JP2656393B2 - Dicing apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus and method, and more particularly, to a dicing apparatus and method for processing a wafer or the like into chips using a cutting blade (hereinafter referred to as a blade).

[0002]

2. Description of the Related Art In a dicing apparatus, a blade attached to a spindle is rotated at a high speed to form a cutting groove in a work and cut the work into chips. By the way, when a cutting groove is machined with a blade, a defect may occur in a processed portion, and a defect is removed as a defective product. The presence or absence of this defect is determined by whether or not the width and shape of the cutting groove are deformed.Furthermore, the measurement of the width and shape of the cutting groove is performed by temporarily suspending the cutting of the work and placing the work under a microscope for alignment. It is performed by image processing after moving and removing water on the work surface by air blow.

[0003] On the other hand, in order to prevent defective products from being produced in the dicing process, it is important to accurately control the uncut amount of the cutting groove. In this control, the amount of wear of the blade with respect to the workpiece and the cutting conditions is determined in advance in an experiment, the correction amount at the time of machining is set based on the experimental value, and the amount of protrusion of the blade every time a predetermined number of workpieces are processed (Ie, the cutting height position of the blade) is measured, and the correction amount is corrected as needed based on the sticking amount.

[0004]

However, when measuring the width and shape of a cutting groove by image processing, it is necessary to temporarily suspend the processing in order to remove cutting water and the like during the processing, and furthermore, the data processing time Takes a long time. Therefore, there is a problem that the width and shape of the cutting groove cannot be measured in real time or constantly monitored. Further, in the case of image processing, since the measurement is performed after removing the cutting water or the like on the work surface by air blow, there is a problem that processing powder or the like adheres to the dried work surface and becomes a defective product.

[0005] On the other hand, in the case of controlling the remaining amount of the cutting groove, the quality of the blade varies and the cutting conditions also fluctuate. Therefore, the amount of wear of the blade changes to accurately control the remaining amount of the cutting groove. There is a problem that is difficult. The present invention has been made in view of such circumstances, and it is possible to measure the shape of a cutting groove or the like in real time or to constantly monitor the cutting groove, and to form a cutting groove without attaching machining powder or the like to a work surface. It is an object of the present invention to provide a dicing apparatus and method capable of performing measurement and further capable of automatically controlling a cutting height position of a blade in response to variations in blade quality and fluctuations in cutting conditions.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention has a movable table which is movably provided on a main body and on which a work is placed, and which has a cutting blade and rotates the cutting blade. A cutting portion for forming a cutting groove in the workpiece; and a cutting portion disposed above the cutting groove and movably provided in a direction orthogonal to the cutting groove, and transmitting ultrasonic waves to the cutting groove. A wave transmitting / receiving unit for receiving the ultrasonic wave reflected from the cutting groove, a liquid supply unit for supplying a liquid to the cutting unit, and a liquid between the wave transmitting and receiving unit and the work by the liquid supplied by the liquid supply unit. Outputs an ultrasonic oscillation signal to the wave transmitting and receiving unit when is satisfied, and the width and depth of the cutting groove based on the ultrasonic wave oscillation signal and the received signal input from the wave transmitting and receiving unit. And at least one of shape A detection unit that, during machining of the workpiece by the cutting blade, characterized by comprising a moving means for moving the wave transceiver section in a direction orthogonal to the cut groove.

Further, in order to achieve the above object, the present invention provides a movable type table in which a work is placed on a movable table movably provided on a main body and the work is placed while rotating a cutting blade. In the dicing method for machining a cutting groove in the work by moving the table, a depth dimension of the cutting groove to be machined in the work is set in advance, and a cutting height of the cutting blade is set based on the set depth dimension. While setting, while processing the cutting groove with the cutting blade while supplying the liquid to the cutting portion, filling the gap between the workpiece and the ultrasonic wave transmitting and receiving portion with the liquid, the cutting blade during processing the cutting groove with the cutting blade. The ultrasonic wave transmitting and receiving unit is reciprocated in a direction orthogonal to the cutting groove, and while transmitting ultrasonic waves by the ultrasonic wave transmitting and receiving unit, receives ultrasonic waves reflected from the cutting groove,
The ultrasonic wave transmitter / receiver measures the depth of the cutting groove based on the relationship between the transmitted wave and the received wave transmitted / received by the ultrasonic wave transmitting / receiving section, and determines the value of the measured cutting groove depth and a preset depth dimension. The cutting height position of the cutting blade is corrected based on the comparison result such that the depth of the cutting groove matches the set depth dimension.

Further, since the thickness of the work varies, prior to cutting, the thickness of each work is measured with an ultrasonic wave by the apparatus and used for controlling the cutting height.

[0009]

According to the present invention, a cutting blade is arranged in parallel to the moving direction of a movable table on which a work is mounted, a cutting groove is machined in the work, and a wave transmitting / receiving unit arranged above the cutting groove. Is moved in the direction orthogonal to the cutting groove by the moving means, the ultrasonic wave is transmitted from the transmitting / receiving section to the cutting groove, the ultrasonic wave reflected from the cutting groove is received, and the ultrasonic oscillation signal is detected by the detecting section. The shape of the cutting groove is detected based on the received signal and the received signal input from the transmitting / receiving section. Therefore, it is possible to measure the shape of the cutting groove etc. in real time and to constantly monitor it,
Further, it is possible to measure a cutting groove without attaching processing powder or the like to a work surface.

According to the present invention, the thickness of the work is measured before cutting, and then the actually measured depth dimension is compared with a preset depth dimension. Since the cutting height position of the cutting blade can be corrected so as to be the set dimensions, the blade height is automatically adjusted in response to variations in the thickness of the work, variations in the quality of the blade, and variations in the cutting conditions. You can control.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a dicing apparatus and method according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of a dicing apparatus according to the present invention. As shown in FIG. 1, a dicing apparatus 10 includes a cutting unit 11, a transmitting / receiving unit 12, a detecting unit 13, a moving unit 14, and a movable table 15. I have. A motor 16 of the cutting unit 11 is provided on a main body (not shown) of the dicing device 10 so as to be able to move up and down. A spindle 18 is coaxially fixed to a rotating shaft of the motor 16. A disk-shaped cutting blade, that is, a blade 20 is fixed to the spindle 18.

A movable table 15 on which a work 22 is placed is provided below the cutting section 11. The movable table 15 is provided on the upper part of the dicing apparatus 10 so as to be movable in the directions of arrows X1-X2 and Y1-Y2 in FIG. Accordingly, when the motor 16 is driven to rotate the blade 20 at a high speed, the blade 20 is lowered, the work 22 is processed by the blade 20, and the movable table 15 is moved in the direction of arrow X2.
2A is processed.

The wave transmitting / receiving section 12 is provided above the cutting groove 22A. One end of the arm 26 of the wave transmitting / receiving section 12 is rotatably supported by the main body of the dicing apparatus 10 via a pin 28. An ultrasonic transmission / reception sensor 34 is fixed to the other end of the arm 26, and the ultrasonic transmission / reception sensor 34 is disposed above the cutting groove 22A. The ultrasonic transmission / reception sensor 34 is provided with a transmitting crystal oscillator and a receiving crystal oscillator.
The ultrasonic wave can be oscillated based on the voltage applied from the, and the receiving crystal oscillator can receive the ultrasonic wave reflected from the work 22. Further, the ultrasonic transmission / reception sensor 34 is provided with a converging lens below the transmitting crystal oscillator.

The ultrasonic transmission / reception sensor 34 includes a detection unit 1
3 are connected. The ultrasonic oscillator 36 of the detecting unit 13 can apply an ultrasonic oscillation signal to the transmitting crystal oscillator of the ultrasonic transmitting / receiving sensor 34 as described above. The detector 38 of the detection unit 13 receives a signal output from the receiving crystal oscillator of the ultrasonic transmission / reception sensor 34, and generates a reflection intensity of the ultrasonic wave and a reflection of the ultrasonic wave based on the ultrasonic oscillation signal and the received signal. You can measure the time it takes to come back.

A moving means 1 is provided on both sides of the arm 26.
4 are fixed, and the piezoelectric element 3
Reference numerals 0 and 30 are also fixed to the main body of the dicing apparatus 10. The oscillator 32 of the moving means 14 includes the piezoelectric element 30,
An oscillating voltage can be applied to 30, whereby the arm 26 can rotate in the direction of arrow AA about the pin 28 as a fulcrum.

In FIG. 2, reference numeral 46 denotes a tape for attaching the work 22 to a fixture (not shown), and the work 22 is fixed to the movable table 15 via the fixture. The operation of the dicing apparatus configured as described above will be described. First, the motor 16 is driven to rotate the blade 20 at high speed and supply cutting water and the like to the blade 20. In this state, when the motor 16 is lowered to process the blade 20 and the movable table 15 is moved in the direction of arrow X2, the cutting groove 22A is formed in the work 22. Oscillator 32
, A voltage is applied to the piezoelectric elements 30, 30. Accordingly, since the piezoelectric elements 30 and 30 vibrate, the arm 26 is
Is rotated in the direction of the arrow AA with the fulcrum as a fulcrum. Thereby, the ultrasonic transmission / reception sensor 34 reciprocates in the width direction of the cutting groove 22A. Also, since the movable table 15 is moving in the direction of the arrow X2, the ultrasonic transmission / reception sensor 34
Along with the longitudinal direction of the cutting groove 22A.

While the ultrasonic transmission / reception sensor 34 is moving as described above, an oscillation voltage is applied to the ultrasonic transmission / reception sensor 34 from the ultrasonic oscillator 36 so that the ultrasonic transmission / reception sensor 34 Generates ultrasonic waves. The oscillated ultrasonic wave is sent to the work 22 through the converging lens, reflected by the work 22 and received by the receiving crystal oscillator. The received reflected ultrasonic wave is converted into an electric signal by a receiving crystal oscillator and applied to the detector 38. The detector 38 measures the reflection intensity of the ultrasonic wave and the time until the ultrasonic wave is reflected and returned based on the electric signal. Therefore, for example, as shown in FIG. 2, when a defect 22 </ b> B occurs in the processed portion of the workpiece 22, the reflection intensity of the ultrasonic wave is weakened, and the time until the ultrasonic wave is reflected and returned becomes longer. Thereby, a defect near the cutting groove 22A of the work 22 is detected.
Thus, according to the dicing apparatus of the present invention, the work 22
It is possible to measure the width and shape of the cut groove 22A that has been machined.

Further, according to the dicing apparatus of the present invention, since the depth of the cutting groove 22A formed on the work 22 can be detected, the depth of the cutting groove 22A is determined as shown in FIG. In comparison, the cutting height position of the blade 20 can be corrected. Hereinafter, the processing method using the dicing apparatus of the present invention will be described with reference to the flowchart of FIG.

First, the depth (D) of the cutting groove 22A shown in FIG.
1) or set the uncut amount (D2) (Step 5)
0). Next, the thickness (D3) of the work is measured (Step 4).
9) Alternatively, the cutting height position of the blade 20 is set based on the uncut amount of the tape (D2) (step 52), and cutting is started after the setting is completed (step 54). Simultaneously with the start of cutting, the wave transmitting / receiving section 12 and the detecting section 13 measure the depth of the cut groove 22A (step 56). Next, the measured depth of the cutting groove 22A and the set depth of the cutting groove 22A (D
1), and it is determined whether the cutting height of the blade 20 needs to be corrected based on the comparison result (step 5).
8). If it is not necessary to correct the cutting height of the blade 20, cutting is continued with the blade 20 (step 6).
0). If the cutting height of the blade 20 needs to be corrected, the cutting height of the blade 20 is corrected (step 6).
2) Continue cutting (step 64). Thereby, the cutting groove 22A having a constant depth can always be machined. In FIG. 2, the dimension D4 indicates the thickness of the tape, and the dimension D5 indicates the cut amount of the tape.

[0020]

As described above, according to the dicing apparatus and method according to the present invention, a cutting groove is formed on a work by a cutting blade, and ultrasonic waves are transmitted to the cutting groove by a detecting means.
The ultrasonic wave reflected by the cutting groove is received to measure the shape of the cutting groove. Therefore, the shape of the cutting groove immediately after processing can be measured while supplying cutting water or the like, and the ultrasonic measurement can process data in a short time. Thereby, the width and shape of the cutting groove can be measured in real time and can be constantly monitored. Furthermore, in the case of ultrasonic measurement, it is not necessary to remove cutting water and the like on the work surface by air blowing, so that it is possible to prevent a problem that machining powder or the like adheres to a dried work surface.

On the other hand, in the ultrasonic measurement, the width and shape of the cutting groove can be constantly monitored, so that the depth of the cutting groove can be accurately measured. Therefore, it is possible to automatically control the cutting height position of the blade in response to variations in the thickness of the work, variations in the quality of the blade, and variations in the cutting conditions.

[Brief description of the drawings]

FIG. 1 is a plan view showing a dicing apparatus according to the present invention.

FIG. 2 is a sectional view taken along line 2-2 of FIG.

FIG. 3 is a flowchart illustrating a dicing method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus 11 ... Cutting part 12 ... Transmitting and receiving part 13 ... Detection part 14 ... Moving means 15 ... Moving table 20 ... Cutting blade 22 ... Work 22A ... Cutting groove

Claims (3)

(57) [Claims] 1. A movable table movably provided on a main body, on which a work is placed, a cutting section having a cutting blade, and rotating the cutting blade to form a cutting groove in the work; A transmission / reception wave disposed above the groove and movably provided in a direction orthogonal to the cutting groove, for transmitting ultrasonic waves to the cutting groove and receiving ultrasonic waves reflected from the cutting groove; Part, liquid supply means for supplying liquid to the cutting part, and the liquid supplied by the liquid supply means,
An ultrasonic oscillation signal is output to the transmission / reception unit when the space between the transmission / reception unit and the work is filled, and the cutting is performed based on the ultrasonic oscillation signal and the reception signal input from the transmission / reception unit. A detecting unit that detects at least one of a width, a depth, and a shape of the groove; and, during cutting of the work by the cutting blade, the transmitting and receiving unit is orthogonal to the cutting groove. And a moving means for moving in a direction in which the dicing is performed. 2. A dimension setting means for setting a depth dimension of a cutting groove to be machined in advance on a workpiece, and a height setting for setting a cutting height of a cutting blade based on the depth dimension set by the dimension setting means. Means, and the detecting unit during machining of a cutting groove in the workpiece with the cutting blade.
The value of the cutting groove depth actually measured by
Comparing means for comparing with the depth dimension set in the step, and cutting of the cutting blade based on a comparison result by the comparing means.
2. The dicing apparatus according to claim 1 , further comprising: a correction unit configured to correct a cutting height position . 3. A movable table movably provided on a main body.
Place the work on the table and rotate the cutting blade to
Moving the movable table on which the
In the dicing method for machining a cutting groove on the work, Set the depth dimension of the cutting groove to be machined in advance, The cutting height of the cutting blade is set based on the set depth dimension.
, Cutting grooves with the cutting blade while supplying liquid to the cutting section
And the liquid is transmitted ultrasonically by the liquid.
Fill the gap between the receiving part, While machining the cutting groove with the cutting blade, the ultrasonic transmitting and receiving
Reciprocate in the direction perpendicular to the cutting groove, Transmitting the ultrasonic wave by the ultrasonic transmitting / receiving section;
Receiving an ultrasonic wave reflected from the cutting groove, The relationship between the transmitted wave and the received wave transmitted and received by the ultrasonic wave transmitting / receiving unit.
Measure the depth of the cutting groove based on the relationship, The measured value of the depth of the cutting groove and a preset depth dimension
And compare The depth of the cutting groove is set based on the comparison result.
Cutting height position of the cutting blade so that it matches the
A dicing method characterized by correcting the following.