GB2505030B - Lead-free solder composition for glass - Google Patents

Lead-free solder composition for glass

Info

Publication number
GB2505030B
GB2505030B GB1308069.2A GB201308069A GB2505030B GB 2505030 B GB2505030 B GB 2505030B GB 201308069 A GB201308069 A GB 201308069A GB 2505030 B GB2505030 B GB 2505030B
Authority
GB
United Kingdom
Prior art keywords
glass
lead
free solder
solder composition
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1308069.2A
Other versions
GB2505030A (en
GB201308069D0 (en
Inventor
Hae Won Jeong
Hyun Dal Park
Tae Seung Lee
Seung Kyu Kim
Hong Nho Joo
Ho June Yoon
Min Ho Bak
Joo Dong Lee
Hyun Chae Jung
Sun Myung Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hyundai Motor Co
Korea Autoglass Corp
LT Materials Co Ltd
Kia Corp
Original Assignee
Hyundai Motor Co
Kia Motors Corp
Heesung Material Ltd
Korea Autoglass Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Motor Co, Kia Motors Corp, Heesung Material Ltd, Korea Autoglass Corp filed Critical Hyundai Motor Co
Publication of GB201308069D0 publication Critical patent/GB201308069D0/en
Publication of GB2505030A publication Critical patent/GB2505030A/en
Application granted granted Critical
Publication of GB2505030B publication Critical patent/GB2505030B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB1308069.2A 2012-08-13 2013-05-03 Lead-free solder composition for glass Active GB2505030B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20120008817 2012-08-13

Publications (3)

Publication Number Publication Date
GB201308069D0 GB201308069D0 (en) 2013-06-12
GB2505030A GB2505030A (en) 2014-02-19
GB2505030B true GB2505030B (en) 2015-07-29

Family

ID=48627305

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1308069.2A Active GB2505030B (en) 2012-08-13 2013-05-03 Lead-free solder composition for glass

Country Status (1)

Country Link
GB (1) GB2505030B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110064864B (en) * 2019-05-29 2020-07-31 南京达迈科技实业有限公司 Solder for connecting polycrystalline silicon and metal, soldering paste prepared by solder, preparation method and soldering method using soldering paste

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU520413A1 (en) * 1974-12-27 1976-07-05 Второй Московский ордена Трудового Красного Знамени часовой завод Silver based alloy
BG51243A3 (en) * 1991-09-27 1993-03-15 Elena G Grin Solder for aluminium cables
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium
JPH07227690A (en) * 1994-02-21 1995-08-29 Asahi Glass Co Ltd Solder alloy and target structural body
US5538686A (en) * 1993-04-30 1996-07-23 At&T Corp. Article comprising a PB-free solder having improved mechanical properties
US6241942B1 (en) * 1995-09-29 2001-06-05 Matsushita Electric Industrial Co., Ltd. Lead-free solder alloys
US20060067852A1 (en) * 2004-09-29 2006-03-30 Daewoong Suh Low melting-point solders, articles made thereby, and processes of making same
US20070152026A1 (en) * 2005-12-30 2007-07-05 Daewoong Suh Transient liquid phase bonding method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU520413A1 (en) * 1974-12-27 1976-07-05 Второй Московский ордена Трудового Красного Знамени часовой завод Silver based alloy
BG51243A3 (en) * 1991-09-27 1993-03-15 Elena G Grin Solder for aluminium cables
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium
US5538686A (en) * 1993-04-30 1996-07-23 At&T Corp. Article comprising a PB-free solder having improved mechanical properties
JPH07227690A (en) * 1994-02-21 1995-08-29 Asahi Glass Co Ltd Solder alloy and target structural body
US6241942B1 (en) * 1995-09-29 2001-06-05 Matsushita Electric Industrial Co., Ltd. Lead-free solder alloys
US20060067852A1 (en) * 2004-09-29 2006-03-30 Daewoong Suh Low melting-point solders, articles made thereby, and processes of making same
US20070152026A1 (en) * 2005-12-30 2007-07-05 Daewoong Suh Transient liquid phase bonding method

Also Published As

Publication number Publication date
GB2505030A (en) 2014-02-19
GB201308069D0 (en) 2013-06-12

Similar Documents

Publication Publication Date Title
PL2990155T3 (en) Lead-free solder composition
HK1204779A1 (en) Lead-free solder ball
IL238431A0 (en) Color-changing composition
EP2692478A4 (en) Lead-free solder ball
EP2883649A4 (en) High-temperature lead-free solder alloy
EP2689885A4 (en) Lead-free solder alloy
HRP20182112T1 (en) Lead-free solder alloy
GB201502723D0 (en) Solder alloy
EP2937432A4 (en) Lead-free solder alloy
EP2719497A4 (en) Solder paste
EP2562141A4 (en) Lead-free low melting point glass composition
EP3077151A4 (en) Zinc-based lead-free solder compositions
PL3031566T3 (en) Lead-free solder alloy
GB201200707D0 (en) Composition
EP2907602A4 (en) Bonding composition
EP2698225A4 (en) Lead-free solder alloy
EP2867307A4 (en) Silver-containing composition
EP2878295A4 (en) Composition
EP2716401A4 (en) High-temperature lead-free solder alloy
SG11201600900SA (en) Lead-free solder alloy
FR2994398B1 (en) LEAD-FREE SOLDERING COMPOSITION FOR GLASS
EP2671666A4 (en) Lead-free solder alloy for vehicle glass
EP2746234A4 (en) Bismuth-containing glass composition
EP2913144A4 (en) Flux composition
EP2837670A4 (en) Fluorobiphenyl-containing composition

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20210527 AND 20210602