DE69401726D1 - Verbundverfahren von Substraten mit Silikonkautschuk - Google Patents

Verbundverfahren von Substraten mit Silikonkautschuk

Info

Publication number
DE69401726D1
DE69401726D1 DE69401726T DE69401726T DE69401726D1 DE 69401726 D1 DE69401726 D1 DE 69401726D1 DE 69401726 T DE69401726 T DE 69401726T DE 69401726 T DE69401726 T DE 69401726T DE 69401726 D1 DE69401726 D1 DE 69401726D1
Authority
DE
Germany
Prior art keywords
substrates
silicone rubber
composite process
composite
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69401726T
Other languages
English (en)
Other versions
DE69401726T2 (de
Inventor
Masayuki Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE69401726D1 publication Critical patent/DE69401726D1/de
Application granted granted Critical
Publication of DE69401726T2 publication Critical patent/DE69401726T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69401726T 1993-05-18 1994-05-17 Verbundverfahren von Substraten mit Silikonkautschuk Expired - Lifetime DE69401726T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5139332A JPH06329997A (ja) 1993-05-18 1993-05-18 シリコーンゴムによる基材の接着方法

Publications (2)

Publication Number Publication Date
DE69401726D1 true DE69401726D1 (de) 1997-03-27
DE69401726T2 DE69401726T2 (de) 1997-06-19

Family

ID=15242857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401726T Expired - Lifetime DE69401726T2 (de) 1993-05-18 1994-05-17 Verbundverfahren von Substraten mit Silikonkautschuk

Country Status (4)

Country Link
US (2) US5486257A (de)
EP (1) EP0630952B1 (de)
JP (1) JPH06329997A (de)
DE (1) DE69401726T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389170A (en) * 1993-06-11 1995-02-14 Dow Corning Corporation Method for bonding substrates using molten moisture reactive organosiloxane compositions
JPH0912892A (ja) * 1995-07-04 1997-01-14 Toray Dow Corning Silicone Co Ltd 現場成形ガスケット用シリコーンゴム組成物
EP0915753B1 (de) * 1996-05-06 2003-01-29 Ameron International Corporation Siloxan modifizierte klebstoff- / klebefläche-systeme
WO1999009681A2 (de) * 1997-08-19 1999-02-25 Valeo Auto-Electric Wischer Und Motoren Gmbh Mit einem silicon-gel an eine scheibe angekoppelter sensor
US6316099B1 (en) 1999-03-31 2001-11-13 3M Innovative Properties Company Multi-layered sealant
US6313448B1 (en) 1999-10-21 2001-11-06 3M Innovative Properties Company Adhesive bonding method and device
US6595660B2 (en) * 2001-03-27 2003-07-22 General Electric Company Silicone adhesive for lamp lens attachment
JP4796704B2 (ja) 2001-03-30 2011-10-19 株式会社タイカ 押出可能な架橋済グリース状放熱材を充填・封入した容器の製法
US7470452B1 (en) 2002-06-13 2008-12-30 E. I. Du Pont De Nemours & Company Process for multilayer coating of substrates
JP3935133B2 (ja) * 2003-11-07 2007-06-20 本田技研工業株式会社 重畳部の形成方法
US20050112286A1 (en) * 2003-11-25 2005-05-26 Nguyen Phui Q. Process for multilayer coating of substrates
KR101747462B1 (ko) * 2009-10-09 2017-06-14 우베 고산 가부시키가이샤 착색 폴리이미드 성형체 및 그의 제조 방법
CN101665623B (zh) * 2009-10-15 2011-07-06 成都拓利化工实业有限公司 一种双组分加成型自粘硅橡胶
JPWO2012137977A1 (ja) * 2011-04-08 2014-07-28 東レ・ダウコーニング株式会社 被膜形成用組成物
JP7485049B2 (ja) * 2020-07-28 2024-05-16 信越化学工業株式会社 熱ラジカル硬化可能なオルガノポリシロキサン組成物、該組成物で接着、コーティング又はポッティングされた物品、及び該組成物の硬化物を製造する方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034140A (en) * 1975-07-31 1977-07-05 Dow Corning Corporation Heat-curable silicone elastomers having unprimed adhesion
DE2855192C2 (de) * 1978-12-21 1980-05-22 Th. Goldschmidt Ag, 4300 Essen In Abwesenheit von Feuchtigkeit bei Raumtemperatur lagerfähige PoIysiloxanformmasse
JPS61247756A (ja) * 1985-04-26 1986-11-05 Toray Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物
US4614760A (en) * 1985-09-27 1986-09-30 Dow Corning Corporation Low consistency, one-part silicone elastomers
JPS62252456A (ja) * 1986-04-24 1987-11-04 Toray Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物
US5091445A (en) * 1990-05-04 1992-02-25 Dow Corning Corporation Silicone sealants

Also Published As

Publication number Publication date
EP0630952B1 (de) 1997-02-12
JPH06329997A (ja) 1994-11-29
EP0630952A1 (de) 1994-12-28
US5486258A (en) 1996-01-23
DE69401726T2 (de) 1997-06-19
US5486257A (en) 1996-01-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: KROHER, STROBEL RECHTS- UND PATENTANWAELTE, 80336

8328 Change in the person/name/address of the agent

Representative=s name: DR. SCHOEN & PARTNER, 80336 MUENCHEN