DE69406154D1 - Method for measuring the depth of fully cut raster trenches using an ultrasound detector and cutting device for carrying out the method - Google Patents

Method for measuring the depth of fully cut raster trenches using an ultrasound detector and cutting device for carrying out the method

Info

Publication number
DE69406154D1
DE69406154D1 DE69406154T DE69406154T DE69406154D1 DE 69406154 D1 DE69406154 D1 DE 69406154D1 DE 69406154 T DE69406154 T DE 69406154T DE 69406154 T DE69406154 T DE 69406154T DE 69406154 D1 DE69406154 D1 DE 69406154D1
Authority
DE
Germany
Prior art keywords
trenches
raster
depth
measuring
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69406154T
Other languages
German (de)
Other versions
DE69406154T2 (en
Inventor
Hotaka Ikeda
Masaharu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE69406154D1 publication Critical patent/DE69406154D1/en
Application granted granted Critical
Publication of DE69406154T2 publication Critical patent/DE69406154T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
DE69406154T 1993-02-23 1994-02-14 Method for measuring the depth of fully cut raster trenches using an ultrasound detector and cutting device for carrying out the method Expired - Fee Related DE69406154T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5033406A JP2868384B2 (en) 1993-02-23 1993-02-23 Dicing groove depth measuring method and dicing device

Publications (2)

Publication Number Publication Date
DE69406154D1 true DE69406154D1 (en) 1997-11-20
DE69406154T2 DE69406154T2 (en) 1998-04-23

Family

ID=12385722

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69406154T Expired - Fee Related DE69406154T2 (en) 1993-02-23 1994-02-14 Method for measuring the depth of fully cut raster trenches using an ultrasound detector and cutting device for carrying out the method

Country Status (4)

Country Link
US (1) US5501104A (en)
EP (1) EP0612978B1 (en)
JP (1) JP2868384B2 (en)
DE (1) DE69406154T2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5668062A (en) * 1995-08-23 1997-09-16 Texas Instruments Incorporated Method for processing semiconductor wafer with reduced particle contamination during saw
US6294439B1 (en) * 1997-07-23 2001-09-25 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
US5863813A (en) * 1997-08-20 1999-01-26 Micron Communications, Inc. Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips
US6120351A (en) * 1998-08-31 2000-09-19 Ingersoll-Rand Company Automatic machinability measuring and machining methods and apparatus therefor
US6021682A (en) * 1998-08-31 2000-02-08 Ingersoll-Rand Company Automatic machinability measuring and machining methods and apparatus therefor
US6244927B1 (en) 1998-08-31 2001-06-12 Ingersoll-Rand Company Multi-functional sensing methods and apparatus therefor
US6357330B1 (en) * 1999-01-07 2002-03-19 Intel Corporation Method and apparatus for cutting a wafer
JP4669162B2 (en) * 2001-06-28 2011-04-13 株式会社ディスコ Semiconductor wafer dividing system and dividing method
DE10160809B4 (en) * 2001-12-11 2007-12-27 Robert Bosch Gmbh Method for the contactless measurement of the removal during the internal surface finishing of a bore introduced into a workpiece
JP4509578B2 (en) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4601965B2 (en) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4598407B2 (en) 2004-01-09 2010-12-15 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
ITMI20042528A1 (en) * 2004-01-10 2005-03-28 Saurer Gmbh & Co Kg METHOD AND DEVICE TO DETECT THE FILLING OF A FIBER AND FIBER CUTTING MACHINE
JP4879012B2 (en) * 2006-12-28 2012-02-15 株式会社ディスコ Cutting blade tip shape inspection method
JP2008307646A (en) * 2007-06-15 2008-12-25 Disco Abrasive Syst Ltd Cutting apparatus
FR2973935A1 (en) * 2011-04-11 2012-10-12 St Microelectronics Rousset METHOD FOR EVALUATING A SEMICONDUCTOR WAFER CUTTING PROCESS
JP5757831B2 (en) * 2011-09-14 2015-08-05 株式会社ディスコ Cutting blade tip shape detection method
JP6259653B2 (en) * 2013-12-17 2018-01-10 株式会社ディスコ Cutting blade shape detection method
US9685362B2 (en) * 2014-02-19 2017-06-20 International Business Machines Corporation Apparatus and method for centering substrates on a chuck
JP6422388B2 (en) * 2015-04-09 2018-11-14 株式会社ディスコ Method for forming cutting groove
CN112066843B (en) * 2020-09-23 2021-04-30 宁夏诚建建设工程有限公司 Channel measuring device for reducing workload of workers by utilizing water based on safety

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813926A (en) * 1972-02-09 1974-06-04 A Stubbeman Ultrasonic pulsed energy inspection system
JPS5157283A (en) * 1974-11-15 1976-05-19 Nippon Electric Co Handotaikibanno bunkatsuhoho
IT1129055B (en) * 1980-01-08 1986-06-04 Fiat Ricerche PALPATOR DEVICE FOR MEASURING THE ROUGHNESS OF A SURFACE
IT1129066B (en) * 1980-02-26 1986-06-04 Fiat Ricerche DEVICE FOR NON-DESTRUCTIVE MEASUREMENT OF THE THICKNESS OF A SURFACE LAYER OF A BODY SUBJECT TO A TREATMENT TO MODIFY ITS SURFACE STRUCTURE
DE3425811C2 (en) * 1983-07-14 1986-10-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 8000 München Method for determining the wall thickness of a workpiece and / or the speed of sound in a workpiece and device for carrying out the method
US4814296A (en) * 1987-08-28 1989-03-21 Xerox Corporation Method of fabricating image sensor dies for use in assembling arrays
EP0357905A3 (en) * 1988-08-16 1991-09-11 Toray Industries, Inc. Method of measuring a profile of an object and an apparatus for carrying out the method
JP2656393B2 (en) * 1991-02-22 1997-09-24 株式会社東京精密 Dicing apparatus and method
US5128282A (en) * 1991-11-04 1992-07-07 Xerox Corporation Process for separating image sensor dies and the like from a wafer that minimizes silicon waste

Also Published As

Publication number Publication date
JPH06252260A (en) 1994-09-09
US5501104A (en) 1996-03-26
JP2868384B2 (en) 1999-03-10
EP0612978B1 (en) 1997-10-15
DE69406154T2 (en) 1998-04-23
EP0612978A1 (en) 1994-08-31

Similar Documents

Publication Publication Date Title
DE69406154T2 (en) Method for measuring the depth of fully cut raster trenches using an ultrasound detector and cutting device for carrying out the method
DE59712459D1 (en) METHOD AND DEVICE FOR THREE-DIMENSIONAL MEASUREMENT OF OBJECTS
DE3584117D1 (en) METHOD FOR ULTRASONIC MEASUREMENT AND RELATED DEVICE.
DE69212771T2 (en) Method and device for ultrasonic testing of tools
DE69213749T2 (en) METHOD AND DEVICE FOR THE SPOTUAL MEASUREMENT OF SPACE COORDINATES
DE69329416T2 (en) Device and method for measuring the elasticity of an artery using ultrasound echography
DE69708352T2 (en) Method and device for detecting the presence of a particular living being in an environment monitored by a Doppler detector
DE69317268D1 (en) DEVICE AND METHOD FOR DETERMINING THE SURFACES OF DRAW AND DRAWN DEFORMABILITY
DE69518834D1 (en) Method and device for determining the erythrocyte sedimentation rate
DE59302962D1 (en) Distance measuring method and device
DE68918546T2 (en) Device and method for density determination with ultrasound.
DE3681710D1 (en) DEVICE AND METHOD FOR DETERMINING THE LOCATION OF AN OBJECT.
DE69518224T2 (en) DEVICE AND METHOD FOR DETERMINING THE WORKING POINT OF AN AUTONOMOUS VEHICLE
DE59706787D1 (en) METHOD AND DEVICE FOR DETERMINING THE SPATIAL COORDINATES OF OBJECTS
DE59401968D1 (en) METHOD AND DEVICE FOR MEASURING THE DISTANCE OF AN OBJECT FROM AN ULTRASONIC TRANSMITTER RECEIVER
DE69623335T2 (en) DEVICE FOR DETERMINING THE DIMENSIONS OF THREE-DIMENSIONAL OBJECTS
DE59609594D1 (en) Method and device for the underground detection of the depth of a well
DE69418507T2 (en) Device and method for automatically determining the density of an object
DE3768562D1 (en) METHOD AND DEVICE FOR MEASURING THE DIMENSION OF AN OBJECT.
DE3685605T2 (en) DEVICE AND METHOD FOR MEASURING THE SPEED OF ULTRASONIC WAVES.
DE3672166D1 (en) METHOD AND DEVICE FOR EXAMINING MEDIA USING ULTRASONIC ECHOGRAPHY.
DE59007108D1 (en) Method and device for determining the position of an object.
DE3667202D1 (en) METHOD FOR DETERMINING A SOUND BREAKING INDEX DISTRIBUTION IN AN EXAMINATION AREA AND ARRANGEMENT FOR IMPLEMENTING THE METHOD.
ATA14593A (en) METHOD AND DEVICE FOR THREE-DIMENSIONAL MEASUREMENT OF THE SURFACE OF OBJECTS
AT365911B (en) METHOD AND DEVICE FOR OBTAINING AND RECORDING ULTRASONIC CUTTING IMAGES

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee