DE69313583T2 - Methode zur Herstellung eines integrierten kapazitiven Transduktors - Google Patents

Methode zur Herstellung eines integrierten kapazitiven Transduktors

Info

Publication number
DE69313583T2
DE69313583T2 DE69313583T DE69313583T DE69313583T2 DE 69313583 T2 DE69313583 T2 DE 69313583T2 DE 69313583 T DE69313583 T DE 69313583T DE 69313583 T DE69313583 T DE 69313583T DE 69313583 T2 DE69313583 T2 DE 69313583T2
Authority
DE
Germany
Prior art keywords
diaphragm
making
substrate
capacitive transducer
transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69313583T
Other languages
English (en)
Other versions
DE69313583D1 (de
Inventor
Johan Wilhelm Berggvist
Felix Rudolf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Colibrys SA
Original Assignee
Centre Suisse dElectronique et Microtechnique SA CSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Suisse dElectronique et Microtechnique SA CSEM filed Critical Centre Suisse dElectronique et Microtechnique SA CSEM
Publication of DE69313583D1 publication Critical patent/DE69313583D1/de
Application granted granted Critical
Publication of DE69313583T2 publication Critical patent/DE69313583T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Measuring Fluid Pressure (AREA)
DE69313583T 1992-11-05 1993-11-02 Methode zur Herstellung eines integrierten kapazitiven Transduktors Expired - Lifetime DE69313583T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9213452A FR2697675B1 (fr) 1992-11-05 1992-11-05 Procédé de fabrication de transducteurs capacitifs intégrés.

Publications (2)

Publication Number Publication Date
DE69313583D1 DE69313583D1 (de) 1997-10-09
DE69313583T2 true DE69313583T2 (de) 1998-04-02

Family

ID=9435354

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69313583T Expired - Lifetime DE69313583T2 (de) 1992-11-05 1993-11-02 Methode zur Herstellung eines integrierten kapazitiven Transduktors

Country Status (7)

Country Link
US (1) US5408731A (de)
EP (1) EP0596456B1 (de)
JP (1) JPH06217396A (de)
AT (1) ATE157837T1 (de)
DE (1) DE69313583T2 (de)
DK (1) DK0596456T3 (de)
FR (1) FR2697675B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7673375B2 (en) 2005-06-17 2010-03-09 Industrial Technology Research Institute Method of fabricating a polymer-based capacitive ultrasonic transducer

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KR100314622B1 (ko) * 1999-06-15 2001-11-17 이형도 마이크로 센서 및 그 패키지방법
US6629461B2 (en) 2000-03-24 2003-10-07 Onix Microsystems, Inc. Biased rotatable combdrive actuator methods
US6593677B2 (en) 2000-03-24 2003-07-15 Onix Microsystems, Inc. Biased rotatable combdrive devices and methods
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US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
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US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
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US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE602004026862D1 (de) * 2003-05-26 2010-06-10 Sensfab Pte Ltd Herstellung von silicium-mikrophonen
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7449356B2 (en) 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
JP4535046B2 (ja) * 2006-08-22 2010-09-01 ヤマハ株式会社 静電容量センサ及びその製造方法
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
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JP4951067B2 (ja) 2006-07-25 2012-06-13 アナログ デバイシス， インコーポレイテッド 複数のマイクロホンシステム
US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
JP2010506532A (ja) * 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー 極低圧力センサーおよびその製造方法
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US8165323B2 (en) 2006-11-28 2012-04-24 Zhou Tiansheng Monolithic capacitive transducer
US8363860B2 (en) * 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
WO2010139050A1 (en) 2009-06-01 2010-12-09 Tiansheng Zhou Mems micromirror and micromirror array
EP2269746B1 (de) * 2009-07-02 2014-05-14 Nxp B.V. Kapazitiver Sensor mit Kollabiermodus
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
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US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
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US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
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Publication number Priority date Publication date Assignee Title
US7673375B2 (en) 2005-06-17 2010-03-09 Industrial Technology Research Institute Method of fabricating a polymer-based capacitive ultrasonic transducer

Also Published As

Publication number Publication date
JPH06217396A (ja) 1994-08-05
US5408731A (en) 1995-04-25
DE69313583D1 (de) 1997-10-09
FR2697675B1 (fr) 1995-01-06
EP0596456B1 (de) 1997-09-03
DK0596456T3 (da) 1998-04-14
EP0596456A1 (de) 1994-05-11
FR2697675A1 (fr) 1994-05-06
ATE157837T1 (de) 1997-09-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: COLIBRYS S.A., NEUCHATEL, CH