JPH0440270A - Cleaning method for electronic component - Google Patents

Cleaning method for electronic component

Info

Publication number
JPH0440270A
JPH0440270A JP14485090A JP14485090A JPH0440270A JP H0440270 A JPH0440270 A JP H0440270A JP 14485090 A JP14485090 A JP 14485090A JP 14485090 A JP14485090 A JP 14485090A JP H0440270 A JPH0440270 A JP H0440270A
Authority
JP
Japan
Prior art keywords
cleaning
water
tank
oxygen
membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14485090A
Other languages
Japanese (ja)
Inventor
Naoki Hina
日名 直樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miura Co Ltd
Original Assignee
Miura Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miura Co Ltd filed Critical Miura Co Ltd
Priority to JP14485090A priority Critical patent/JPH0440270A/en
Publication of JPH0440270A publication Critical patent/JPH0440270A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the oxidation and corrosion of an electronic component in a cleaning process by reducing the concn. of dissolved oxygen in cleaning water to about 1ppm or less. CONSTITUTION:A membrane type deoxygenating device 1 is inserted in a cleaning water supply line 4 to remove dissolved oxygen in the cleaning water supplied to a cleaning tank 3 for an electronic component to reduce the concn. of dissolved coxygen to about 1ppm or less. Raw water is purified by a pure water apparatus S, for example, a reverse osmosis membrane apparatus to store pure water in a tank 7 and this pure water is fed to the membrane type deoxygenating device 1 by a pump 7. The cleaning water from which dissolved oxygen is removed by the membrane type deoxygenating apparatus is sent to the cleaning tank 3 but, as the cleaning tank 3, a hermetically closed one is used in order to prevent the re-dissolution of oxygen and, for example, the tank is filled with inert gas, for example, N2 to prevent the mixing with oxygen in an atmosphere from the outside.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、IC基盤、太陽電池及びその他の電子部品
等の洗浄方法に係るものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for cleaning IC boards, solar cells, other electronic components, etc.

〔従来の技術及びその課題〕[Conventional technology and its problems]

周知のように、電子部品の洗浄には、フロン或いは純水
などが一般に用いられているが、フロンは、地球環境の
保護の為に全世界的にその使用が禁止されつつある。一
方、純水を用いる場合には、溶存酸素の影響による電子
部品の酸化、腐食の問題があり、腐食を防止する為に、
インヒビターいわゆる腐食抑制剤を投入するようにして
いるが、インヒビクーを使用すると公害防止の為の大が
かりな処理設備を必要とし、その他、インヒビターの製
品への付着、洗浄液への金属イオンの流出等の問題があ
る。
As is well known, fluorocarbons or pure water are generally used to clean electronic parts, but the use of fluorocarbons is being banned worldwide to protect the global environment. On the other hand, when using pure water, there are problems with oxidation and corrosion of electronic components due to the influence of dissolved oxygen.
We try to use inhibitors, so-called corrosion inhibitors, but using inhibitors requires large-scale processing equipment to prevent pollution, and there are other problems such as the inhibitors adhering to products and metal ions leaking into the cleaning solution. There is.

[課題を解決するための手段] この発明は、上述の課題に鑑み、安全で且つ低コストの
洗浄方法を提供しようとするもので、具体的には、原水
を膜式脱酸素装置に導入し、脱酸素膜を介じて真空脱気
することにより、溶存酸素濃度が約lppm以下の脱酸
素水とし、これを電子部品の洗浄タンクに連続的に供給
することを特徴としている。
[Means for Solving the Problems] In view of the above-mentioned problems, the present invention aims to provide a safe and low-cost cleaning method. The method is characterized in that deoxygenated water with a dissolved oxygen concentration of about 1 ppm or less is produced by vacuum degassing through an oxygen-depleting membrane, and this water is continuously supplied to a tank for cleaning electronic parts.

[作用] 上述の構成によれば、膜式脱酸素装置により溶存酸素濃
度を1 ppm以下とした脱酸素水を電子部品の洗浄水
として用いることにより、公害などの危険もなく安全で
、しかも大がかりな設備を必要とせず簡略で且つ低コス
トのシステムによる電子部品の洗浄を実現することがで
きる。
[Function] According to the above configuration, by using deoxygenated water with a dissolved oxygen concentration of 1 ppm or less by a membrane-type oxygen absorbing device as cleaning water for electronic parts, it is safe without any risk of pollution, and moreover, it is easy to clean on a large scale. Electronic components can be cleaned using a simple and low-cost system that does not require special equipment.

〔実施例〕〔Example〕

以下、この発明の好ましい実施例を、図面に基づいて説
明する。
Preferred embodiments of the present invention will be described below with reference to the drawings.

図中(1)は膜式脱酸素装置で、洗浄水供給ライン(4
)に挿入し、電子部品等の洗浄タンク(3)へ供給する
洗浄水中の溶存酸素を除去する(溶存酸素濃度約1 p
Pln以下)。(5)は純水装置で、例えば逆浸透膜装
置等を用いて原水を純水化し、タンク(6)に溜め、ポ
ンプ(7)にて次の膜式脱酸素装置(1)に送給する。
In the figure (1) is a membrane type oxygen deoxidizer, and the washing water supply line (4
) to remove dissolved oxygen in the cleaning water supplied to the cleaning tank (3) for electronic parts, etc. (dissolved oxygen concentration approximately 1p).
Pln and below). (5) is a water purifier that purifies raw water using, for example, a reverse osmosis membrane device, stores it in a tank (6), and sends it to the next membrane-type oxygen absorber (1) using a pump (7). do.

この膜式脱酸素装置で溶存酸素を除去した洗浄水は、洗
浄タンク(3)へ送られるが、この洗浄タンクは、酸素
の再溶存を防ぐために密閉型のものを用い、例えばN2
等の不活性ガスを該タンク内に充満させて外部からの(
雰囲気中の)酸素の混入を防止する。
The cleaning water from which dissolved oxygen has been removed by this membrane-type deoxidizer is sent to the cleaning tank (3), but this cleaning tank is of a closed type to prevent oxygen from re-dissolving; for example, N2
The tank is filled with inert gas such as (
Prevents oxygen from entering the atmosphere (in the atmosphere).

第2図に示す実施例では、洗浄タンク(3)に循環ライ
ン(8)を設け、この循環ラインに循環ポンプ(9)及
び膜式脱酸素装置(1)を挿入して、洗浄タンク内の洗
浄水の溶存酸素量を常に一定値以下に保持するようにし
ている。
In the embodiment shown in FIG. 2, a circulation line (8) is provided in the cleaning tank (3), and a circulation pump (9) and a membrane type oxygen deoxidizer (1) are inserted into this circulation line, so that the inside of the cleaning tank is The amount of dissolved oxygen in the cleaning water is always kept below a certain value.

第3図に腹式脱気装置(1)の−例を示すが、同図にお
いて、(2)は中空糸状気体透過膜を用いた脱酸素膜で
、該脱酸素膜の外周を水封式真空ポンプ00)にて真空
状態にし、膜中を流れる原水の溶存気体を護膜を通じて
除去するようにしたものである。
Figure 3 shows an example of an abdominal deaerator (1). In the same figure, (2) is a deoxidizing membrane using a hollow fiber gas permeable membrane, and the outer periphery of the deoxidizing membrane is sealed with water. A vacuum state is created using a vacuum pump 00), and dissolved gases in the raw water flowing through the membrane are removed through the protective membrane.

θDは減圧弁、面は定流量弁、03)、 Q4)は電磁
弁である。05)はフロースイッチであって、このスイ
ッチは、その出力信号により、前記水封式真空ポンプ0
0)の稼働及び電磁弁03)、 04)の開閉を制御す
るように働(。即ち、該装置内を原水が流れると、フロ
ースイッチが作動して、真空ポンプをONにするととも
に、2つの電磁弁が開状態になる。
θD is a pressure reducing valve, surface is a constant flow valve, and 03) and Q4) are solenoid valves. 05) is a flow switch, and this switch uses its output signal to control the water ring type vacuum pump 0.
0) and the opening and closing of solenoid valves 03) and 04) (i.e., when raw water flows through the device, the flow switch is activated, turns on the vacuum pump, and turns on the two solenoid valves 03) and 04). The solenoid valve becomes open.

〔発明の効果〕〔Effect of the invention〕

この発明は、以上のような構成であり、洗浄水中の溶存
酸素濃度を約1 ppm以下とすることにより、洗浄行
程における電子部品の酸化・腐食を防止することができ
る。腐食抑制剤を用いないので、その管理の手間を省略
し、安全で低コストの洗浄方法を提供するとともに、腐
食抑制剤の製品への付着、洗浄液への金属イオンの流出
等の心配もない。しかも、膜式脱酸素装置を用いること
により、システム構成も簡略で低コストのものになり、
常温下で連続処理が可能である。
The present invention has the above configuration, and by controlling the dissolved oxygen concentration in the cleaning water to about 1 ppm or less, it is possible to prevent oxidation and corrosion of electronic components during the cleaning process. Since no corrosion inhibitor is used, the trouble of managing the corrosion inhibitor is omitted, providing a safe and low-cost cleaning method, and there is no need to worry about the corrosion inhibitor adhering to the product or metal ions leaking into the cleaning solution. Moreover, by using a membrane-type oxygen absorber, the system configuration is simple and low cost.
Continuous processing is possible at room temperature.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例を示す系統図、第2図はこ
の発明の別の実施例を示す系統図、第3図はこの発明に
おける膜式脱酸素装置の一実施例を示す系統図である。 (])・・・膜腹膜酸素装置  (2)・・・脱酸素膜
(3)・・・洗浄タンク 第1図 j112  図
Fig. 1 is a system diagram showing one embodiment of the present invention, Fig. 2 is a system diagram showing another embodiment of the invention, and Fig. 3 is a system diagram showing an embodiment of the membrane type oxygen removing device in this invention. It is a diagram. (])...Membrane peritoneal oxygen device (2)...Oxygen removal membrane (3)...Washing tank Fig. 1 j112

Claims (1)

【特許請求の範囲】[Claims]  原水を膜式脱酸素装置(1)に導入し、脱酸素膜(2
)を介して真空脱気することにより、溶存酸素濃度が約
1ppm以下の脱酸素水とし、これを電子部品の洗浄タ
ンク(3)に連続的に供給することを特徴とする電子部
品の洗浄方法。
The raw water is introduced into the membrane type oxygen absorber (1), and the oxygen absorbing membrane (2
) to obtain deoxygenated water with a dissolved oxygen concentration of approximately 1 ppm or less, and continuously supplying this to an electronic component cleaning tank (3). .
JP14485090A 1990-06-01 1990-06-01 Cleaning method for electronic component Pending JPH0440270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14485090A JPH0440270A (en) 1990-06-01 1990-06-01 Cleaning method for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14485090A JPH0440270A (en) 1990-06-01 1990-06-01 Cleaning method for electronic component

Publications (1)

Publication Number Publication Date
JPH0440270A true JPH0440270A (en) 1992-02-10

Family

ID=15371872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14485090A Pending JPH0440270A (en) 1990-06-01 1990-06-01 Cleaning method for electronic component

Country Status (1)

Country Link
JP (1) JPH0440270A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333629A (en) * 1992-03-10 1994-08-02 Minebea Co., Ltd. Apparatus for cleaning metal articles
WO1996017503A1 (en) * 1994-12-01 1996-06-06 Ibiden Co., Ltd. Multilayer printed wiring board and process for producing the same
US5795494A (en) * 1994-12-19 1998-08-18 Fujitsu Limited Semiconductor substrate cleaning method and semiconductor device fabrication method
GB2339071A (en) * 1998-06-29 2000-01-12 Speedfam Corp Apparatus and method for immersion cleaning of a workpiece
JP2000265945A (en) * 1998-11-10 2000-09-26 Uct Kk Chemical supplying pump, chemical supplying device, chemical supplying system, substrate cleaning device, chemical supplying method, and substrate cleaning method
US6471783B1 (en) 1998-05-20 2002-10-29 Tdk Corporation Production method of electronic parts and water treatment apparatus
EP1310988A1 (en) * 2000-06-23 2003-05-14 Fujitsu Limited Semiconductor device and method of manufacture thereof
JP2007149818A (en) * 2005-11-25 2007-06-14 Showa Denko Kk Solder substrate processing jig, and bonding method of solder powder to electronic circuit board
JP2007264529A (en) * 2006-03-30 2007-10-11 Nippon Seiki Co Ltd Display device
JP2008041867A (en) * 2006-08-04 2008-02-21 Showa Denko Kk Manufacturing method of soldered circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143483A (en) * 1977-05-17 1978-12-13 Eisai Co Ltd Device for filling gas and attaching plug
JPS61115880A (en) * 1984-11-06 1986-06-03 アンホイザ−、ブツシユ、インコ−ポレ−テツド Method of filling vessel with liquid
JPS6437398A (en) * 1987-07-31 1989-02-08 Mitsubishi Heavy Ind Ltd Method of filling liquid
JPH02107317A (en) * 1988-10-14 1990-04-19 Dainippon Ink & Chem Inc Gas-liquid contacting apparatus of porous hollow fiber membrane type

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143483A (en) * 1977-05-17 1978-12-13 Eisai Co Ltd Device for filling gas and attaching plug
JPS61115880A (en) * 1984-11-06 1986-06-03 アンホイザ−、ブツシユ、インコ−ポレ−テツド Method of filling vessel with liquid
JPS6437398A (en) * 1987-07-31 1989-02-08 Mitsubishi Heavy Ind Ltd Method of filling liquid
JPH02107317A (en) * 1988-10-14 1990-04-19 Dainippon Ink & Chem Inc Gas-liquid contacting apparatus of porous hollow fiber membrane type

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333629A (en) * 1992-03-10 1994-08-02 Minebea Co., Ltd. Apparatus for cleaning metal articles
WO1996017503A1 (en) * 1994-12-01 1996-06-06 Ibiden Co., Ltd. Multilayer printed wiring board and process for producing the same
US5827604A (en) * 1994-12-01 1998-10-27 Ibiden Co., Ltd. Multilayer printed circuit board and method of producing the same
US5795494A (en) * 1994-12-19 1998-08-18 Fujitsu Limited Semiconductor substrate cleaning method and semiconductor device fabrication method
US6471783B1 (en) 1998-05-20 2002-10-29 Tdk Corporation Production method of electronic parts and water treatment apparatus
US6749183B2 (en) * 1998-05-20 2004-06-15 Tdk Corporation Production method of electronic parts and water treatment apparatus
EP0959491A3 (en) * 1998-05-20 2005-05-11 TDK Corporation Production method of electronic parts and water treatment apparatus
GB2339071A (en) * 1998-06-29 2000-01-12 Speedfam Corp Apparatus and method for immersion cleaning of a workpiece
JP2000265945A (en) * 1998-11-10 2000-09-26 Uct Kk Chemical supplying pump, chemical supplying device, chemical supplying system, substrate cleaning device, chemical supplying method, and substrate cleaning method
EP1310988A1 (en) * 2000-06-23 2003-05-14 Fujitsu Limited Semiconductor device and method of manufacture thereof
US6943115B2 (en) 2000-06-23 2005-09-13 Fujitsu Limited Semiconductor device and method of manufacture thereof
EP1310988A4 (en) * 2000-06-23 2007-04-18 Fujitsu Ltd Semiconductor device and method of manufacture thereof
JP2007149818A (en) * 2005-11-25 2007-06-14 Showa Denko Kk Solder substrate processing jig, and bonding method of solder powder to electronic circuit board
JP2007264529A (en) * 2006-03-30 2007-10-11 Nippon Seiki Co Ltd Display device
JP2008041867A (en) * 2006-08-04 2008-02-21 Showa Denko Kk Manufacturing method of soldered circuit board

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