DE69327135T2 - Halbleiteranordnung mit mehreren Halbleiterchips - Google Patents

Halbleiteranordnung mit mehreren Halbleiterchips

Info

Publication number
DE69327135T2
DE69327135T2 DE1993627135 DE69327135T DE69327135T2 DE 69327135 T2 DE69327135 T2 DE 69327135T2 DE 1993627135 DE1993627135 DE 1993627135 DE 69327135 T DE69327135 T DE 69327135T DE 69327135 T2 DE69327135 T2 DE 69327135T2
Authority
DE
Germany
Prior art keywords
semiconductor
several
arrangement
chips
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1993627135
Other languages
English (en)
Other versions
DE69327135D1 (de
Inventor
Yukio Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE69327135D1 publication Critical patent/DE69327135D1/de
Application granted granted Critical
Publication of DE69327135T2 publication Critical patent/DE69327135T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE1993627135 1992-06-29 1993-05-28 Halbleiteranordnung mit mehreren Halbleiterchips Expired - Fee Related DE69327135T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16973092A JP3120575B2 (ja) 1992-06-29 1992-06-29 半導体装置

Publications (2)

Publication Number Publication Date
DE69327135D1 DE69327135D1 (de) 2000-01-05
DE69327135T2 true DE69327135T2 (de) 2000-04-27

Family

ID=15891791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1993627135 Expired - Fee Related DE69327135T2 (de) 1992-06-29 1993-05-28 Halbleiteranordnung mit mehreren Halbleiterchips

Country Status (4)

Country Link
US (1) US5350946A (de)
EP (1) EP0577264B1 (de)
JP (1) JP3120575B2 (de)
DE (1) DE69327135T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3073273U (ja) * 2000-05-16 2000-11-14 船井電機株式会社 光ピックアップ装置
JP2002043496A (ja) * 2000-07-21 2002-02-08 Hitachi Ltd 半導体装置
TWI374525B (en) * 2004-05-11 2012-10-11 Taiwan Semiconductor Mfg Cut-out heat slug for integrated circuit device packaging
DE102005050534B4 (de) * 2005-10-21 2008-08-07 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
JP4167715B1 (ja) * 2007-08-13 2008-10-22 オーナンバ株式会社 ツインチップ搭載型ダイオード
JP2012059876A (ja) * 2010-09-08 2012-03-22 Sanken Electric Co Ltd 半導体モジュール及びその製造方法
CN103650138B (zh) * 2011-08-25 2016-06-22 富士电机株式会社 半导体装置及其制造方法
JP6299120B2 (ja) * 2013-09-05 2018-03-28 富士電機株式会社 半導体モジュール
US10978366B2 (en) 2017-05-11 2021-04-13 Mitsubishi Electric Corporation Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
JPS5984459A (ja) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタモジユ−ル
US4815042A (en) * 1986-02-26 1989-03-21 Micro Chemical, Inc. Programmable apparatus and method for delivering microingredient feed additives to animals by weight
US4920405A (en) * 1986-11-28 1990-04-24 Fuji Electric Co., Ltd. Overcurrent limiting semiconductor device
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
JPH03263363A (ja) * 1990-02-23 1991-11-22 Fuji Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
EP0577264B1 (de) 1999-12-01
DE69327135D1 (de) 2000-01-05
US5350946A (en) 1994-09-27
JP3120575B2 (ja) 2000-12-25
JPH0613537A (ja) 1994-01-21
EP0577264A1 (de) 1994-01-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee