DE69418930D1 - Verfahren zum Verbinden eines Isolators und eines Leiters - Google Patents

Verfahren zum Verbinden eines Isolators und eines Leiters

Info

Publication number
DE69418930D1
DE69418930D1 DE69418930T DE69418930T DE69418930D1 DE 69418930 D1 DE69418930 D1 DE 69418930D1 DE 69418930 T DE69418930 T DE 69418930T DE 69418930 T DE69418930 T DE 69418930T DE 69418930 D1 DE69418930 D1 DE 69418930D1
Authority
DE
Germany
Prior art keywords
insulator
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69418930T
Other languages
English (en)
Other versions
DE69418930T2 (de
Inventor
Masatake Akaike
Takayuki Yagi
Masahiro Fushimi
Miki Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69418930D1 publication Critical patent/DE69418930D1/de
Publication of DE69418930T2 publication Critical patent/DE69418930T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Ceramic Products (AREA)
  • Non-Insulated Conductors (AREA)
  • Pressure Sensors (AREA)
  • Joining Of Glass To Other Materials (AREA)
DE1994618930 1993-03-23 1994-03-22 Verfahren zum Verbinden eines Isolators und eines Leiters Expired - Fee Related DE69418930T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06429493A JP3188546B2 (ja) 1993-03-23 1993-03-23 絶縁体と導電体との接合体並びに接合方法

Publications (2)

Publication Number Publication Date
DE69418930D1 true DE69418930D1 (de) 1999-07-15
DE69418930T2 DE69418930T2 (de) 2000-03-09

Family

ID=13254081

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994618930 Expired - Fee Related DE69418930T2 (de) 1993-03-23 1994-03-22 Verfahren zum Verbinden eines Isolators und eines Leiters

Country Status (4)

Country Link
US (1) US5769997A (de)
EP (1) EP0619598B1 (de)
JP (1) JP3188546B2 (de)
DE (1) DE69418930T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193294A (ja) * 1993-11-01 1995-07-28 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JPH08122359A (ja) * 1994-10-21 1996-05-17 Fuji Electric Co Ltd 半導体加速度センサとその製造方法および試験方法
US6242842B1 (en) 1996-12-16 2001-06-05 Siemens Matsushita Components Gmbh & Co. Kg Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
JP4125889B2 (ja) * 2000-12-04 2008-07-30 日本板硝子株式会社 光学素子、成形型及びそれらの製造方法
US20040020173A1 (en) * 2002-07-30 2004-02-05 Cho Steven T. Low temperature anodic bonding method using focused energy for assembly of micromachined systems
WO2005090227A1 (en) * 2004-03-23 2005-09-29 Casio Computer Co., Ltd. Stack structure and method of manufacturing the same
US7115182B2 (en) * 2004-06-15 2006-10-03 Agency For Science, Technology And Research Anodic bonding process for ceramics
KR100747336B1 (ko) 2006-01-20 2007-08-07 엘에스전선 주식회사 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법
KR101029020B1 (ko) * 2006-11-27 2011-04-14 주식회사 엘지화학 도전성 부재들의 전기적 연결 방법
JP6058450B2 (ja) * 2013-03-29 2017-01-11 株式会社アルバック 金属セラミック接合体、隔膜真空計、金属とセラミックとの接合方法、および、隔膜真空計の製造方法
JP2015129684A (ja) * 2014-01-08 2015-07-16 株式会社アルバック 金属セラミック接合体、隔膜真空計、金属とセラミックとの接合方法、および、隔膜真空計の製造方法
JP6848008B2 (ja) * 2019-06-06 2021-03-24 マレリ株式会社 接合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3417459A (en) * 1965-05-06 1968-12-24 Mallory & Co Inc P R Bonding electrically conductive metals to insulators
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3506424A (en) * 1967-05-03 1970-04-14 Mallory & Co Inc P R Bonding an insulator to an insulator
US3589965A (en) * 1968-11-27 1971-06-29 Mallory & Co Inc P R Bonding an insulator to an insulator
US3783218A (en) * 1972-01-12 1974-01-01 Gen Electric Electrostatic bonding process
US4452624A (en) 1982-12-21 1984-06-05 The United States Of America As Represented By The Secretary Of The Navy Method for bonding insulator to insulator
US4643532A (en) * 1985-06-24 1987-02-17 At&T Bell Laboratories Field-assisted bonding method and articles produced thereby
US5009690A (en) 1990-03-09 1991-04-23 The United States Of America As Represented By The United States Department Of Energy Method of bonding single crystal quartz by field-assisted bonding
DE69232896T2 (de) * 1991-09-30 2003-09-04 Canon Kk Verfahren für anodische Bindung mit Lichtstrahlung

Also Published As

Publication number Publication date
US5769997A (en) 1998-06-23
EP0619598A2 (de) 1994-10-12
EP0619598A3 (de) 1995-12-06
DE69418930T2 (de) 2000-03-09
JP3188546B2 (ja) 2001-07-16
JPH06271361A (ja) 1994-09-27
EP0619598B1 (de) 1999-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee