DE69325241D1 - Überspannungsschutzeinrichtung - Google Patents
ÜberspannungsschutzeinrichtungInfo
- Publication number
- DE69325241D1 DE69325241D1 DE69325241T DE69325241T DE69325241D1 DE 69325241 D1 DE69325241 D1 DE 69325241D1 DE 69325241 T DE69325241 T DE 69325241T DE 69325241 T DE69325241 T DE 69325241T DE 69325241 D1 DE69325241 D1 DE 69325241D1
- Authority
- DE
- Germany
- Prior art keywords
- protection device
- surge protection
- surge
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/747—Bidirectional devices, e.g. triacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/06181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Emergency Protection Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Protection Of Static Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9214793A FR2699015B1 (fr) | 1992-12-04 | 1992-12-04 | Dispositif de protection contre des surtensions. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69325241D1 true DE69325241D1 (de) | 1999-07-15 |
DE69325241T2 DE69325241T2 (de) | 2000-01-27 |
Family
ID=9436364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69325241T Expired - Fee Related DE69325241T2 (de) | 1992-12-04 | 1993-11-29 | Überspannungsschutzeinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6252256B1 (de) |
EP (1) | EP0600810B1 (de) |
JP (1) | JPH0738063A (de) |
CA (1) | CA2110632A1 (de) |
DE (1) | DE69325241T2 (de) |
FR (1) | FR2699015B1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2734114B1 (fr) * | 1995-05-12 | 1997-07-25 | Sgs Thomson Microelectronics | Composant de protection sensible de circuit d'interface de lignes d'abonnes |
FR2734113B1 (fr) * | 1995-05-12 | 1997-07-25 | Sgs Thomson Microelectronics | Composant de protection complet de circuit d'interface de lignes d'abonnes |
DE19735542A1 (de) * | 1997-08-16 | 1999-02-18 | Bosch Gmbh Robert | Hochspannungsbauelement und Verfahren zu seiner Herstellung |
US7442629B2 (en) | 2004-09-24 | 2008-10-28 | President & Fellows Of Harvard College | Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate |
US7057256B2 (en) | 2001-05-25 | 2006-06-06 | President & Fellows Of Harvard College | Silicon-based visible and near-infrared optoelectric devices |
US6885223B2 (en) | 2003-05-09 | 2005-04-26 | Bae Systems Information And Electronic Systems Integration Inc. | Overvoltage detector |
US8212327B2 (en) * | 2008-03-06 | 2012-07-03 | Sionyx, Inc. | High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme |
US9911781B2 (en) | 2009-09-17 | 2018-03-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US9673243B2 (en) | 2009-09-17 | 2017-06-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US8692198B2 (en) | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
US20120146172A1 (en) | 2010-06-18 | 2012-06-14 | Sionyx, Inc. | High Speed Photosensitive Devices and Associated Methods |
FR2968835A1 (fr) * | 2010-12-09 | 2012-06-15 | St Microelectronics Tours Sas | Triac quatre quadrants |
US9496308B2 (en) | 2011-06-09 | 2016-11-15 | Sionyx, Llc | Process module for increasing the response of backside illuminated photosensitive imagers and associated methods |
JP2014525091A (ja) | 2011-07-13 | 2014-09-25 | サイオニクス、インク. | 生体撮像装置および関連方法 |
US9064764B2 (en) | 2012-03-22 | 2015-06-23 | Sionyx, Inc. | Pixel isolation elements, devices, and associated methods |
JP6466346B2 (ja) | 2013-02-15 | 2019-02-06 | サイオニクス、エルエルシー | アンチブルーミング特性を有するハイダイナミックレンジcmos画像センサおよび関連づけられた方法 |
US9939251B2 (en) | 2013-03-15 | 2018-04-10 | Sionyx, Llc | Three dimensional imaging utilizing stacked imager devices and associated methods |
US9209345B2 (en) | 2013-06-29 | 2015-12-08 | Sionyx, Inc. | Shallow trench textured regions and associated methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396932A (en) * | 1978-06-16 | 1983-08-02 | Motorola, Inc. | Method for making a light-activated line-operable zero-crossing switch including two lateral transistors, the emitter of one lying between the emitter and collector of the other |
SE414357B (sv) * | 1978-08-17 | 1980-07-21 | Asea Ab | Overspenningsskydd for skydd av halvledarkomponenter av lageffekttyp |
SE430450B (sv) * | 1979-04-03 | 1983-11-14 | Asea Ab | Tvapoligt overstromsskydd for inkoppling i en stromforande ledning |
GB2184884B (en) * | 1985-12-20 | 1988-12-21 | Philips Electronic Associated | Bipolar semiconductor device |
FR2598043A1 (fr) * | 1986-04-25 | 1987-10-30 | Thomson Csf | Composant semiconducteur de protection contre les surtensions et surintensites |
US4905119A (en) * | 1988-06-27 | 1990-02-27 | Teccor Electronics, Inc. | Solid state overvoltage protection circuit |
US5150271A (en) * | 1990-08-21 | 1992-09-22 | Texas Instruments Incorporated | Telecommunication equipment protector |
US5220197A (en) * | 1991-07-22 | 1993-06-15 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
JP3142617B2 (ja) * | 1991-11-27 | 2001-03-07 | 新電元工業株式会社 | サージ防護素子 |
-
1992
- 1992-12-04 FR FR9214793A patent/FR2699015B1/fr not_active Expired - Fee Related
-
1993
- 1993-11-29 DE DE69325241T patent/DE69325241T2/de not_active Expired - Fee Related
- 1993-11-29 EP EP93420475A patent/EP0600810B1/de not_active Expired - Lifetime
- 1993-12-02 US US08/161,878 patent/US6252256B1/en not_active Expired - Lifetime
- 1993-12-03 JP JP5303705A patent/JPH0738063A/ja not_active Withdrawn
- 1993-12-03 CA CA002110632A patent/CA2110632A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JPH0738063A (ja) | 1995-02-07 |
FR2699015B1 (fr) | 1995-02-24 |
EP0600810B1 (de) | 1999-06-09 |
US6252256B1 (en) | 2001-06-26 |
DE69325241T2 (de) | 2000-01-27 |
CA2110632A1 (en) | 1994-06-05 |
FR2699015A1 (fr) | 1994-06-10 |
EP0600810A1 (de) | 1994-06-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |