DE69402227T2 - Leiterplattenanordnung - Google Patents

Leiterplattenanordnung

Info

Publication number
DE69402227T2
DE69402227T2 DE69402227T DE69402227T DE69402227T2 DE 69402227 T2 DE69402227 T2 DE 69402227T2 DE 69402227 T DE69402227 T DE 69402227T DE 69402227 T DE69402227 T DE 69402227T DE 69402227 T2 DE69402227 T2 DE 69402227T2
Authority
DE
Germany
Prior art keywords
pcb arrangement
pcb
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69402227T
Other languages
English (en)
Other versions
DE69402227D1 (de
Inventor
Ronald Alex Nordin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69402227D1 publication Critical patent/DE69402227D1/de
Application granted granted Critical
Publication of DE69402227T2 publication Critical patent/DE69402227T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
DE69402227T 1993-02-08 1994-01-26 Leiterplattenanordnung Expired - Fee Related DE69402227T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/014,936 US5353192A (en) 1993-02-08 1993-02-08 Circuit card assembly

Publications (2)

Publication Number Publication Date
DE69402227D1 DE69402227D1 (de) 1997-04-30
DE69402227T2 true DE69402227T2 (de) 1997-09-25

Family

ID=21768654

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69402227T Expired - Fee Related DE69402227T2 (de) 1993-02-08 1994-01-26 Leiterplattenanordnung

Country Status (4)

Country Link
US (1) US5353192A (de)
EP (1) EP0611068B1 (de)
CA (1) CA2112916C (de)
DE (1) DE69402227T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
US5459640A (en) * 1994-09-23 1995-10-17 Motorola, Inc. Electrical module mounting apparatus and method thereof
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5559675A (en) * 1995-03-28 1996-09-24 Twinhead International Corp. Computer CPU heat dissipating and protecting device
US5826643A (en) * 1996-06-07 1998-10-27 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink
US5831826A (en) * 1996-09-20 1998-11-03 Motorola, Inc. Heat transfer apparatus suitable for use in a circuit board assembly
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module
US5794454A (en) * 1996-12-04 1998-08-18 International Business Machines Corporation Cooling device for hard to access non-coplanar circuit chips
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
US6167952B1 (en) 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US5956229A (en) * 1998-04-01 1999-09-21 Intel Corporation Injection molded thermal interface system
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
US6213195B1 (en) 1998-12-23 2001-04-10 Hamilton Sundstrand Corporation Modular coolant manifold for use with power electronics devices having integrated coolers
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US7095620B2 (en) * 2002-11-27 2006-08-22 International Business Machines Corp. Optically connectable circuit board with optical component(s) mounted thereon
CA2604255A1 (en) * 2005-04-13 2006-10-19 Sierra Wireless, Inc. Methods and apparatuses for thermal dissipation
DE602005022783D1 (de) * 2005-06-23 2010-09-16 Ericsson Telefon Ab L M Kühlbaugruppe
DE102006033310A1 (de) 2006-07-17 2008-01-31 Evonik Degussa Gmbh Gemische aus siliciumhaltigen Kopplungsreagentien
CN101222006A (zh) * 2007-01-12 2008-07-16 泰硕电子股份有限公司 带散热装置的发光二极管(二)
CN101222007A (zh) * 2007-01-12 2008-07-16 泰硕电子股份有限公司 带散热装置的发光二极管(三)
US7978472B2 (en) * 2009-06-10 2011-07-12 International Business Machines Corporation Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
US8531822B2 (en) 2011-07-29 2013-09-10 Hamilton Sundstrand Corporation Cooling and controlling electronics
US9398723B2 (en) 2013-08-29 2016-07-19 Eaton Corporation Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
TWM496091U (zh) * 2014-03-26 2015-02-21 Leadray Energy Co Ltd 具矽基座的發光二極體及發光二極體燈具
US9750127B2 (en) 2015-12-04 2017-08-29 General Electric Company Circuit card assembly including heat transfer assembly and method of manufacturing such

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
GB8601746D0 (en) * 1986-01-24 1986-02-26 British Telecomm Heat sink
EP0281404A3 (de) * 1987-03-04 1989-11-23 Nec Corporation Kühlungsvorrichtung für elektronische Baugruppe
JPS6420699A (en) * 1987-07-15 1989-01-24 Fujitsu Ltd Radiating structure of electronic component
US5095404A (en) * 1990-02-26 1992-03-10 Data General Corporation Arrangement for mounting and cooling high density tab IC chips
US5262922A (en) * 1990-07-26 1993-11-16 Fujitsu, Limited Heat radiation structure for semiconductor device
US5173839A (en) * 1990-12-10 1992-12-22 Grumman Aerospace Corporation Heat-dissipating method and device for led display

Also Published As

Publication number Publication date
US5353192A (en) 1994-10-04
CA2112916A1 (en) 1994-08-09
EP0611068A1 (de) 1994-08-17
CA2112916C (en) 1997-12-02
EP0611068B1 (de) 1997-03-26
DE69402227D1 (de) 1997-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee