DE69423837D1 - Taktversorgunsystem - Google Patents

Taktversorgunsystem

Info

Publication number
DE69423837D1
DE69423837D1 DE69423837T DE69423837T DE69423837D1 DE 69423837 D1 DE69423837 D1 DE 69423837D1 DE 69423837 T DE69423837 T DE 69423837T DE 69423837 T DE69423837 T DE 69423837T DE 69423837 D1 DE69423837 D1 DE 69423837D1
Authority
DE
Germany
Prior art keywords
supply system
clock supply
clock
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69423837T
Other languages
English (en)
Other versions
DE69423837T2 (de
Inventor
Kazushige Ichinose
Masayuki Kikushima
Tooru Shirotori
Mikio Shigemori
Hideo Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69423837D1 publication Critical patent/DE69423837D1/de
Application granted granted Critical
Publication of DE69423837T2 publication Critical patent/DE69423837T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
    • G06F1/08—Clock generators with changeable or programmable clock frequency
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12035—Zener diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
DE69423837T 1993-09-29 1994-07-15 Taktversorgungssystem Expired - Lifetime DE69423837T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24279093 1993-09-29
JP26017393 1993-10-18
JP592694 1994-01-24

Publications (2)

Publication Number Publication Date
DE69423837D1 true DE69423837D1 (de) 2000-05-11
DE69423837T2 DE69423837T2 (de) 2000-10-12

Family

ID=27276955

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69423837T Expired - Lifetime DE69423837T2 (de) 1993-09-29 1994-07-15 Taktversorgungssystem

Country Status (3)

Country Link
US (1) US5696950A (de)
EP (1) EP0645689B1 (de)
DE (1) DE69423837T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5668594A (en) * 1995-01-03 1997-09-16 Intel Corporation Method and apparatus for aligning and synchronizing a remote video signal and a local video signal
JPH0993126A (ja) * 1995-09-28 1997-04-04 Nec Corp クロック発生器
US5942951A (en) * 1997-03-11 1999-08-24 Stmicroelectronics, Inc. Method and apparatus for reducing a noise differential in an electronic circuit
US6385735B1 (en) * 1997-12-15 2002-05-07 Intel Corporation Method and apparatus for limiting processor clock frequency
US6473852B1 (en) * 1998-10-30 2002-10-29 Fairchild Semiconductor Corporation Method and circuit for performing automatic power on reset of an integrated circuit
CH692534A5 (fr) * 1998-11-05 2002-07-15 Em Microelectronic Marin Sa Procédé d'ajustement de la marche d'un module horloger au moyen de fusibles destructibles par laser.
EP0999483B1 (de) 1998-11-05 2009-01-21 EM Microelectronic-Marin SA Verfahren zum Einstellen des Takts eines Uhrenmoduls mittels Schmelzen von Schmelzsicherungen per Laser
JP2000165905A (ja) * 1998-11-27 2000-06-16 Mitsubishi Electric Corp クロック発生回路
US6434726B1 (en) 1999-06-29 2002-08-13 Lucent Technologies Inc. System and method of transmission using coplanar bond wires
US6535988B1 (en) 1999-09-29 2003-03-18 Intel Corporation System for detecting over-clocking uses a reference signal thereafter preventing over-clocking by reducing clock rate
US6671500B2 (en) * 2001-03-30 2003-12-30 Skyworks Solutions, Inc. Frequency plan
US6791380B2 (en) * 2001-11-27 2004-09-14 Winbond Electronics Corporation Universal clock generator
KR100440569B1 (ko) * 2001-12-20 2004-07-21 한국전자통신연구원 다중 밴드 모뎀의 클럭 분배장치
US7114086B2 (en) 2002-01-04 2006-09-26 Ati Technologies, Inc. System for reduced power consumption by monitoring instruction buffer and method thereof
DE10255355A1 (de) * 2002-11-27 2004-06-24 Infineon Technologies Ag Verfahren zur automatischen Erkennung der Taktfrequenz eines Systemtaktes für die Konfiguration einer Peripherie-Einrichtung
US20040153894A1 (en) * 2003-01-21 2004-08-05 Zarlink Semiconductor Inc. Method of measuring the accuracy of a clock signal
US6975154B1 (en) * 2003-04-29 2005-12-13 Altera Corporation Reduced power consumption clock network
US7528638B2 (en) * 2003-12-22 2009-05-05 Micron Technology, Inc. Clock signal distribution with reduced parasitic loading effects
JP4426888B2 (ja) * 2004-03-30 2010-03-03 パイオニア株式会社 制御装置、電子機器及び信号処理装置
US8220031B2 (en) * 2007-05-01 2012-07-10 Texas Instruments Incorporated Secure time/date virtualization
JP2009037456A (ja) * 2007-08-02 2009-02-19 Nec Electronics Corp マイクロコントローラおよびその制御方法
JP4655134B2 (ja) * 2008-09-30 2011-03-23 ブラザー工業株式会社 液滴噴射装置
RU2485241C1 (ru) * 2011-12-05 2013-06-20 Дахир Курманбиевич Семенов Многофункциональный самоходный дорожный агрегат, дорожная плита и скоростной способ строительства дороги
US9223365B2 (en) 2013-03-16 2015-12-29 Intel Corporation Method and apparatus for controlled reset sequences without parallel fuses and PLL'S
TWI587295B (zh) * 2015-06-26 2017-06-11 英業達股份有限公司 硬碟重置裝置
CN109286448B (zh) * 2018-09-28 2021-02-26 天津市英贝特航天科技有限公司 一种基于usb的标频信号产生系统及方法
TWI722831B (zh) * 2020-03-16 2021-03-21 奇景光電股份有限公司 振盪電路及自我啟動控制電路
CN112924850B (zh) * 2021-01-27 2024-09-06 胜达克半导体科技(上海)股份有限公司 一种应用于自动测试机的soc芯片并行测试切换方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL163338C (nl) * 1972-03-25 1980-08-15 Philips Nv Elektronische schakeling.
US4013902A (en) * 1975-08-06 1977-03-22 Honeywell Inc. Initial reset signal generator and low voltage detector
US4296338A (en) * 1979-05-01 1981-10-20 Motorola, Inc. Power on and low voltage reset circuit
WO1982004345A1 (en) * 1981-05-27 1982-12-09 Aswell Cecil James Power supply control for integrated circuit
JPS6020223A (ja) * 1983-07-15 1985-02-01 Hitachi Ltd Ｃｍｏｓ半導体集積回路装置
US4893271A (en) * 1983-11-07 1990-01-09 Motorola, Inc. Synthesized clock microcomputer with power saving
US4617473A (en) * 1984-01-03 1986-10-14 Intersil, Inc. CMOS backup power switching circuit
JPS62106524A (ja) * 1985-11-01 1987-05-18 Clarion Co Ltd 車載用の機器のマイクロコンピユ−タリセツト回路
US4803702A (en) * 1986-08-05 1989-02-07 Advanced Micro Devices, Inc. Reset and synchronization interface circuit
US5133064A (en) * 1987-04-27 1992-07-21 Hitachi, Ltd. Data processing system generating clock signal from an input clock, phase locked to the input clock and used for clocking logic devices
US5261082A (en) * 1987-11-20 1993-11-09 Hitachi, Ltd. Semiconductor integrated circuit having a plurality of oscillation circuits
US5123107A (en) * 1989-06-20 1992-06-16 Mensch Jr William D Topography of CMOS microcomputer integrated circuit chip including core processor and memory, priority, and I/O interface circuitry coupled thereto
JPH0359790A (ja) * 1989-07-28 1991-03-14 Seikosha Co Ltd 電気機器の電力制御装置
JP2719226B2 (ja) * 1990-10-01 1998-02-25 株式会社日立製作所 情報処理システム
US5095280A (en) * 1990-11-26 1992-03-10 Integrated Circuit Systems, Inc. Dual dot clock signal generator
GB9109445D0 (en) * 1991-05-01 1991-06-26 Ncr Co A circuit for glitch-free switching of asynchronous clock sources
US5159217A (en) * 1991-07-29 1992-10-27 National Semiconductor Corporation Brownout and power-up reset signal generator
US5267189A (en) * 1991-09-30 1993-11-30 Wilke William G Rational fraction synthesizer
JPH05304467A (ja) * 1992-04-24 1993-11-16 Ricoh Co Ltd 発振回路
US5481573A (en) * 1992-06-26 1996-01-02 International Business Machines Corporation Synchronous clock distribution system
JP3036290B2 (ja) * 1993-04-08 2000-04-24 日本電気株式会社 パワー・オン・リセット回路

Also Published As

Publication number Publication date
EP0645689A2 (de) 1995-03-29
EP0645689B1 (de) 2000-04-05
DE69423837T2 (de) 2000-10-12
US5696950A (en) 1997-12-09
EP0645689A3 (de) 1996-02-28

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