EP0959491A3 - Production method of electronic parts and water treatment apparatus - Google Patents

Production method of electronic parts and water treatment apparatus Download PDF

Info

Publication number
EP0959491A3
EP0959491A3 EP19990303881 EP99303881A EP0959491A3 EP 0959491 A3 EP0959491 A3 EP 0959491A3 EP 19990303881 EP19990303881 EP 19990303881 EP 99303881 A EP99303881 A EP 99303881A EP 0959491 A3 EP0959491 A3 EP 0959491A3
Authority
EP
European Patent Office
Prior art keywords
working
water
production method
electronic parts
water treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP19990303881
Other languages
German (de)
French (fr)
Other versions
EP0959491A2 (en
Inventor
Masashi Gotoh
Jitsuo Kanazawa
Syuichiro Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of EP0959491A2 publication Critical patent/EP0959491A2/en
Publication of EP0959491A3 publication Critical patent/EP0959491A3/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B5/00—Water
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/20—Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/12—Nature of the water, waste water, sewage or sludge to be treated from the silicate or ceramic industries, e.g. waste waters from cement or glass factories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Water Supply & Treatment (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Removal Of Specific Substances (AREA)
  • Dicing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Physical Water Treatments (AREA)

Abstract

A production method of an electronic part comprising a step of working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5 ≤ pH ≤ 6.5 and DO ≤ 0.5pH2 - 6.5pH + 22 [wherein DO represents a dissolved oxygen amount (unit ppm)].
By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.
EP19990303881 1998-05-20 1999-05-19 Production method of electronic parts and water treatment apparatus Ceased EP0959491A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15530198 1998-05-20
JP15530198A JP3533332B2 (en) 1998-05-20 1998-05-20 Electronic component manufacturing method and water treatment device

Publications (2)

Publication Number Publication Date
EP0959491A2 EP0959491A2 (en) 1999-11-24
EP0959491A3 true EP0959491A3 (en) 2005-05-11

Family

ID=15602915

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19990303881 Ceased EP0959491A3 (en) 1998-05-20 1999-05-19 Production method of electronic parts and water treatment apparatus

Country Status (3)

Country Link
US (2) US6471783B1 (en)
EP (1) EP0959491A3 (en)
JP (1) JP3533332B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1310988B1 (en) * 2000-06-23 2010-05-26 Fujitsu Limited Method of manufacturing a semiconductor element
US7253092B2 (en) 2003-06-24 2007-08-07 Nec Electronics America, Inc. Tungsten plug corrosion prevention method using water
US7052992B2 (en) 2003-10-28 2006-05-30 Nec Electronics America, Inc. Tungsten plug corrosion prevention method using ionized air
US6977215B2 (en) * 2003-10-28 2005-12-20 Nec Electronics America, Inc. Tungsten plug corrosion prevention method using gas sparged water
FR2901278B1 (en) * 2006-05-22 2008-07-04 Rhodia Recherches & Tech PROCESS FOR TREATING AN ARTICLE COMPRISING A PLASTIC MATERIAL COVERED WITH A SILICONE MATERIAL
US8448925B2 (en) * 2006-10-17 2013-05-28 Mks Instruments, Inc. Devices, systems, and methods for carbonation of deionized water
WO2008049001A2 (en) * 2006-10-17 2008-04-24 Mks Intruments, Inc. Devices, systems, and methods for carbonation of deionized water
JP5275585B2 (en) * 2007-06-18 2013-08-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Epitaxial silicon wafer manufacturing method
US9659796B2 (en) * 2008-07-24 2017-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Rinsing wafers using composition-tunable rinse water in chemical mechanical polish
JP6324659B2 (en) * 2013-02-08 2018-05-16 幸信 森 Hydrogen water production apparatus and hydrogen water production method
WO2016075534A2 (en) * 2014-11-13 2016-05-19 Wade Campbell Gas/liquid mixing apparatus
WO2018193825A1 (en) * 2017-04-17 2018-10-25 パナソニックＩｐマネジメント株式会社 Pyroelectric sensor element and pyroelectric sensor using same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB602899A (en) * 1944-10-12 1948-06-04 Solvay Improvements in process of degassing liquids
JPH0440270A (en) * 1990-06-01 1992-02-10 Miura Co Ltd Cleaning method for electronic component
US5398757A (en) * 1994-02-22 1995-03-21 K N Energy, Inc. Mono-well for soil sparging and soil vapor extraction
WO1998008248A1 (en) * 1996-08-20 1998-02-26 Organo Corporation Method and device for washing electronic parts member, or the like

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4259360A (en) * 1979-04-16 1981-03-31 Liquid Carbonic Corporation Deoxygenation of liquids
JPS55153332A (en) 1979-05-18 1980-11-29 Matsushita Electric Ind Co Ltd Manufacture of gallium arsenide semiconductor device
US4352682A (en) * 1980-11-13 1982-10-05 Fmc Corporation Deoxygenating apparatus
JPS587831A (en) 1981-07-07 1983-01-17 Sumitomo Shoji Kk Washing method for wafer by high pressured water and device thereof
FR2597003B1 (en) * 1986-04-15 1990-09-07 Air Liquide METHOD AND DEVICE FOR TREATING A FOOD LIQUID WITH A GAS
US4861352A (en) * 1987-12-30 1989-08-29 Union Carbide Corporation Method of separating a gas and/or particulate matter from a liquid
JPH0644098Y2 (en) * 1989-02-27 1994-11-14 黒谷 信子 Bubbler for cleaning semiconductor wafers
US5112357A (en) * 1990-10-05 1992-05-12 Universal Beverage Equipment, Inc. Deoxygenation system and method
US5175124A (en) * 1991-03-25 1992-12-29 Motorola, Inc. Process for fabricating a semiconductor device using re-ionized rinse water
US5336371A (en) * 1993-03-18 1994-08-09 At&T Bell Laboratories Semiconductor wafer cleaning and rinsing techniques using re-ionized water and tank overflow
EP0646400B1 (en) * 1993-04-14 2001-07-18 Nippon Sanso Corporation Dissolved oxygen reducing apparatus
JPH09307155A (en) 1996-05-16 1997-11-28 Matsushita Electric Ind Co Ltd Manufacture of piezoelectric component
US5849091A (en) * 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB602899A (en) * 1944-10-12 1948-06-04 Solvay Improvements in process of degassing liquids
JPH0440270A (en) * 1990-06-01 1992-02-10 Miura Co Ltd Cleaning method for electronic component
US5398757A (en) * 1994-02-22 1995-03-21 K N Energy, Inc. Mono-well for soil sparging and soil vapor extraction
WO1998008248A1 (en) * 1996-08-20 1998-02-26 Organo Corporation Method and device for washing electronic parts member, or the like
US6290777B1 (en) * 1996-08-20 2001-09-18 Organo Corp. Method and device for washing electronic parts member, or the like

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 213 (C - 0942) 20 May 1992 (1992-05-20) *

Also Published As

Publication number Publication date
US6749183B2 (en) 2004-06-15
JP3533332B2 (en) 2004-05-31
US6471783B1 (en) 2002-10-29
JPH11330583A (en) 1999-11-30
EP0959491A2 (en) 1999-11-24
US20030006513A1 (en) 2003-01-09

Similar Documents

Publication Publication Date Title
EP0959491A3 (en) Production method of electronic parts and water treatment apparatus
EP1087648A3 (en) Multi-purpose finish for printed wiring boards and method of manufacture of such boards
EP0982765A3 (en) Cleaning method of semiconductor substrate
EP1043408A3 (en) Processes and apparatus for recovery and removal of copper from fluids
MXPA03000526A (en) Method and system of preventing fouling and corrosion of biomedical devices and structures.
EP1212149A4 (en) Soil and/or groundwater remediation process
EP0994415A3 (en) Apparatus and method for an install system for third party applications
EP0953949A3 (en) Apparatus and method of operating a retail terminal having a single-orientation base assembly and a multiple-orientation base assembly
DE59508025D1 (en) Tool for metal forming and machining devices and method for producing a coated tool
DE69511434D1 (en) PRODUCTION OF PRINTED CIRCUITS
ATE304786T1 (en) ELECTROLUMINescent DEVICE AND METHOD OF PRODUCTION
TWI318753B (en) Method and system for manufacturing an electrically conductive metal foil structure
EP1246514A3 (en) Circuit board and method for producing the same
DE602004015748D1 (en) SOLUTION FOR COATING COPPER SURFACES AND METHOD FOR DECOMPOSING ON COPPER SURFACES
WO1993013019A3 (en) Water-treatment and conditioning apparatus and method
CA2386940A1 (en) Process for reducing the concentration of dissolved metals and metalloids in an aqueous solution
ES2079246T3 (en) PROCEDURE FOR THE SEPARATION OF DISTURBING ELEMENTS OF VALUABLE METAL SOLUTIONS.
EP0777265A3 (en) Method and device for dissolving surface layer of semiconductor substrate
WO2000002168A3 (en) Electronic payment method
AU3724095A (en) Stainless steel acid treatment
EA200200653A1 (en) METHOD AND SYSTEM OF PROTECTION AGAINST CORROSION OF CONDUCTING CONSTRUCTIONS
ES2101127T3 (en) IMMOBILIZATION OF METALLIC RADIOACTIVE SUBSTANCES FROM A LIQUID MEDIUM TO A SOLID MEDIUM.
WO2000034985A3 (en) Method for structuring a metalliferous layer
EP1049191A3 (en) Procedure for the production of electronical elements with strip lines
EP0863117A3 (en) A process for forming a microstructure in a substrate of a ferroelectric single crystal

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

17P Request for examination filed

Effective date: 20051024

AKX Designation fees paid

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 20051208

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20101104