DE69414846D1 - Methode zur elektrische Isolation von Kühlkörpern in elektronischen Leistungsschaltungen - Google Patents
Methode zur elektrische Isolation von Kühlkörpern in elektronischen LeistungsschaltungenInfo
- Publication number
- DE69414846D1 DE69414846D1 DE69414846T DE69414846T DE69414846D1 DE 69414846 D1 DE69414846 D1 DE 69414846D1 DE 69414846 T DE69414846 T DE 69414846T DE 69414846 T DE69414846 T DE 69414846T DE 69414846 D1 DE69414846 D1 DE 69414846D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical insulation
- heat sinks
- electronic power
- power circuits
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010292 electrical insulation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94830442A EP0703612B1 (de) | 1994-09-20 | 1994-09-20 | Methode zur elektrische Isolation von Kühlkörpern in elektronischen Leistungsschaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69414846D1 true DE69414846D1 (de) | 1999-01-07 |
DE69414846T2 DE69414846T2 (de) | 1999-05-20 |
Family
ID=8218526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69414846T Expired - Fee Related DE69414846T2 (de) | 1994-09-20 | 1994-09-20 | Methode zur elektrische Isolation von Kühlkörpern in elektronischen Leistungsschaltungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5789279A (de) |
EP (1) | EP0703612B1 (de) |
JP (1) | JP2700449B2 (de) |
DE (1) | DE69414846T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6063646A (en) * | 1998-10-06 | 2000-05-16 | Japan Rec Co., Ltd. | Method for production of semiconductor package |
EP2206145A4 (de) * | 2007-09-28 | 2012-03-28 | Tessera Inc | Flip-chip-verbindung mit doppelten pfosten |
US20100044860A1 (en) * | 2008-08-21 | 2010-02-25 | Tessera Interconnect Materials, Inc. | Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer |
US8580607B2 (en) | 2010-07-27 | 2013-11-12 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
US8853558B2 (en) | 2010-12-10 | 2014-10-07 | Tessera, Inc. | Interconnect structure |
TWI601249B (zh) * | 2013-05-22 | 2017-10-01 | Kaneka Corp | Cooling structure |
US9633971B2 (en) | 2015-07-10 | 2017-04-25 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5480079A (en) * | 1978-08-07 | 1979-06-26 | Dai Ichi Seiko Co Ltd | Method of forming semiconductor seal |
JPS55143054A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Resin sealed semiconductor device |
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
JPS6077445A (ja) * | 1983-10-05 | 1985-05-02 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS60132350A (ja) * | 1983-12-21 | 1985-07-15 | Toshiba Corp | 樹脂封止半導体装置 |
JPS61194755A (ja) * | 1985-02-25 | 1986-08-29 | Hitachi Ltd | 半導体装置 |
JP2503778B2 (ja) * | 1988-10-07 | 1996-06-05 | 三菱マテリアル株式会社 | 半導体装置用基板 |
JPH0424952A (ja) * | 1990-05-15 | 1992-01-28 | Mitsubishi Materials Corp | ハイブリッド型半導体装置 |
JPH04123442A (ja) * | 1990-09-14 | 1992-04-23 | Hitachi Ltd | 半導体集積回路装置 |
-
1994
- 1994-09-20 EP EP94830442A patent/EP0703612B1/de not_active Expired - Lifetime
- 1994-09-20 DE DE69414846T patent/DE69414846T2/de not_active Expired - Fee Related
-
1995
- 1995-09-14 US US08/527,858 patent/US5789279A/en not_active Expired - Lifetime
- 1995-09-19 JP JP7239849A patent/JP2700449B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2700449B2 (ja) | 1998-01-21 |
US5789279A (en) | 1998-08-04 |
JPH08111482A (ja) | 1996-04-30 |
EP0703612B1 (de) | 1998-11-25 |
EP0703612A1 (de) | 1996-03-27 |
DE69414846T2 (de) | 1999-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |