GB2505030B - Lead-free solder composition for glass - Google Patents
Lead-free solder composition for glassInfo
- Publication number
- GB2505030B GB2505030B GB1308069.2A GB201308069A GB2505030B GB 2505030 B GB2505030 B GB 2505030B GB 201308069 A GB201308069 A GB 201308069A GB 2505030 B GB2505030 B GB 2505030B
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass
- lead
- free solder
- solder composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120008817 | 2012-08-13 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201308069D0 GB201308069D0 (en) | 2013-06-12 |
GB2505030A GB2505030A (en) | 2014-02-19 |
GB2505030B true GB2505030B (en) | 2015-07-29 |
Family
ID=48627305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1308069.2A Active GB2505030B (en) | 2012-08-13 | 2013-05-03 | Lead-free solder composition for glass |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2505030B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110064864B (en) * | 2019-05-29 | 2020-07-31 | 南京达迈科技实业有限公司 | Solder for connecting polycrystalline silicon and metal, soldering paste prepared by solder, preparation method and soldering method using soldering paste |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU520413A1 (en) * | 1974-12-27 | 1976-07-05 | Второй Московский ордена Трудового Красного Знамени часовой завод | Silver based alloy |
BG51243A3 (en) * | 1991-09-27 | 1993-03-15 | Валентин Кашин | Solder for aluminium cables |
US5242658A (en) * | 1992-07-07 | 1993-09-07 | The Indium Corporation Of America | Lead-free alloy containing tin, zinc and indium |
JPH07227690A (en) * | 1994-02-21 | 1995-08-29 | Asahi Glass Co Ltd | Solder alloy and target structural body |
US5538686A (en) * | 1993-04-30 | 1996-07-23 | At&T Corp. | Article comprising a PB-free solder having improved mechanical properties |
US6241942B1 (en) * | 1995-09-29 | 2001-06-05 | Matsushita Electric Industrial Co., Ltd. | Lead-free solder alloys |
US20060067852A1 (en) * | 2004-09-29 | 2006-03-30 | Daewoong Suh | Low melting-point solders, articles made thereby, and processes of making same |
US20070152026A1 (en) * | 2005-12-30 | 2007-07-05 | Daewoong Suh | Transient liquid phase bonding method |
-
2013
- 2013-05-03 GB GB1308069.2A patent/GB2505030B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU520413A1 (en) * | 1974-12-27 | 1976-07-05 | Второй Московский ордена Трудового Красного Знамени часовой завод | Silver based alloy |
BG51243A3 (en) * | 1991-09-27 | 1993-03-15 | Валентин Кашин | Solder for aluminium cables |
US5242658A (en) * | 1992-07-07 | 1993-09-07 | The Indium Corporation Of America | Lead-free alloy containing tin, zinc and indium |
US5538686A (en) * | 1993-04-30 | 1996-07-23 | At&T Corp. | Article comprising a PB-free solder having improved mechanical properties |
JPH07227690A (en) * | 1994-02-21 | 1995-08-29 | Asahi Glass Co Ltd | Solder alloy and target structural body |
US6241942B1 (en) * | 1995-09-29 | 2001-06-05 | Matsushita Electric Industrial Co., Ltd. | Lead-free solder alloys |
US20060067852A1 (en) * | 2004-09-29 | 2006-03-30 | Daewoong Suh | Low melting-point solders, articles made thereby, and processes of making same |
US20070152026A1 (en) * | 2005-12-30 | 2007-07-05 | Daewoong Suh | Transient liquid phase bonding method |
Also Published As
Publication number | Publication date |
---|---|
GB2505030A (en) | 2014-02-19 |
GB201308069D0 (en) | 2013-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20210527 AND 20210602 |