JPH0440270A - Cleaning method for electronic component - Google Patents
Cleaning method for electronic componentInfo
- Publication number
- JPH0440270A JPH0440270A JP14485090A JP14485090A JPH0440270A JP H0440270 A JPH0440270 A JP H0440270A JP 14485090 A JP14485090 A JP 14485090A JP 14485090 A JP14485090 A JP 14485090A JP H0440270 A JPH0440270 A JP H0440270A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- water
- tank
- oxygen
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000001301 oxygen Substances 0.000 claims abstract description 26
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 26
- 239000012528 membrane Substances 0.000 claims abstract description 18
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000011261 inert gas Substances 0.000 abstract description 2
- 238000001223 reverse osmosis Methods 0.000 abstract description 2
- 230000003635 deoxygenating effect Effects 0.000 abstract 3
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000003187 abdominal effect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、IC基盤、太陽電池及びその他の電子部品
等の洗浄方法に係るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for cleaning IC boards, solar cells, other electronic components, etc.
周知のように、電子部品の洗浄には、フロン或いは純水
などが一般に用いられているが、フロンは、地球環境の
保護の為に全世界的にその使用が禁止されつつある。一
方、純水を用いる場合には、溶存酸素の影響による電子
部品の酸化、腐食の問題があり、腐食を防止する為に、
インヒビターいわゆる腐食抑制剤を投入するようにして
いるが、インヒビクーを使用すると公害防止の為の大が
かりな処理設備を必要とし、その他、インヒビターの製
品への付着、洗浄液への金属イオンの流出等の問題があ
る。As is well known, fluorocarbons or pure water are generally used to clean electronic parts, but the use of fluorocarbons is being banned worldwide to protect the global environment. On the other hand, when using pure water, there are problems with oxidation and corrosion of electronic components due to the influence of dissolved oxygen.
We try to use inhibitors, so-called corrosion inhibitors, but using inhibitors requires large-scale processing equipment to prevent pollution, and there are other problems such as the inhibitors adhering to products and metal ions leaking into the cleaning solution. There is.
[課題を解決するための手段]
この発明は、上述の課題に鑑み、安全で且つ低コストの
洗浄方法を提供しようとするもので、具体的には、原水
を膜式脱酸素装置に導入し、脱酸素膜を介じて真空脱気
することにより、溶存酸素濃度が約lppm以下の脱酸
素水とし、これを電子部品の洗浄タンクに連続的に供給
することを特徴としている。[Means for Solving the Problems] In view of the above-mentioned problems, the present invention aims to provide a safe and low-cost cleaning method. The method is characterized in that deoxygenated water with a dissolved oxygen concentration of about 1 ppm or less is produced by vacuum degassing through an oxygen-depleting membrane, and this water is continuously supplied to a tank for cleaning electronic parts.
[作用]
上述の構成によれば、膜式脱酸素装置により溶存酸素濃
度を1 ppm以下とした脱酸素水を電子部品の洗浄水
として用いることにより、公害などの危険もなく安全で
、しかも大がかりな設備を必要とせず簡略で且つ低コス
トのシステムによる電子部品の洗浄を実現することがで
きる。[Function] According to the above configuration, by using deoxygenated water with a dissolved oxygen concentration of 1 ppm or less by a membrane-type oxygen absorbing device as cleaning water for electronic parts, it is safe without any risk of pollution, and moreover, it is easy to clean on a large scale. Electronic components can be cleaned using a simple and low-cost system that does not require special equipment.
以下、この発明の好ましい実施例を、図面に基づいて説
明する。Preferred embodiments of the present invention will be described below with reference to the drawings.
図中(1)は膜式脱酸素装置で、洗浄水供給ライン(4
)に挿入し、電子部品等の洗浄タンク(3)へ供給する
洗浄水中の溶存酸素を除去する(溶存酸素濃度約1 p
Pln以下)。(5)は純水装置で、例えば逆浸透膜装
置等を用いて原水を純水化し、タンク(6)に溜め、ポ
ンプ(7)にて次の膜式脱酸素装置(1)に送給する。In the figure (1) is a membrane type oxygen deoxidizer, and the washing water supply line (4
) to remove dissolved oxygen in the cleaning water supplied to the cleaning tank (3) for electronic parts, etc. (dissolved oxygen concentration approximately 1p).
Pln and below). (5) is a water purifier that purifies raw water using, for example, a reverse osmosis membrane device, stores it in a tank (6), and sends it to the next membrane-type oxygen absorber (1) using a pump (7). do.
この膜式脱酸素装置で溶存酸素を除去した洗浄水は、洗
浄タンク(3)へ送られるが、この洗浄タンクは、酸素
の再溶存を防ぐために密閉型のものを用い、例えばN2
等の不活性ガスを該タンク内に充満させて外部からの(
雰囲気中の)酸素の混入を防止する。The cleaning water from which dissolved oxygen has been removed by this membrane-type deoxidizer is sent to the cleaning tank (3), but this cleaning tank is of a closed type to prevent oxygen from re-dissolving; for example, N2
The tank is filled with inert gas such as (
Prevents oxygen from entering the atmosphere (in the atmosphere).
第2図に示す実施例では、洗浄タンク(3)に循環ライ
ン(8)を設け、この循環ラインに循環ポンプ(9)及
び膜式脱酸素装置(1)を挿入して、洗浄タンク内の洗
浄水の溶存酸素量を常に一定値以下に保持するようにし
ている。In the embodiment shown in FIG. 2, a circulation line (8) is provided in the cleaning tank (3), and a circulation pump (9) and a membrane type oxygen deoxidizer (1) are inserted into this circulation line, so that the inside of the cleaning tank is The amount of dissolved oxygen in the cleaning water is always kept below a certain value.
第3図に腹式脱気装置(1)の−例を示すが、同図にお
いて、(2)は中空糸状気体透過膜を用いた脱酸素膜で
、該脱酸素膜の外周を水封式真空ポンプ00)にて真空
状態にし、膜中を流れる原水の溶存気体を護膜を通じて
除去するようにしたものである。Figure 3 shows an example of an abdominal deaerator (1). In the same figure, (2) is a deoxidizing membrane using a hollow fiber gas permeable membrane, and the outer periphery of the deoxidizing membrane is sealed with water. A vacuum state is created using a vacuum pump 00), and dissolved gases in the raw water flowing through the membrane are removed through the protective membrane.
θDは減圧弁、面は定流量弁、03)、 Q4)は電磁
弁である。05)はフロースイッチであって、このスイ
ッチは、その出力信号により、前記水封式真空ポンプ0
0)の稼働及び電磁弁03)、 04)の開閉を制御す
るように働(。即ち、該装置内を原水が流れると、フロ
ースイッチが作動して、真空ポンプをONにするととも
に、2つの電磁弁が開状態になる。θD is a pressure reducing valve, surface is a constant flow valve, and 03) and Q4) are solenoid valves. 05) is a flow switch, and this switch uses its output signal to control the water ring type vacuum pump 0.
0) and the opening and closing of solenoid valves 03) and 04) (i.e., when raw water flows through the device, the flow switch is activated, turns on the vacuum pump, and turns on the two solenoid valves 03) and 04). The solenoid valve becomes open.
この発明は、以上のような構成であり、洗浄水中の溶存
酸素濃度を約1 ppm以下とすることにより、洗浄行
程における電子部品の酸化・腐食を防止することができ
る。腐食抑制剤を用いないので、その管理の手間を省略
し、安全で低コストの洗浄方法を提供するとともに、腐
食抑制剤の製品への付着、洗浄液への金属イオンの流出
等の心配もない。しかも、膜式脱酸素装置を用いること
により、システム構成も簡略で低コストのものになり、
常温下で連続処理が可能である。The present invention has the above configuration, and by controlling the dissolved oxygen concentration in the cleaning water to about 1 ppm or less, it is possible to prevent oxidation and corrosion of electronic components during the cleaning process. Since no corrosion inhibitor is used, the trouble of managing the corrosion inhibitor is omitted, providing a safe and low-cost cleaning method, and there is no need to worry about the corrosion inhibitor adhering to the product or metal ions leaking into the cleaning solution. Moreover, by using a membrane-type oxygen absorber, the system configuration is simple and low cost.
Continuous processing is possible at room temperature.
第1図はこの発明の一実施例を示す系統図、第2図はこ
の発明の別の実施例を示す系統図、第3図はこの発明に
おける膜式脱酸素装置の一実施例を示す系統図である。
(])・・・膜腹膜酸素装置 (2)・・・脱酸素膜
(3)・・・洗浄タンク
第1図
j112 図Fig. 1 is a system diagram showing one embodiment of the present invention, Fig. 2 is a system diagram showing another embodiment of the invention, and Fig. 3 is a system diagram showing an embodiment of the membrane type oxygen removing device in this invention. It is a diagram. (])...Membrane peritoneal oxygen device (2)...Oxygen removal membrane (3)...Washing tank Fig. 1 j112
Claims (1)
)を介して真空脱気することにより、溶存酸素濃度が約
1ppm以下の脱酸素水とし、これを電子部品の洗浄タ
ンク(3)に連続的に供給することを特徴とする電子部
品の洗浄方法。The raw water is introduced into the membrane type oxygen absorber (1), and the oxygen absorbing membrane (2
) to obtain deoxygenated water with a dissolved oxygen concentration of approximately 1 ppm or less, and continuously supplying this to an electronic component cleaning tank (3). .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14485090A JPH0440270A (en) | 1990-06-01 | 1990-06-01 | Cleaning method for electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14485090A JPH0440270A (en) | 1990-06-01 | 1990-06-01 | Cleaning method for electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0440270A true JPH0440270A (en) | 1992-02-10 |
Family
ID=15371872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14485090A Pending JPH0440270A (en) | 1990-06-01 | 1990-06-01 | Cleaning method for electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440270A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5333629A (en) * | 1992-03-10 | 1994-08-02 | Minebea Co., Ltd. | Apparatus for cleaning metal articles |
WO1996017503A1 (en) * | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Multilayer printed wiring board and process for producing the same |
US5795494A (en) * | 1994-12-19 | 1998-08-18 | Fujitsu Limited | Semiconductor substrate cleaning method and semiconductor device fabrication method |
GB2339071A (en) * | 1998-06-29 | 2000-01-12 | Speedfam Corp | Apparatus and method for immersion cleaning of a workpiece |
JP2000265945A (en) * | 1998-11-10 | 2000-09-26 | Uct Kk | Chemical supplying pump, chemical supplying device, chemical supplying system, substrate cleaning device, chemical supplying method, and substrate cleaning method |
US6471783B1 (en) | 1998-05-20 | 2002-10-29 | Tdk Corporation | Production method of electronic parts and water treatment apparatus |
EP1310988A1 (en) * | 2000-06-23 | 2003-05-14 | Fujitsu Limited | Semiconductor device and method of manufacture thereof |
JP2007149818A (en) * | 2005-11-25 | 2007-06-14 | Showa Denko Kk | Solder substrate processing jig, and bonding method of solder powder to electronic circuit board |
JP2007264529A (en) * | 2006-03-30 | 2007-10-11 | Nippon Seiki Co Ltd | Display device |
JP2008041867A (en) * | 2006-08-04 | 2008-02-21 | Showa Denko Kk | Manufacturing method of soldered circuit board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53143483A (en) * | 1977-05-17 | 1978-12-13 | Eisai Co Ltd | Device for filling gas and attaching plug |
JPS61115880A (en) * | 1984-11-06 | 1986-06-03 | アンホイザ−、ブツシユ、インコ−ポレ−テツド | Method of filling vessel with liquid |
JPS6437398A (en) * | 1987-07-31 | 1989-02-08 | Mitsubishi Heavy Ind Ltd | Method of filling liquid |
JPH02107317A (en) * | 1988-10-14 | 1990-04-19 | Dainippon Ink & Chem Inc | Gas-liquid contacting apparatus of porous hollow fiber membrane type |
-
1990
- 1990-06-01 JP JP14485090A patent/JPH0440270A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53143483A (en) * | 1977-05-17 | 1978-12-13 | Eisai Co Ltd | Device for filling gas and attaching plug |
JPS61115880A (en) * | 1984-11-06 | 1986-06-03 | アンホイザ−、ブツシユ、インコ−ポレ−テツド | Method of filling vessel with liquid |
JPS6437398A (en) * | 1987-07-31 | 1989-02-08 | Mitsubishi Heavy Ind Ltd | Method of filling liquid |
JPH02107317A (en) * | 1988-10-14 | 1990-04-19 | Dainippon Ink & Chem Inc | Gas-liquid contacting apparatus of porous hollow fiber membrane type |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5333629A (en) * | 1992-03-10 | 1994-08-02 | Minebea Co., Ltd. | Apparatus for cleaning metal articles |
WO1996017503A1 (en) * | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Multilayer printed wiring board and process for producing the same |
US5827604A (en) * | 1994-12-01 | 1998-10-27 | Ibiden Co., Ltd. | Multilayer printed circuit board and method of producing the same |
US5795494A (en) * | 1994-12-19 | 1998-08-18 | Fujitsu Limited | Semiconductor substrate cleaning method and semiconductor device fabrication method |
US6471783B1 (en) | 1998-05-20 | 2002-10-29 | Tdk Corporation | Production method of electronic parts and water treatment apparatus |
US6749183B2 (en) * | 1998-05-20 | 2004-06-15 | Tdk Corporation | Production method of electronic parts and water treatment apparatus |
EP0959491A3 (en) * | 1998-05-20 | 2005-05-11 | TDK Corporation | Production method of electronic parts and water treatment apparatus |
GB2339071A (en) * | 1998-06-29 | 2000-01-12 | Speedfam Corp | Apparatus and method for immersion cleaning of a workpiece |
JP2000265945A (en) * | 1998-11-10 | 2000-09-26 | Uct Kk | Chemical supplying pump, chemical supplying device, chemical supplying system, substrate cleaning device, chemical supplying method, and substrate cleaning method |
EP1310988A1 (en) * | 2000-06-23 | 2003-05-14 | Fujitsu Limited | Semiconductor device and method of manufacture thereof |
US6943115B2 (en) | 2000-06-23 | 2005-09-13 | Fujitsu Limited | Semiconductor device and method of manufacture thereof |
EP1310988A4 (en) * | 2000-06-23 | 2007-04-18 | Fujitsu Ltd | Semiconductor device and method of manufacture thereof |
JP2007149818A (en) * | 2005-11-25 | 2007-06-14 | Showa Denko Kk | Solder substrate processing jig, and bonding method of solder powder to electronic circuit board |
JP2007264529A (en) * | 2006-03-30 | 2007-10-11 | Nippon Seiki Co Ltd | Display device |
JP2008041867A (en) * | 2006-08-04 | 2008-02-21 | Showa Denko Kk | Manufacturing method of soldered circuit board |
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