B2 (en) * 1997-06-24 2005-06-22 アルプス電気株式会社 Cleaning liquid manufacturing method and apparatus therefor
US6007406A (en) 1997-12-04 1999-12-28 Micron Technology, Inc. Polishing systems, methods of polishing substrates, and method of preparing liquids for semiconductor fabrication process
EP1310988B1 (en) * 2000-06-23 2010-05-26 Fujitsu Limited Method of manufacturing a semiconductor element
JP4602540B2 (en) * 2000-12-12 2010-12-22 オメガセミコン電子株式会社 Substrate processing equipment
US8084406B2 (en) * 2007-12-14 2011-12-27 Lam Research Corporation Apparatus for particle removal by single-phase and two-phase media
US8956463B2 (en) 2008-10-08 2015-02-17 Shin-Etsu Chemical Co., Ltd. Method for cleaning photomask-related substrate, cleaning method, and cleaning fluid supplying apparatus
JP2010117412A (en) * 2008-11-11 2010-05-27 Shin-Etsu Chemical Co Ltd Method for cleaning photomask-related substrate
JP2010117403A (en) * 2008-11-11 2010-05-27 Shin-Etsu Chemical Co Ltd Method for cleaning photomask-related substrate
JP5871652B2 (en) * 2012-02-23 2016-03-01 オルガノ株式会社 Method for removing dissolved oxygen in alcohol, alcohol supply device and cleaning liquid supply device
CN102728577B (en) * 2012-06-21 2014-11-19 信义汽车部件（芜湖）有限公司 Method for improving surface tension of glass plastic accessory
US9339853B2 (en) 2012-12-04 2016-05-17 The Boeing Company Surface materials for decontamination with decontaminants
US10190227B2 (en) * 2013-03-14 2019-01-29 Xtalic Corporation Articles comprising an electrodeposited aluminum alloys
JP2016164977A (en) * 2015-02-27 2016-09-08 キヤノン株式会社 Nanoimprint liquid material, method for manufacturing nanoimprint liquid material, method for manufacturing hardened material pattern, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component
JP6993885B2 (en) * 2018-01-15 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス Board processing method and board processing equipment
CN111599730A (en) * 2020-06-22 2020-08-28 上海华力微电子有限公司 Etching liquid supply device and method
CN116435418B (en) * 2023-06-13 2023-08-25 南昌凯捷半导体科技有限公司 590nm reversed-polarity LED epitaxial wafer and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU843029A1 (en) * 1979-04-16 1981-06-30 Предприятие П/Я А-3560 Device for cleaning semiconductor plate surface
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
JPH071761B2 (en) * 1987-12-07 1995-01-11 松下電器産業株式会社 Semiconductor substrate processing method
JPH02164035A (en) * 1988-12-19 1990-06-25 Nec Corp Cleaning of semiconductor substrate
JPH03157927A (en) * 1989-11-15 1991-07-05 Mitsubishi Electric Corp Drying process of semiconductor wafer
JPH04151835A (en) * 1990-05-25 1992-05-25 Shimada Phys & Chem Ind Co Ltd Washing drying method
JPH0440270A (en) * 1990-06-01 1992-02-10 Miura Co Ltd Cleaning method for electronic component
JPH04107922A (en) * 1990-08-29 1992-04-09 Fujitsu Ltd Semiconductor cleaning liquid and cleaning method therewith
JPH04124825A (en) * 1990-09-14 1992-04-24 Sharp Corp Washing method of semiconductor wafer
JPH0653201A (en) * 1992-07-27 1994-02-25 Nippon Telegr & Teleph Corp <Ntt> Surface formation method of compound semiconductor substrate
KR960002763B1 (en) * 1992-12-24 1996-02-26 금성일렉트론주식회사 Semiconductor cleaning method and cleaning chemicals
DE4316096C1 (en) * 1993-05-13 1994-11-10 Wacker Chemitronic Process for the wet chemical treatment of disk-shaped workpieces
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid

Also Published As

Publication number Publication date
EP0718872B1 (en) 1999-01-20
EP0718872A1 (en) 1996-06-26
KR960026331A (en) 1996-07-22
KR0185463B1 (en) 1999-04-15
CN1127424A (en) 1996-07-24
US5795494A (en) 1998-08-18
DE69507445T2 (en) 1999-06-02
CN1079579C (en) 2002-02-20
JPH08172068A (en) 1996-07-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee