DE69423255T2 - Lead-free soft solder with improved mechanical properties. - Google Patents

Lead-free soft solder with improved mechanical properties.

Info

Publication number
DE69423255T2
DE69423255T2 DE69423255T DE69423255T DE69423255T2 DE 69423255 T2 DE69423255 T2 DE 69423255T2 DE 69423255 T DE69423255 T DE 69423255T DE 69423255 T DE69423255 T DE 69423255T DE 69423255 T2 DE69423255 T2 DE 69423255T2
Authority
DE
Germany
Prior art keywords
lead
mechanical properties
improved mechanical
soft solder
free soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69423255T
Other languages
German (de)
Other versions
DE69423255D1 (en
Inventor
Ho Sou Chen
Sungho Jin
Mark Thomas Mccormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69423255D1 publication Critical patent/DE69423255D1/en
Publication of DE69423255T2 publication Critical patent/DE69423255T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
DE69423255T 1993-04-30 1994-04-20 Lead-free soft solder with improved mechanical properties. Expired - Lifetime DE69423255T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5549593A 1993-04-30 1993-04-30

Publications (2)

Publication Number Publication Date
DE69423255D1 DE69423255D1 (en) 2000-04-13
DE69423255T2 true DE69423255T2 (en) 2000-08-31

Family

ID=21998229

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69423255T Expired - Lifetime DE69423255T2 (en) 1993-04-30 1994-04-20 Lead-free soft solder with improved mechanical properties.

Country Status (6)

Country Link
US (1) US5538686A (en)
EP (1) EP0622151B1 (en)
JP (1) JP3221640B2 (en)
KR (1) KR100346606B1 (en)
DE (1) DE69423255T2 (en)
TW (1) TW251249B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012223270B4 (en) 2012-08-13 2021-11-25 Heesung Material Ltd. Use of a lead-free solder composition for glass

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Publication number Priority date Publication date Assignee Title
DE69524912T2 (en) * 1994-09-30 2002-08-22 At & T Corp Lead-free alloys for soft soldering
KR0158600B1 (en) * 1995-06-30 1999-01-15 이형도 The solder for pb-free
KR0168964B1 (en) * 1995-06-30 1999-01-15 이형도 Pb free solder
JPH0994687A (en) * 1995-09-29 1997-04-08 Senju Metal Ind Co Ltd Lead-free solder alloy
US5730932A (en) * 1996-03-06 1998-03-24 International Business Machines Corporation Lead-free, tin-based multi-component solder alloys
KR980006783A (en) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 Low cost phase locked motor control method and structure
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
JP3688429B2 (en) 1997-04-25 2005-08-31 株式会社東芝 Electronic component mounting substrate and electronic component mounting substrate
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
US20020046627A1 (en) * 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
US6176947B1 (en) 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
KR100374173B1 (en) * 1999-06-29 2003-03-03 김성진 Pb free solder reduced oxidation of Zn in Sn-Zn system
JP3753168B2 (en) * 1999-08-20 2006-03-08 千住金属工業株式会社 Solder paste for joining microchip components
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP2002359459A (en) * 2001-06-01 2002-12-13 Nec Corp Electronic component mounting method, printed wiring board, and mounting structure
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
JP2003234433A (en) 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd Semiconductor device, its mounting method, mounting block and its manufacturing method
CN1254347C (en) * 2002-01-21 2006-05-03 富士通株式会社 Solder alloy and soldered joint
DE60239569D1 (en) * 2002-01-21 2011-05-05 Fujitsu Ltd Electrical or electronic device with a solder connection
US7357291B2 (en) * 2002-01-30 2008-04-15 Showa Denko K.K. Solder metal, soldering flux and solder paste
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
CN1445049A (en) * 2002-03-19 2003-10-01 日本胜利株式会社 Soldering tin paste, welding finished product and welding method
JP2003275892A (en) * 2002-03-20 2003-09-30 Tamura Kaken Co Ltd Lead-free solder alloy and solder paste composition
JP3991788B2 (en) * 2002-07-04 2007-10-17 日本電気株式会社 Solder and mounted product using it
JP4337326B2 (en) 2002-10-31 2009-09-30 千住金属工業株式会社 Lead-free solder and soldered articles
JP2004241542A (en) * 2003-02-05 2004-08-26 Matsushita Electric Ind Co Ltd Soldering method, and component and bond structure bonded thereby
US20040187976A1 (en) 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US20050029675A1 (en) * 2003-03-31 2005-02-10 Fay Hua Tin/indium lead-free solders for low stress chip attachment
DE10319888A1 (en) * 2003-04-25 2004-11-25 Siemens Ag Solder material based on SnAgCu
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
EP1749616A1 (en) * 2005-08-05 2007-02-07 Grillo-Werke AG Process for arc or beam soldering or welding of workpieces from same or different metal or metallic aloys using a Sn-Basis alloy filler; Wire of Tin-basis alloy
EP2183076A1 (en) * 2007-07-23 2010-05-12 Henkel Limited Solder flux
JP5806304B2 (en) * 2011-05-31 2015-11-10 京セラ株式会社 Solar cell and method for manufacturing the same
GB2505030B (en) * 2012-08-13 2015-07-29 Hyundai Motor Co Ltd Lead-free solder composition for glass
TWI612025B (en) * 2015-09-23 2018-01-21 住華科技股份有限公司 Solder for fabricating sputtering target and applying method thereof
CN112077477A (en) * 2020-09-10 2020-12-15 哈尔滨理工大学 High-stability low-melting-point fiber material and preparation method thereof
CN113084391A (en) * 2021-04-12 2021-07-09 哈尔滨理工大学 Low-melting-point green flexible 3D packaging alloy
CN114346520A (en) * 2021-11-23 2022-04-15 西安理工大学 Sn-Zn-Bi-In lead-free solder and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH80998A (en) * 1918-08-09 1920-01-02 Gustave Ferriere Welding for aluminum
DE806820C (en) * 1949-10-25 1951-06-18 Rau Fa G Soft solder
DE3771522D1 (en) * 1986-02-19 1991-08-29 Degussa USE OF A SOFT SOLDER ALLOY TO CONNECT CERAMIC PARTS.
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
JPH02197396A (en) * 1989-01-24 1990-08-03 Mitsubishi Cable Ind Ltd Method for repairing weld defect part of welded aluminum pipe
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012223270B4 (en) 2012-08-13 2021-11-25 Heesung Material Ltd. Use of a lead-free solder composition for glass

Also Published As

Publication number Publication date
EP0622151A1 (en) 1994-11-02
JPH06344181A (en) 1994-12-20
JP3221640B2 (en) 2001-10-22
DE69423255D1 (en) 2000-04-13
TW251249B (en) 1995-07-11
EP0622151B1 (en) 2000-03-08
KR100346606B1 (en) 2002-12-11
US5538686A (en) 1996-07-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition