DE69406215D1 - Verfahren zur Verhütung der Erschöpfung von säuren Kupfer-Plattierungsbädern, und zur Wiedergewinnung von metallischem Kupfer aus Lösungen und Schlämmen, die Kupfer in Jonenform enthalten - Google Patents

Verfahren zur Verhütung der Erschöpfung von säuren Kupfer-Plattierungsbädern, und zur Wiedergewinnung von metallischem Kupfer aus Lösungen und Schlämmen, die Kupfer in Jonenform enthalten

Info

Publication number
DE69406215D1
DE69406215D1 DE69406215T DE69406215T DE69406215D1 DE 69406215 D1 DE69406215 D1 DE 69406215D1 DE 69406215 T DE69406215 T DE 69406215T DE 69406215 T DE69406215 T DE 69406215T DE 69406215 D1 DE69406215 D1 DE 69406215D1
Authority
DE
Germany
Prior art keywords
copper
plating baths
preventing
ionic form
depletion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69406215T
Other languages
English (en)
Other versions
DE69406215T2 (de
Inventor
Leandro Taboga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAB TABOGA DI TABOGA LEANDRO
Original Assignee
LAB TABOGA DI TABOGA LEANDRO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LAB TABOGA DI TABOGA LEANDRO filed Critical LAB TABOGA DI TABOGA LEANDRO
Publication of DE69406215D1 publication Critical patent/DE69406215D1/de
Application granted granted Critical
Publication of DE69406215T2 publication Critical patent/DE69406215T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/13—Purification and treatment of electroplating baths and plating wastes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S210/00—Liquid purification or separation
    • Y10S210/902—Materials removed
    • Y10S210/911—Cumulative poison
    • Y10S210/912—Heavy metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Removal Of Specific Substances (AREA)
  • Chemically Coating (AREA)
DE69406215T 1993-07-29 1994-07-15 Verfahren zur Verhütung der Erschöpfung von säuren Kupfer-Plattierungsbädern, und zur Wiedergewinnung von metallischem Kupfer aus Lösungen und Schlämmen, die Kupfer in Jonenform enthalten Expired - Fee Related DE69406215T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD930148A IT1262169B (it) 1993-07-29 1993-07-29 Procedimento per la prevenzione dell'esaurimento dei bagni acidi di ramatura e per il recupero di rame metallico da soluzioni e fanghi contenenti rame in forma ionica

Publications (2)

Publication Number Publication Date
DE69406215D1 true DE69406215D1 (de) 1997-11-20
DE69406215T2 DE69406215T2 (de) 1998-05-28

Family

ID=11421348

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69406215T Expired - Fee Related DE69406215T2 (de) 1993-07-29 1994-07-15 Verfahren zur Verhütung der Erschöpfung von säuren Kupfer-Plattierungsbädern, und zur Wiedergewinnung von metallischem Kupfer aus Lösungen und Schlämmen, die Kupfer in Jonenform enthalten

Country Status (7)

Country Link
US (1) US5599458A (de)
EP (1) EP0636708B1 (de)
AT (1) ATE159301T1 (de)
DE (1) DE69406215T2 (de)
ES (1) ES2109558T3 (de)
GR (1) GR3025210T3 (de)
IT (1) IT1262169B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228104B (en) * 2003-07-29 2005-02-21 Min-Shing Tsai Sludge-free wastewater treatment process and apparatus
CN102259994B (zh) * 2008-04-28 2012-11-14 重庆华浩冶炼有限公司 电解铜粉废液的处理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE157184C (de) *
DE623658C (de) *
US2754174A (en) * 1956-07-10 Treatment of salt solutions to
US4176160A (en) * 1971-06-23 1979-11-27 Societe De Prayon Process for purifying a zinc sulfate solution
DE2623658A1 (de) * 1976-05-24 1977-12-15 Schering Ag Verfahren zur gewinnung von kupfer (ii)-sulfat aus kupfersalzhaltigen aetzloesungen
SU753927A1 (ru) * 1978-07-19 1980-08-07 Химико-Металлургический Институт Ан Казахской Сср Способ переработки медного электролита электролизом
US4324629A (en) * 1979-06-19 1982-04-13 Hitachi, Ltd. Process for regenerating chemical copper plating solution
DD157184A1 (de) * 1981-01-07 1982-10-20 Guenter Reiche Verfahren zur aufbereitung und nutzbarmachung von kupferaetzrueckstaenden
JPS59162108A (ja) * 1983-03-03 1984-09-13 Tadao Nagai 硫酸溶液の浄液法
US4549946A (en) * 1984-05-09 1985-10-29 Electrochem International, Inc. Process and an electrodialytic cell for electrodialytically regenerating a spent electroless copper plating bath
US4600493A (en) * 1985-01-14 1986-07-15 Morton Thiokol, Inc. Electrodialysis apparatus for the chemical maintenance of electroless copper plating baths
US5059403A (en) * 1990-12-03 1991-10-22 Compeq Manufacturing Co., Ltd. Method for producing copper sulfate from waste copper-containing liquid
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths

Also Published As

Publication number Publication date
GR3025210T3 (en) 1998-02-27
IT1262169B (it) 1996-06-19
DE69406215T2 (de) 1998-05-28
ATE159301T1 (de) 1997-11-15
ITUD930148A0 (it) 1993-07-29
EP0636708B1 (de) 1997-10-15
ES2109558T3 (es) 1998-01-16
EP0636708A1 (de) 1995-02-01
ITUD930148A1 (it) 1995-01-29
US5599458A (en) 1997-02-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee