DE69500271T2 - Verfahren zur Herstellung eines Stanzmessers - Google Patents
Verfahren zur Herstellung eines StanzmessersInfo
- Publication number
- DE69500271T2 DE69500271T2 DE69500271T DE69500271T DE69500271T2 DE 69500271 T2 DE69500271 T2 DE 69500271T2 DE 69500271 T DE69500271 T DE 69500271T DE 69500271 T DE69500271 T DE 69500271T DE 69500271 T2 DE69500271 T2 DE 69500271T2
- Authority
- DE
- Germany
- Prior art keywords
- cutting edges
- cutting
- varying
- shapes
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
- B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
- B23P15/406—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools rotary or plane die cutters
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22354194A JP3477254B2 (ja) | 1994-09-19 | 1994-09-19 | 抜き型の製造方法および抜き型 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69500271D1 DE69500271D1 (de) | 1997-06-05 |
DE69500271T2 true DE69500271T2 (de) | 1997-08-14 |
Family
ID=16799783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69500271T Expired - Fee Related DE69500271T2 (de) | 1994-09-19 | 1995-09-18 | Verfahren zur Herstellung eines Stanzmessers |
Country Status (5)
Country | Link |
---|---|
US (1) | US5733465A (de) |
EP (1) | EP0702269B1 (de) |
JP (1) | JP3477254B2 (de) |
AT (1) | ATE152527T1 (de) |
DE (1) | DE69500271T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6223641B1 (en) * | 1996-11-12 | 2001-05-01 | Xynatech, Inc., | Perforating and slitting die sheet |
CA2433262C (en) * | 2000-12-28 | 2007-03-27 | Tsukatani Hamono Mfg. Co., Ltd. | Flexible die and method for its manufacture |
EP1427584A1 (de) * | 2001-08-15 | 2004-06-16 | Quickutz, Inc. | Prägevorrichtung, ihre komponenten und methoden |
US7469634B2 (en) * | 2004-02-03 | 2008-12-30 | Spellbinders Paper Arts Co. Llc | Apertured media embellishing template and system and method using same |
US8402889B2 (en) * | 2004-02-03 | 2013-03-26 | Spellbinders Paper Arts Company, Llc | Apertured media embellishing template and system and method using same |
JP4724209B2 (ja) * | 2008-07-09 | 2011-07-13 | 有限会社森下製版 | 抜型の製造方法 |
TW201102240A (en) * | 2009-07-07 | 2011-01-16 | Lai-Ju Cai | Method for directly forming knife mold through one-time etching and knife mold formed by such a method |
US20110107926A1 (en) * | 2009-11-09 | 2011-05-12 | Pma Photometals Of Arizona, Inc. | Non-Apertured Media Embossing Template |
WO2012067225A1 (ja) * | 2010-11-19 | 2012-05-24 | 凸版印刷株式会社 | 金属箔パターン積層体、金属箔の型抜き方法、回路基板、その製造方法、および太陽電池モジュール |
CN106480236B (zh) * | 2016-11-26 | 2022-03-01 | 胡挺 | 一种复合皮料冲切用刀模及冲切皮料的方法 |
CN112848497A (zh) * | 2019-11-26 | 2021-05-28 | 晋江市丰川包装有限公司 | 一种皮纸盒加工蚀刻生产工艺 |
US11602945B2 (en) | 2020-10-22 | 2023-03-14 | Yong Jia Chen | Multi-purpose acid-etched metallic stamps and dies |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB203993A (en) * | 1923-03-19 | 1923-09-20 | Charles Rivage | Process and apparatus for the production of paper and cards in imitation of hand-made paper and cards |
DE3047886A1 (de) * | 1979-12-20 | 1981-10-29 | The Fujikura Cable Works, Ltd., Tokyo | Verfahren zur herstellung eines stanzwerkzeugs und nach diesem verfahren hergestelltes stanzwerkzeug |
US4579634A (en) * | 1982-04-05 | 1986-04-01 | Jerobee Industries, Inc. | Die and method of making same |
US4437924A (en) * | 1982-04-19 | 1984-03-20 | Jerobee Industries, Inc. | Method of making fine-line die |
JP2677466B2 (ja) * | 1991-08-09 | 1997-11-17 | リンテック株式会社 | 抜き型の製造方法および抜き型 |
EP0620201A3 (de) * | 1993-04-12 | 1995-01-25 | Hughes Aircraft Co | Verfahren zur Herstellung von mikrooptischen Bauteilen. |
-
1994
- 1994-09-19 JP JP22354194A patent/JP3477254B2/ja not_active Expired - Fee Related
-
1995
- 1995-09-18 DE DE69500271T patent/DE69500271T2/de not_active Expired - Fee Related
- 1995-09-18 AT AT95306577T patent/ATE152527T1/de not_active IP Right Cessation
- 1995-09-18 EP EP95306577A patent/EP0702269B1/de not_active Expired - Lifetime
- 1995-09-18 US US08/529,432 patent/US5733465A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5733465A (en) | 1998-03-31 |
DE69500271D1 (de) | 1997-06-05 |
EP0702269A1 (de) | 1996-03-20 |
EP0702269B1 (de) | 1997-05-02 |
JPH0885099A (ja) | 1996-04-02 |
JP3477254B2 (ja) | 2003-12-10 |
ATE152527T1 (de) | 1997-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |