JPH04267106A - Dicing device and method - Google Patents

Abstract

PURPOSE:To provide a dicing device capable of monitoring a kerf at a real time at all time. CONSTITUTION:A table 15 movably installed to a main body, a cutting section 11 having a cutting edge 20 and machining a kerf 22A to a work 22, an ultrasonic-wave transmitting and receiving section 12, which is mounted to the upper section of the kerf 22A and movably in the direction orthogonal to the kerf 22A, transmits ultrasonic waves over the kerf 22A and receives reflected ultrasonic waves, a detecting section 13 outputting an ultrasonic-wave oscillation signal to the ultrasonic-wave transmitting and receiving section 12 while detecting the shape of the kerf 22A on the basis of the ultrasonic-wave oscillation signal and an ultrasonic-wave receiving signal, and a moving means 14 shifting the ultrasonic-wave transmitting and receiving section 12 while being crossed at a right angle to the kerf 22A are provided, and the kerf 22A is monitored at a real time at all times.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus and method, and more particularly to a dicing apparatus and method for processing a wafer or the like into chips using a cutting blade (hereinafter referred to as a blade).

0002

2. Description of the Related Art A dicing device rotates a blade attached to a spindle at high speed to cut grooves into a workpiece and cut the workpiece into chips. By the way, when machining cutting grooves with a blade, defects may occur in the machined part, and those with defects are removed as defective products. The presence or absence of this defect is determined by whether or not the width and shape of the cut groove are deformed. Furthermore, the width and shape of the cut groove can be measured by temporarily suspending cutting of the workpiece and then placing the workpiece under an alignment microscope. Image processing is performed after the workpiece is moved and the water on the workpiece surface is removed by air blowing.

On the other hand, in order to prevent defective products from being produced in the dicing process, it is important to accurately control the amount of remaining cutting grooves. This control involves determining the wear amount of the blade in advance for the workpiece and cutting conditions through experiments, setting the amount of correction during machining based on this experimental value, and then adjusting the amount of blade protrusion each time a predetermined number of workpieces are processed. (that is, the cutting height position of the blade) and corrects the correction amount as needed based on the protrusion amount.

0004

[Problems to be Solved by the Invention] However, when measuring the width and shape of a cut groove using image processing, it is necessary to temporarily suspend the machining to remove cutting water etc. during machining, which further increases the data processing time. takes a long time. Therefore, there is a problem that the width and shape of the cut groove cannot be measured in real time or constantly monitored. In addition, in the case of image processing, since cutting water and the like on the surface of the workpiece are removed by air blowing before measurement, processing powder and the like adhere to the dried surface of the workpiece, resulting in a defective product.

On the other hand, in the case of controlling the amount of remaining cut in the cutting groove, since the quality of the blade varies and the cutting conditions also change, the amount of wear on the blade changes and it is difficult to accurately control the amount of remaining cut in the cutting groove. The problem is that it is difficult. The present invention was developed in view of these circumstances, and it is possible to measure the shape of the cutting groove in real time and to constantly monitor it, and it also allows cutting grooves to be formed without attaching machining powder etc. to the workpiece surface. It is an object of the present invention to provide a dicing device and method that can measure the cutting height of the blade and automatically control the cutting height position of the blade in response to variations in blade quality and cutting conditions.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the present invention includes a movable table that is movably provided in the main body and on which a work is placed, and a cutting blade that rotates the cutting blade. a cutting section for machining a cutting groove in the workpiece; a cutting section disposed above the cutting groove and movable in a direction perpendicular to the cutting groove, and transmitting ultrasonic waves to the cutting groove; and a wave transmitting/receiving unit that receives the ultrasonic waves reflected from the cutting groove, and outputting an ultrasonic oscillation signal to the wave transmitting/receiving unit, and combining the ultrasonic oscillation signal with a receiving signal input from the wave transmitting/receiving unit. The present invention is characterized by comprising: a detecting section that detects the shape of the cutting groove based on the shape of the cutting groove; and a moving means that moves the wave transmitting/receiving section in a direction perpendicular to the cutting groove.

[0007] Furthermore, in order to achieve the above object, the present invention sets the depth dimension of the cutting groove to be machined on the workpiece in advance, and sets the cutting height of the cutting blade based on the set depth dimension. , while machining a cutting groove on the workpiece with the cutting blade, actually measuring the depth dimension of the cutting groove with an ultrasonic detection means, comparing the actually measured depth dimension with a preset depth dimension, and comparing the result. Based on this, the cutting height position of the cutting blade is corrected so that the depth of the cutting groove becomes the set dimension.

Furthermore, since the thickness of the workpieces varies, the thickness of each workpiece is measured by ultrasonic waves using this device prior to cutting, and is used to control the cutting height 2.

[0009]

[Operation] According to the present invention, a cutting blade is arranged parallel to the moving direction of the movable table on which the work is placed to form a cutting groove in the work, and a wave transmitting/receiving section is arranged above the cutting groove. is moved by a moving means in a direction perpendicular to the cutting groove, the transmitter/receiver section transmits ultrasonic waves to the cutting groove, and the ultrasonic wave reflected from the cutting groove is received, and the detection section generates an ultrasonic oscillation signal. The shape of the cut groove is detected based on the received wave signal inputted from the wave transmitting/receiving section. Therefore, it is possible to measure the shape of the cut groove in real time and constantly monitor it.
Furthermore, it is possible to measure cutting grooves without attaching machining powder or the like to the workpiece surface.

Further, according to the present invention, the thickness of the workpiece is measured before cutting, and then the actually measured depth dimension is compared with a preset depth dimension, and based on the comparison result, the depth of the cutting groove is determined as described above. Since the cutting height position of the cutting blade can be corrected to meet the set dimensions, the blade height can be automatically adjusted in response to variations in workpiece thickness, variations in blade quality, and changes in cutting conditions. can be controlled.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the dicing apparatus and method according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a plan view of a dicing apparatus according to the present invention, and as shown in the figure, a dicing apparatus 10 includes a cutting section 11, a wave transmitting/receiving section 12, a detecting section 13, a moving means 14, and a moving table 15. There is. The motor 16 of the cutting section 11 is provided on the main body (not shown) of the dicing device 10 so as to be movable up and down, and a spindle 18 is coaxially fixed to the rotating shaft of the motor 16. The spindle 18 has a disc-shaped cutting blade,
That is, the blade 20 is fixed.

A movable table 15 on which a workpiece 22 is placed is provided below the cutting section 11. The movable table 15 is provided above the main body of the dicing apparatus 10 so as to be movable in the directions of arrows X1-X2 and Y1-Y2 in FIG. Therefore, when the motor 16 is driven and the blade 20 is rotated at high speed, the blade 20 is lowered, and the blade 20 processes the workpiece 22 while moving the movable table 15 in the direction of the arrow X2.
2A is processed.

A wave transmitting/receiving section 12 is provided above the cutting groove 22A. One end of the arm 26 of the wave transmitting/receiving section 12 is rotatably supported by the main body of the dicing device 10 via a pin 28. An ultrasonic transmitting/receiving sensor 34 is fixed to the other end of the arm 26, and the ultrasonic transmitting/receiving sensor 34 is arranged above the cutting groove 22A. The ultrasonic transmitting/receiving sensor 34 is provided with a transmitting crystal oscillator and a receiving crystal oscillator, and the transmitting crystal oscillator is an ultrasonic oscillator 36 described later.
The receiving crystal oscillator can receive the ultrasonic waves reflected from the workpiece 22 . Further, the ultrasonic transmitting/receiving sensor 34 is provided with a converging lens below the transmitting crystal oscillator.

The ultrasonic transmitting/receiving sensor 34 includes a detecting section 1.
3 is connected. As described above, the ultrasonic oscillator 36 of the detection unit 13 can apply an ultrasonic oscillation signal to the wave transmitting crystal oscillator of the ultrasonic transmitting/receiving sensor 34. Further, the detector 38 of the detection unit 13 receives the signal output from the receiving crystal oscillator of the ultrasonic transmitting/receiving sensor 34, and determines the reflection intensity of the ultrasonic wave and the reflected ultrasonic wave based on the ultrasonic oscillation signal and the received signal. You can measure the time it takes to get back.

Further, moving means 1 are provided on both sides of the arm 26.
4 piezoelectric elements 30, 30 are fixed, and this piezoelectric element 30
, 30 are also fixed to the main body of the dicing device 10. The oscillator 32 of the moving means 14 is composed of piezoelectric elements 30, 3.
An oscillating voltage can be applied to the pin 28, thereby allowing the arm 26 to rotate in the direction of arrow A--A using the pin 28 as a fulcrum.

In addition, in FIG. 2, reference numeral 46 indicates a mounting tool (
(not shown), and the workpiece 22 is fixed to the movable table 15 via the fixture. The operation of the dicing apparatus configured as described above will be explained. First, the motor 16 is driven to rotate the blade 20 at high speed and supply cutting water and the like to the blade 20. In this state, when the motor 16 is lowered to machine the blade 20 and the movable table 15 is moved in the direction of arrow X2, the cutting groove 22A is machined in the workpiece 22. At the same time, a voltage is applied from the oscillator 32 to the piezoelectric elements 30, 30. Therefore, since the piezoelectric elements 30, 30 vibrate, the arm 26 rotates in the direction of arrow A--A using the pin 28 as a fulcrum. Thereby, the ultrasonic transmitting/receiving sensor 34 reciprocates in the width direction of the cutting groove 22A. Furthermore, since the movable table 15 is moving in the direction of the arrow X2, the ultrasonic transmission/reception sensor 34 can detect the width direction of the cut groove 22A as well as the longitudinal direction of the cut groove 22A.

While the ultrasonic transmitting/receiving sensor 34 is moving in this manner, an oscillating voltage is applied from the ultrasonic oscillator 36 to the ultrasonic transmitting/receiving sensor 34, and a voltage from the crystal oscillator for transmitting waves of the ultrasonic transmitting/receiving sensor 34 is applied. Emits ultrasonic waves. The oscillated ultrasonic waves are sent to the workpiece 22 through a converging lens, reflected by the workpiece 22, and received by a receiving crystal oscillator. The received reflected ultrasonic waves are converted into electrical signals by a receiving crystal oscillator and applied to the detector 38 . The detector 38 measures the reflected intensity of the ultrasonic wave and the time it takes for the ultrasonic wave to be reflected and return based on the electrical signal. Therefore, for example, Figure 2
As shown in FIG. 2, when a defect 22B occurs in the processed portion of the workpiece 22, the reflected intensity of the ultrasonic waves becomes weaker and the time it takes for the ultrasonic waves to be reflected and return becomes longer. As a result, a defect in the vicinity of the cutting groove 22A of the workpiece 22 is detected. In this way, according to the dicing apparatus of the present invention, the workpiece 22
The width and shape of the cut groove 22A can be measured.

Furthermore, according to the dicing apparatus of the present invention, the depth of the cut groove 22A machined in the workpiece 22 can be detected, so that the depth of the cut groove 22A can be detected as shown in FIG. By comparison, the cutting height position of the blade 20 can be corrected. The processing method using the dicing apparatus of the present invention will be explained below according to the flowchart of FIG.

First, the depth (D1) of the cutting groove 22A shown in FIG.
) or set the uncut amount (D2) (step 50
). Next, measure the thickness (D3) of the workpiece (step 49).
) or the tape uncut amount (D2), the cutting height position of the blade 20 is set (step 52), and after the setting is completed, cutting is started (step 54). At the same time as cutting is started, the depth of the cutting groove 22A is measured by the wave transmitting/receiving section 12 and the detecting section 13 (step 56). Cutting groove 2 measured next
The depth of the groove 2A and the set depth of the cutting groove 22A (D1
), and it is determined whether or not the cutting height of the blade 20 needs to be corrected based on the comparison result (step 58). If the cutting height of the blade 20 does not need to be corrected, the blade 20 continues cutting (step 60). If the cutting height of the blade 20 needs to be corrected, the cutting height of the blade 20 is corrected (step 62) and cutting is continued (step 64). Thereby, the cutting groove 22A having a constant depth can be machined at all times. In addition, in FIG. 2, dimension D4 indicates the thickness of the tape, and dimension D5 indicates the amount of incision of the tape.

[0020]

As explained above, according to the dicing apparatus and method of the present invention, the cutting blade forms a cutting groove on the workpiece, and the detection means transmits ultrasonic waves to the cutting groove.
The shape of the cut groove is measured by receiving the ultrasonic waves reflected by the cut groove. Therefore, the shape of the cut groove immediately after machining can be measured while supplying cutting water, etc., and ultrasonic measurement can process data in a short time. This allows the width and shape of the cut groove to be measured in real time and constantly monitored. Furthermore, in the case of ultrasonic measurement, there is no need to remove cutting water or the like on the surface of the workpiece by air blowing, so it is possible to prevent problems such as processing powder or the like from adhering to the dry surface of the workpiece.

On the other hand, since the ultrasonic measurement allows the width and shape of the cut groove to be constantly monitored, the depth of the cut groove can be accurately measured. Therefore, the cutting height position of the blade can be automatically controlled in response to variations in workpiece thickness, variations in blade quality, and variations in cutting conditions.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a dicing apparatus according to the present invention.

FIG. 2 is a sectional view taken along line 2-2 in FIG. 1;

FIG. 3 is a flowchart showing a dicing method according to the present invention.

[Explanation of symbols]

10... Dicing device 11...Cutting part 12... Wave transmitting/receiving section 13...Detection section 14...Means of transportation 15...Movable table 20...Cutting blade 22...Work 22A...cutting groove

Claims (2)

[Claims] 1. A movable table movably provided on a main body and on which a work is placed; a cutting section having a cutting blade and rotating the cutting blade to machine a cutting groove in the work;
It is arranged above the cutting groove and is movable in a direction orthogonal to the cutting groove, and transmits ultrasonic waves to the cutting groove and receives ultrasonic waves reflected from the cutting groove. a detection unit that outputs an ultrasonic oscillation signal to the wave transmission and reception unit and detects the shape of the cutting groove based on the ultrasonic oscillation signal and a reception signal input from the wave transmission and reception unit; A dicing apparatus comprising: a moving means for moving the wave transmitting/receiving section in a direction perpendicular to the cutting groove. 2. Setting the depth dimension of the cutting groove to be machined on the workpiece in advance, setting the cutting height of the cutting blade based on the set depth dimension, and machining the cutting groove on the workpiece with the cutting blade. At the same time, the depth dimension of the cutting groove is actually measured using an ultrasonic detection means, and the measured depth dimension is compared with a preset depth dimension, and based on the comparison result, the depth of the cutting groove is determined to be the set dimension. A dicing method characterized in that the cutting height position of the cutting blade is corrected so that the height of the cutting blade is adjusted.