JPS6434697A - Stamping method - Google Patents

Stamping method

Info

Publication number
JPS6434697A
JPS6434697A JP18603087A JP18603087A JPS6434697A JP S6434697 A JPS6434697 A JP S6434697A JP 18603087 A JP18603087 A JP 18603087A JP 18603087 A JP18603087 A JP 18603087A JP S6434697 A JPS6434697 A JP S6434697A
Authority
JP
Japan
Prior art keywords
hole
positioning
punch
die
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18603087A
Other languages
Japanese (ja)
Inventor
Masanobu Ogasawara
Hidenori Nagaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP18603087A priority Critical patent/JPS6434697A/en
Publication of JPS6434697A publication Critical patent/JPS6434697A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a through hole of which a peripheral face is uniformly shaved, by pressing a positioning punch toward a positioning hole of a die at the punching, half die cutting a punching material, and pressing the half die cut part into the hole for positioning the punching material. CONSTITUTION: A punched hole 15b is formed on a printed wiring board 15 on a die plate 8 by pressing a punch 13 toward a die hole 8a of a die plate 8, and then the punched hole 15b is shaved by inserting the punch 13 into the punched hole 15 by a specific number of times. When the punching is to be performed by the punch 13, a positioning punch 13 is pressesd toward a positioning hole mounted on the die plate 8, for half die cutting of the printed wiring board 15. By pressing the half die cut part into the positioning hole, the printed wiring board 15 is positioned. By this positioning, the through hole of which a peripheral face is uniformly shaved, can be formed on the printed wiring board.
JP18603087A 1987-07-24 1987-07-24 Stamping method Pending JPS6434697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18603087A JPS6434697A (en) 1987-07-24 1987-07-24 Stamping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18603087A JPS6434697A (en) 1987-07-24 1987-07-24 Stamping method

Publications (1)

Publication Number Publication Date
JPS6434697A true JPS6434697A (en) 1989-02-06

Family

ID=16181166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18603087A Pending JPS6434697A (en) 1987-07-24 1987-07-24 Stamping method

Country Status (1)

Country Link
JP (1) JPS6434697A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05116100A (en) * 1991-06-17 1993-05-14 Mano Takashi Punching method for molding of rubber or the like
US6915828B2 (en) 2001-11-20 2005-07-12 Ngk Insulators, Ltd. Punch die for punching and laminating simultaneously

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05116100A (en) * 1991-06-17 1993-05-14 Mano Takashi Punching method for molding of rubber or the like
US6915828B2 (en) 2001-11-20 2005-07-12 Ngk Insulators, Ltd. Punch die for punching and laminating simultaneously

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