DE69416659D1 - Keramische Halbleiterpackung vom Nahtschweissung-Typ für Umkehrmontage und Nahtschweissungsverfahren - Google Patents

Keramische Halbleiterpackung vom Nahtschweissung-Typ für Umkehrmontage und Nahtschweissungsverfahren

Info

Publication number
DE69416659D1
DE69416659D1 DE69416659T DE69416659T DE69416659D1 DE 69416659 D1 DE69416659 D1 DE 69416659D1 DE 69416659 T DE69416659 T DE 69416659T DE 69416659 T DE69416659 T DE 69416659T DE 69416659 D1 DE69416659 D1 DE 69416659D1
Authority
DE
Germany
Prior art keywords
seam welding
semiconductor package
type ceramic
reverse mounting
ceramic semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69416659T
Other languages
English (en)
Other versions
DE69416659T2 (de
Inventor
Katsushi Terashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69416659D1 publication Critical patent/DE69416659D1/de
Publication of DE69416659T2 publication Critical patent/DE69416659T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69416659T 1993-12-30 1994-12-30 Keramische Halbleiterpackung vom Nahtschweissung-Typ für Umkehrmontage und Nahtschweissungsverfahren Expired - Fee Related DE69416659T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5353708A JP2734364B2 (ja) 1993-12-30 1993-12-30 半導体装置

Publications (2)

Publication Number Publication Date
DE69416659D1 true DE69416659D1 (de) 1999-04-01
DE69416659T2 DE69416659T2 (de) 1999-09-30

Family

ID=18432687

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416659T Expired - Fee Related DE69416659T2 (de) 1993-12-30 1994-12-30 Keramische Halbleiterpackung vom Nahtschweissung-Typ für Umkehrmontage und Nahtschweissungsverfahren

Country Status (5)

Country Link
US (1) US5527992A (de)
EP (1) EP0661738B1 (de)
JP (1) JP2734364B2 (de)
KR (1) KR0185228B1 (de)
DE (1) DE69416659T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866867A (en) * 1997-05-29 1999-02-02 Sawtek Inc. Surface mount package seam welder apparatus and method
JP4614594B2 (ja) * 2001-08-28 2011-01-19 京セラ株式会社 電子部品収納用パッケージ
JP4575247B2 (ja) * 2005-07-11 2010-11-04 株式会社東芝 高周波パッケージ装置
US7803211B2 (en) * 2005-09-22 2010-09-28 Ati Properties, Inc. Method and apparatus for producing large diameter superalloy ingots
CN101925968B (zh) * 2008-01-29 2012-05-30 株式会社村田制作所 芯片型半导体陶瓷电子元器件
JP5664248B2 (ja) * 2010-03-17 2015-02-04 株式会社リコー 面発光レーザモジュール、光走査装置及び画像形成装置
CN118218734B (zh) * 2024-05-24 2024-07-19 合肥先进封装陶瓷有限公司 一种陶瓷封装外壳自动定位组装装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4015071A (en) * 1975-06-05 1977-03-29 Bliss & Laughlin Ind., Inc. Microelectronic circuit case
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
JPS5856357A (ja) * 1981-09-30 1983-04-04 Fujitsu Ltd 半導体装置用パツケ−ジ
JPS57172754A (en) * 1981-10-19 1982-10-23 Nec Corp Hermetically sealing method for container of semiconductor substrate
JPS59231838A (ja) * 1983-06-14 1984-12-26 Nippon Abionikusu Kk 半導体装置用容器のシ−ム溶接方法および装置
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
JPH02122540U (de) * 1989-03-20 1990-10-08
JP2689621B2 (ja) * 1989-07-13 1997-12-10 富士通株式会社 半導体装置とその製造方法
US5117068A (en) * 1990-08-17 1992-05-26 Watkins-Johnson Company Surface mount package for R.F. devices
US5268533A (en) * 1991-05-03 1993-12-07 Hughes Aircraft Company Pre-stressed laminated lid for electronic circuit package
JPH05144999A (ja) * 1991-11-25 1993-06-11 Kyocera Corp 半導体素子収納用パツケージ

Also Published As

Publication number Publication date
EP0661738B1 (de) 1999-02-24
EP0661738A1 (de) 1995-07-05
JP2734364B2 (ja) 1998-03-30
DE69416659T2 (de) 1999-09-30
JPH07202058A (ja) 1995-08-04
US5527992A (en) 1996-06-18
KR0185228B1 (ko) 1999-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee