DE69327937T2 - Kapazitätselektrodenvorrichtung zur Untersuchung von unterbrochenen Lötstellen in Leiterplattenbaugruppen - Google Patents

Kapazitätselektrodenvorrichtung zur Untersuchung von unterbrochenen Lötstellen in Leiterplattenbaugruppen

Info

Publication number
DE69327937T2
DE69327937T2 DE69327937T DE69327937T DE69327937T2 DE 69327937 T2 DE69327937 T2 DE 69327937T2 DE 69327937 T DE69327937 T DE 69327937T DE 69327937 T DE69327937 T DE 69327937T DE 69327937 T2 DE69327937 T2 DE 69327937T2
Authority
DE
Germany
Prior art keywords
examining
circuit board
printed circuit
capacitance electrode
electrode device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69327937T
Other languages
English (en)
Other versions
DE69327937D1 (de
Inventor
Ronald K Kerschner
David T Crook
Lisa M Kent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE69327937D1 publication Critical patent/DE69327937D1/de
Application granted granted Critical
Publication of DE69327937T2 publication Critical patent/DE69327937T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
DE69327937T 1992-11-25 1993-11-18 Kapazitätselektrodenvorrichtung zur Untersuchung von unterbrochenen Lötstellen in Leiterplattenbaugruppen Expired - Fee Related DE69327937T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/981,665 US5420500A (en) 1992-11-25 1992-11-25 Pacitive electrode system for detecting open solder joints in printed circuit assemblies

Publications (2)

Publication Number Publication Date
DE69327937D1 DE69327937D1 (de) 2000-04-06
DE69327937T2 true DE69327937T2 (de) 2000-11-02

Family

ID=25528561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69327937T Expired - Fee Related DE69327937T2 (de) 1992-11-25 1993-11-18 Kapazitätselektrodenvorrichtung zur Untersuchung von unterbrochenen Lötstellen in Leiterplattenbaugruppen

Country Status (4)

Country Link
US (2) US5420500A (de)
EP (1) EP0599544B1 (de)
JP (1) JPH06213955A (de)
DE (1) DE69327937T2 (de)

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US7068039B2 (en) * 2004-04-28 2006-06-27 Agilent Technologies, Inc. Test structure embedded in a shipping and handling cover for integrated circuit sockets and method for testing integrated circuit sockets and circuit assemblies utilizing same
US7123022B2 (en) * 2004-04-28 2006-10-17 Agilent Technologies, Inc. Method and apparatus for non-contact testing and diagnosing electrical paths through connectors on circuit assemblies
TWI232949B (en) * 2004-05-20 2005-05-21 Wan-Chiuan Jou Thin film-type wafer testing apparatus and probing sensing as well as transporting structure
US7224169B2 (en) 2004-11-02 2007-05-29 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
US7208957B2 (en) * 2005-03-01 2007-04-24 Agilent Technologies, Inc. Method for non-contact testing of fixed and inaccessible connections without using a sensor plate
US7057395B1 (en) 2005-03-04 2006-06-06 Agilent Technologies, Inc. Method for diagnosing open defects on non-contacted nodes of an electronic device from measurements of capacitively coupled nodes
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US7362106B2 (en) * 2005-06-29 2008-04-22 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes
US7327148B2 (en) * 2005-06-29 2008-02-05 Agilent Technologies, Inc. Method for using internal semiconductor junctions to aid in non-contact testing
US7307426B2 (en) * 2005-07-12 2007-12-11 Agilent Technologies, Inc. Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices
US7307427B2 (en) * 2005-07-23 2007-12-11 Agilent Technologies, Inc. Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards
US7478741B1 (en) * 2005-08-02 2009-01-20 Sun Microsystems, Inc. Solder interconnect integrity monitor
US7622931B2 (en) * 2005-10-03 2009-11-24 University Of Utah Research Foundation Non-contact reflectometry system and method
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US7279907B2 (en) * 2006-02-28 2007-10-09 Freescale Semiconductor, Inc. Method of testing for power and ground continuity of a semiconductor device
US7295031B1 (en) 2006-07-12 2007-11-13 Agilent Technologies, Inc. Method for non-contact testing of marginal integrated circuit connections
US7702981B2 (en) * 2007-03-29 2010-04-20 Intel Corporation Structural testing using boundary scan techniques
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US9041659B2 (en) * 2007-07-26 2015-05-26 N-Trig Ltd. System and method for diagnostics of a grid based digitizer
US8179143B2 (en) * 2008-10-15 2012-05-15 Test Research, Inc. Apparatus for testing printed circuit and method therefor
DE102009021627A1 (de) * 2009-05-16 2010-11-18 Wolf & Wölfel GmbH Verfahren und Vorrichtung zum Prüfen von Steckverbindern mit insbesondere zahlreichen und eng benachbarten Kontakten
US8907694B2 (en) * 2009-12-17 2014-12-09 Xcerra Corporation Wiring board for testing loaded printed circuit board
US8310256B2 (en) * 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
TWI383160B (zh) * 2009-12-31 2013-01-21 Test Research Inc 電性連接瑕疵偵測系統及方法
TWI383159B (zh) * 2009-12-31 2013-01-21 Test Research Inc 電性連接瑕疵偵測裝置
US8933722B2 (en) * 2011-08-31 2015-01-13 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
US8896320B2 (en) * 2011-08-31 2014-11-25 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
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US20140159749A1 (en) * 2012-12-08 2014-06-12 Masco Corporation Automatic faucet sensor and attachment for the same
US9121884B2 (en) 2013-06-07 2015-09-01 Infineon Technologies Ag Capacitive test method, apparatus and system for semiconductor packages
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Also Published As

Publication number Publication date
DE69327937D1 (de) 2000-04-06
US5420500A (en) 1995-05-30
US5498964A (en) 1996-03-12
JPH06213955A (ja) 1994-08-05
EP0599544B1 (de) 2000-03-01
EP0599544A1 (de) 1994-06-01

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee