DE69326543D1 - Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung - Google Patents

Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung

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Publication number
DE69326543D1
DE69326543D1 DE69326543T DE69326543T DE69326543D1 DE 69326543 D1 DE69326543 D1 DE 69326543D1 DE 69326543 T DE69326543 T DE 69326543T DE 69326543 T DE69326543 T DE 69326543T DE 69326543 D1 DE69326543 D1 DE 69326543D1
Authority
DE
Germany
Prior art keywords
electronic device
threshold voltage
integrated structure
monolithically integrated
unidirectional conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69326543T
Other languages
English (en)
Other versions
DE69326543T2 (de
Inventor
Sergio Palara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CORIMME Consorzio per Ricerca Sulla Microelettronica nel Mezzogiorno
Original Assignee
CORIMME Consorzio per Ricerca Sulla Microelettronica nel Mezzogiorno
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CORIMME Consorzio per Ricerca Sulla Microelettronica nel Mezzogiorno filed Critical CORIMME Consorzio per Ricerca Sulla Microelettronica nel Mezzogiorno
Application granted granted Critical
Publication of DE69326543D1 publication Critical patent/DE69326543D1/de
Publication of DE69326543T2 publication Critical patent/DE69326543T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
    • H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • H01L27/0664—Vertical bipolar transistor in combination with diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7808—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69326543T 1993-04-28 1993-04-28 Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung Expired - Lifetime DE69326543T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93830180A EP0622849B1 (de) 1993-04-28 1993-04-28 Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung

Publications (2)

Publication Number Publication Date
DE69326543D1 true DE69326543D1 (de) 1999-10-28
DE69326543T2 DE69326543T2 (de) 2000-01-05

Family

ID=8215155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326543T Expired - Lifetime DE69326543T2 (de) 1993-04-28 1993-04-28 Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung

Country Status (4)

Country Link
US (1) US5521414A (de)
EP (1) EP0622849B1 (de)
JP (1) JPH07130963A (de)
DE (1) DE69326543T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0624906B1 (de) * 1993-05-13 2001-08-08 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Integrierte Schaltungsstruktur für den Schutz von Leistungsvorrichtung gegen Überspannungen
DE69327320T2 (de) * 1993-09-30 2000-05-31 Cons Ric Microelettronica Integrierte aktive Klammerungsstruktur für den Schutz von Leistungsanordnungen gegen Überspannungen, und Verfahren zu ihrer Herstellung
EP0657933B1 (de) * 1993-12-13 2000-06-28 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Integrierte aktive Klammerungsstruktur für den Schutz von Leistungshalbleiterbauelementen gegen Überspannungen
FR2725307B1 (fr) * 1994-09-30 1996-12-20 Sgs Thomson Microelectronics Composant semiconducteur d'alimentation, de recirculation et de demagnetisation d'une charge selfique
EP0809293B1 (de) * 1996-05-21 2001-08-29 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Leistungshalbleiterstruktur mit einem durch den Vertikaltransistor gesteuerten Lateraltransistor
JP2943738B2 (ja) * 1996-11-29 1999-08-30 日本電気株式会社 半導体装置における静電保護回路
US6160292A (en) * 1997-04-23 2000-12-12 International Business Machines Corporation Circuit and methods to improve the operation of SOI devices
FR2764136B1 (fr) * 1997-05-28 1999-08-13 Sgs Thomson Microelectronics Protection contre des surtensions d'un transistor mos de puissance integre
IT1296832B1 (it) * 1997-12-02 1999-08-02 Sgs Thomson Microelectronics Struttura integrata di protezione con dispositivi a soglia di conduzione inversa prestabilita di polarizzazione
JP3255147B2 (ja) * 1998-06-19 2002-02-12 株式会社デンソー 絶縁ゲート型トランジスタのサージ保護回路
US6429489B1 (en) 2001-05-18 2002-08-06 International Business Machines Corporation Electrostatic discharge power clamp circuit
US6798041B1 (en) * 2002-06-19 2004-09-28 Micrel, Inc. Method and system for providing a power lateral PNP transistor using a buried power buss
JP3998583B2 (ja) * 2003-01-31 2007-10-31 株式会社東芝 光半導体装置
DE102011079569B4 (de) * 2011-07-21 2013-11-07 Hs Elektronik Systeme Gmbh Leistungs- oder Stromverteilungssystem eines Flugzeuges mit einer aktiven Transistor-Klemmschaltung sowie zugehöriges Verfahren zum aktiven Pegelhalten
US10290702B2 (en) 2012-07-31 2019-05-14 Silanna Asia Pte Ltd Power device on bulk substrate
US8994105B2 (en) * 2012-07-31 2015-03-31 Azure Silicon LLC Power device integration on a common substrate
US9412881B2 (en) 2012-07-31 2016-08-09 Silanna Asia Pte Ltd Power device integration on a common substrate
EP2757688B1 (de) * 2013-01-18 2019-05-22 HS Elektronik Systeme GmbH Aktive geklemmte Transistorschaltung für Niedertemperaturbetriebsbedingungen
US9431532B1 (en) * 2015-02-13 2016-08-30 PowerWyse, Inc. System and method for fabricating high voltage power MOSFET
DE102015108091A1 (de) * 2015-05-21 2016-11-24 Infineon Technologies Dresden Gmbh Transistoranordnung mit Leistungstransistoren und spannungslimitierenden Bauteilen
US9923059B1 (en) 2017-02-20 2018-03-20 Silanna Asia Pte Ltd Connection arrangements for integrated lateral diffusion field effect transistors
US10083897B2 (en) 2017-02-20 2018-09-25 Silanna Asia Pte Ltd Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568669A (en) * 1978-11-17 1980-05-23 Fuji Electric Co Ltd Fabrication method of semiconductor device containing overvoltage protecting zener diode
JPS59198768A (ja) * 1983-04-26 1984-11-10 Nec Corp ツエナ−ダイオ−ド
JP2724146B2 (ja) * 1987-05-29 1998-03-09 日産自動車株式会社 縦形ｍｏｓｆｅｔ
JPS63301555A (ja) * 1987-06-01 1988-12-08 Nec Corp 半導体装置
US4736271A (en) * 1987-06-23 1988-04-05 Signetics Corporation Protection device utilizing one or more subsurface diodes and associated method of manufacture
JPH0465878A (ja) * 1990-07-06 1992-03-02 Fuji Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
EP0622849B1 (de) 1999-09-22
EP0622849A1 (de) 1994-11-02
US5521414A (en) 1996-05-28
JPH07130963A (ja) 1995-05-19
DE69326543T2 (de) 2000-01-05

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