DE69500057T2 - Verfahren zum elektrischen Abscheiden von Resistformulierungen, die Metallsalze von Beta-Diketonen enthalten - Google Patents

Verfahren zum elektrischen Abscheiden von Resistformulierungen, die Metallsalze von Beta-Diketonen enthalten

Info

Publication number
DE69500057T2
DE69500057T2 DE69500057T DE69500057T DE69500057T2 DE 69500057 T2 DE69500057 T2 DE 69500057T2 DE 69500057 T DE69500057 T DE 69500057T DE 69500057 T DE69500057 T DE 69500057T DE 69500057 T2 DE69500057 T2 DE 69500057T2
Authority
DE
Germany
Prior art keywords
diketones
beta
metal salts
contain metal
electrical deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69500057T
Other languages
English (en)
Other versions
DE69500057D1 (de
Inventor
William L Hamilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69500057D1 publication Critical patent/DE69500057D1/de
Publication of DE69500057T2 publication Critical patent/DE69500057T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4484—Anodic paints
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69500057T 1994-03-04 1995-02-20 Verfahren zum elektrischen Abscheiden von Resistformulierungen, die Metallsalze von Beta-Diketonen enthalten Expired - Fee Related DE69500057T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/205,441 US5415749A (en) 1994-03-04 1994-03-04 Process for electrodeposition of resist formulations which contain metal salts of β-diketones

Publications (2)

Publication Number Publication Date
DE69500057D1 DE69500057D1 (de) 1996-11-14
DE69500057T2 true DE69500057T2 (de) 1997-03-06

Family

ID=22762203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500057T Expired - Fee Related DE69500057T2 (de) 1994-03-04 1995-02-20 Verfahren zum elektrischen Abscheiden von Resistformulierungen, die Metallsalze von Beta-Diketonen enthalten

Country Status (4)

Country Link
US (1) US5415749A (de)
EP (1) EP0672955B1 (de)
JP (1) JPH07258587A (de)
DE (1) DE69500057T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5744283A (en) * 1994-04-12 1998-04-28 U.S. Philips Corporation Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
JP3992173B2 (ja) * 1998-10-28 2007-10-17 日本パーカライジング株式会社 金属表面処理用組成物及び表面処理液ならびに表面処理方法
US6361833B1 (en) 1998-10-28 2002-03-26 Henkel Corporation Composition and process for treating metal surfaces
PT1144520E (pt) * 1998-12-10 2004-09-30 Du Pont Revestimento aquoso electrodepositado sua producao e uso
US6551756B1 (en) * 2000-07-24 2003-04-22 Napp Systems, Inc. Solvent-developable printing formulations with improved processing characteristics
JP5561192B2 (ja) * 2010-02-26 2014-07-30 信越化学工業株式会社 高分子化合物及びこれを用いた化学増幅ポジ型レジスト組成物並びにパターン形成方法
JP5505371B2 (ja) 2010-06-01 2014-05-28 信越化学工業株式会社 高分子化合物、化学増幅ポジ型レジスト材料、及びパターン形成方法
JP5278406B2 (ja) 2010-11-02 2013-09-04 信越化学工業株式会社 パターン形成方法
JP5601309B2 (ja) 2010-11-29 2014-10-08 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5708521B2 (ja) 2011-02-15 2015-04-30 信越化学工業株式会社 レジスト材料及びこれを用いたパターン形成方法
JP5708522B2 (ja) * 2011-02-15 2015-04-30 信越化学工業株式会社 レジスト材料及びこれを用いたパターン形成方法
JP5601286B2 (ja) * 2011-07-25 2014-10-08 信越化学工業株式会社 レジスト材料及びこれを用いたパターン形成方法
KR102202279B1 (ko) * 2015-03-20 2021-01-13 동우 화인켐 주식회사 착색 감광성 수지 조성물
CN110428939B (zh) * 2019-08-09 2020-06-30 常州大学 一种高导电石墨烯铜/铝复合导线的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455364A (en) * 1981-11-14 1984-06-19 Konishiroku Photo Industry Co., Ltd. Process for forming metallic image, composite material for the same
JPH0644150B2 (ja) * 1986-05-09 1994-06-08 関西ペイント株式会社 プリント配線フオトレジスト用電着塗料組成物
US4943513A (en) * 1988-10-07 1990-07-24 Morton Thiokol, Inc. Photoimageable composition with reduced cold flow due to salt-bridging by metal ions and dry film formed therefrom
JP2749646B2 (ja) * 1989-07-12 1998-05-13 関西ペイント株式会社 ポジ型感光性電着塗料組成物及びそれを用いた回路板の製造方法

Also Published As

Publication number Publication date
EP0672955A1 (de) 1995-09-20
EP0672955B1 (de) 1996-10-09
JPH07258587A (ja) 1995-10-09
US5415749A (en) 1995-05-16
DE69500057D1 (de) 1996-11-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee