DE69406997D1 - Photoempfindliche Harzzusammensetzung und Verfahen zur Herstellung einesReliefmusters mit dieser Zusammensetzung - Google Patents
Photoempfindliche Harzzusammensetzung und Verfahen zur Herstellung einesReliefmusters mit dieser ZusammensetzungInfo
- Publication number
- DE69406997D1 DE69406997D1 DE69406997T DE69406997T DE69406997D1 DE 69406997 D1 DE69406997 D1 DE 69406997D1 DE 69406997 T DE69406997 T DE 69406997T DE 69406997 T DE69406997 T DE 69406997T DE 69406997 D1 DE69406997 D1 DE 69406997D1
- Authority
- DE
- Germany
- Prior art keywords
- composition
- producing
- photosensitive resin
- relief pattern
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
- G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
- G03F7/0125—Macromolecular azides; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2640093 | 1993-02-16 | ||
JP3320293 | 1993-02-23 | ||
JP6154493 | 1993-03-22 | ||
PCT/JP1994/000231 WO1994019725A1 (en) | 1993-02-16 | 1994-02-16 | Photosensitive resin composition and process for forming relief pattern therefrom |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69406997D1 true DE69406997D1 (de) | 1998-01-08 |
DE69406997T2 DE69406997T2 (de) | 1998-05-28 |
Family
ID=27285387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69406997T Expired - Fee Related DE69406997T2 (de) | 1993-02-16 | 1994-02-16 | Photoempfindliche Harzzusammensetzung und Verfahen zur Herstellung einesReliefmusters mit dieser Zusammensetzung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0637776B1 (de) |
KR (1) | KR100287248B1 (de) |
DE (1) | DE69406997T2 (de) |
WO (1) | WO1994019725A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008297226A (ja) * | 2007-05-30 | 2008-12-11 | Mitsubishi Gas Chem Co Inc | ピロメリット酸二無水物の製造方法 |
JP7003771B2 (ja) * | 2017-03-28 | 2022-01-21 | 東レ株式会社 | 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550069A (en) * | 1984-06-11 | 1985-10-29 | American Hoechst Corporation | Positive photoresist compositions with o-quinone diazide, novolak, and propylene glycol alkyl ether acetate |
JPS61254605A (ja) * | 1985-05-07 | 1986-11-12 | Asahi Chem Ind Co Ltd | 感光性組成物 |
JPH01293341A (ja) * | 1988-05-20 | 1989-11-27 | Tokyo Ohka Kogyo Co Ltd | ポジ型感光性組成物 |
JPH04120542A (ja) * | 1990-09-12 | 1992-04-21 | Hitachi Ltd | 感光性耐熱重合体組成物 |
JP2943379B2 (ja) * | 1991-03-19 | 1999-08-30 | 日本ゼオン株式会社 | レジスト組成物 |
-
1994
- 1994-02-16 WO PCT/JP1994/000231 patent/WO1994019725A1/ja active IP Right Grant
- 1994-02-16 DE DE69406997T patent/DE69406997T2/de not_active Expired - Fee Related
- 1994-02-16 EP EP94907054A patent/EP0637776B1/de not_active Expired - Lifetime
- 1994-02-16 KR KR1019940703663A patent/KR100287248B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100287248B1 (ko) | 2001-09-17 |
KR950701092A (ko) | 1995-02-20 |
WO1994019725A1 (en) | 1994-09-01 |
EP0637776B1 (de) | 1997-11-26 |
EP0637776A4 (de) | 1996-01-17 |
DE69406997T2 (de) | 1998-05-28 |
EP0637776A1 (de) | 1995-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |