DE69311267D1 - Ätzregelssystem - Google Patents

Ätzregelssystem

Info

Publication number
DE69311267D1
DE69311267D1 DE69311267T DE69311267T DE69311267D1 DE 69311267 D1 DE69311267 D1 DE 69311267D1 DE 69311267 T DE69311267 T DE 69311267T DE 69311267 T DE69311267 T DE 69311267T DE 69311267 D1 DE69311267 D1 DE 69311267D1
Authority
DE
Germany
Prior art keywords
control system
etching control
etching
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69311267T
Other languages
English (en)
Other versions
DE69311267T2 (de
Inventor
Roland H Thoms
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BMC Industries Inc
Original Assignee
BMC Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/973,679 external-priority patent/US5378308A/en
Application filed by BMC Industries Inc filed Critical BMC Industries Inc
Publication of DE69311267D1 publication Critical patent/DE69311267D1/de
Application granted granted Critical
Publication of DE69311267T2 publication Critical patent/DE69311267T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0463—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length
    • B05B13/0468—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length with reciprocating or oscillating spray heads
    • B05B13/0473—Installation or apparatus for applying liquid or other fluent material to moving work of indefinite length with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/035—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material to several spraying apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
DE69311267T 1992-11-09 1993-10-12 Ätzregelssystem Expired - Fee Related DE69311267T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/973,679 US5378308A (en) 1992-11-09 1992-11-09 Etchant distribution apparatus
US08/095,400 US5387313A (en) 1992-11-09 1993-07-23 Etchant control system

Publications (2)

Publication Number Publication Date
DE69311267D1 true DE69311267D1 (de) 1997-07-10
DE69311267T2 DE69311267T2 (de) 1997-10-02

Family

ID=26790175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69311267T Expired - Fee Related DE69311267T2 (de) 1992-11-09 1993-10-12 Ätzregelssystem

Country Status (5)

Country Link
US (1) US5387313A (de)
EP (1) EP0599039B1 (de)
JP (1) JPH06212456A (de)
KR (1) KR100278702B1 (de)
DE (1) DE69311267T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5524654A (en) * 1994-01-13 1996-06-11 Kabushi Gaisha Ishii Hyoki Etching, developing and peeling apparatus for printed board
US5993681A (en) * 1998-05-08 1999-11-30 Lucent Technology, Inc. Method and apparatus for aiming a spray etcher nozzle
US6099660A (en) * 1999-01-06 2000-08-08 Warren W. Davis Apparatus and method for cleaning discrete materials
TW419395B (en) * 1999-10-29 2001-01-21 Acer Display Tech Inc Multi-directional liquid spraying device for wet process
KR100672632B1 (ko) * 2001-11-06 2007-02-09 엘지.필립스 엘시디 주식회사 액정표시소자의 약액교환방법 및 그 장치
US20040250837A1 (en) * 2003-06-13 2004-12-16 Michael Watson Ware wash machine with fluidic oscillator nozzles
US8037613B2 (en) 2004-09-02 2011-10-18 Rovcal, Inc. Shaving head for rotary shaver and method of manufacturing the same
US20090062909A1 (en) 2005-07-15 2009-03-05 Micell Technologies, Inc. Stent with polymer coating containing amorphous rapamycin
PL1909973T3 (pl) 2005-07-15 2019-01-31 Micell Technologies, Inc. Polimerowe powłoki zawierające proszek leku o kontrolowanej morfologii
ES2540059T3 (es) 2006-04-26 2015-07-08 Micell Technologies, Inc. Recubrimientos que contienen múltiples fármacos
CA2667228C (en) * 2006-10-23 2015-07-14 Micell Technologies, Inc. Holder for electrically charging a substrate during coating
JP5603598B2 (ja) 2007-01-08 2014-10-08 ミセル テクノロジーズ、インコーポレイテッド 生物分解層を有するステント
US11426494B2 (en) 2007-01-08 2022-08-30 MT Acquisition Holdings LLC Stents having biodegradable layers
US7951244B2 (en) * 2008-01-11 2011-05-31 Illinois Tool Works Inc. Liquid cleaning apparatus for cleaning printed circuit boards
CA2721832C (en) 2008-04-17 2018-08-07 Micell Technologies, Inc. Stents having bioabsorbable layers
AU2009270849B2 (en) 2008-07-17 2013-11-21 Micell Technologies, Inc. Drug delivery medical device
US8834913B2 (en) * 2008-12-26 2014-09-16 Battelle Memorial Institute Medical implants and methods of making medical implants
CA2756307C (en) * 2009-03-23 2017-08-08 Micell Technologies, Inc. Peripheral stents having layers and reinforcement fibers
CN102481195B (zh) 2009-04-01 2015-03-25 米歇尔技术公司 涂覆支架
EP2419058B1 (de) 2009-04-17 2018-02-28 Micell Technologies, Inc. Stents mit gesteuerter elution
EP2453834A4 (de) 2009-07-16 2014-04-16 Micell Technologies Inc Medizinische wirkstofffreisetzungsvorrichtung
WO2011097103A1 (en) 2010-02-02 2011-08-11 Micell Technologies, Inc. Stent and stent delivery system with improved deliverability
US8795762B2 (en) * 2010-03-26 2014-08-05 Battelle Memorial Institute System and method for enhanced electrostatic deposition and surface coatings
US10232092B2 (en) 2010-04-22 2019-03-19 Micell Technologies, Inc. Stents and other devices having extracellular matrix coating
EP2593039B1 (de) 2010-07-16 2022-11-30 Micell Technologies, Inc. Medizinische wirkstofffreisetzungsvorrichtung
US10464100B2 (en) 2011-05-31 2019-11-05 Micell Technologies, Inc. System and process for formation of a time-released, drug-eluting transferable coating
WO2013012689A1 (en) 2011-07-15 2013-01-24 Micell Technologies, Inc. Drug delivery medical device
US10188772B2 (en) 2011-10-18 2019-01-29 Micell Technologies, Inc. Drug delivery medical device
EP2967803B1 (de) 2013-03-12 2023-12-27 Micell Technologies, Inc. Bioabsorbierbare biomedizinische implantate
JP2016519965A (ja) 2013-05-15 2016-07-11 マイセル・テクノロジーズ，インコーポレイテッド 生体吸収性バイオメディカルインプラント
CN109225713A (zh) * 2017-04-28 2019-01-18 均豪精密工业股份有限公司 平台式喷洒装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3419446A (en) * 1965-02-15 1968-12-31 Chemcut Corp Method and means for continuous control of etching rate
US3401068A (en) * 1965-02-15 1968-09-10 Chemcut Corp Method and apparatus for uniformly etching printed circuits by control of the conveyor speed
US3756898A (en) * 1969-07-14 1973-09-04 Buckbee Mears Co Resistant system suitable for controlling etching without the aid of an etchant
US3669771A (en) * 1970-01-28 1972-06-13 Zenith Radio Corp Process of etching a shadow mask
US3645811A (en) * 1970-03-02 1972-02-29 Buckbee Mears Co Method and apparatus for controlling the size of perforations in a shadow mask
US3788912A (en) * 1971-11-10 1974-01-29 Buckbee Mears Co System suitable for controlling etching without the aid of an etchant resistant
US3808067A (en) * 1972-11-24 1974-04-30 Western Electric Co Method of controlling an etching process
US4124437A (en) * 1976-04-05 1978-11-07 Buckbee-Mears Company System for etching patterns of small openings on a continuous strip of metal
US4126510A (en) * 1977-10-06 1978-11-21 Rca Corporation Etching a succession of articles from a strip of sheet metal
JPS56139676A (en) * 1980-04-02 1981-10-31 Toshiba Corp Method and apparatus for etching metal sheet
US4397708A (en) * 1980-09-25 1983-08-09 Koltron Corporation Etching and etchant removal apparatus
JPS5976878A (ja) * 1982-10-26 1984-05-02 Hitachi Chem Co Ltd エツチングマシン
DE3539874A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Anlage zum aetzen von zumindest teilweise aus metall, vorzugsweise kupfer, bestehendem aetzgut
DE3807261A1 (de) * 1988-03-05 1989-09-14 Hoellmueller Maschbau H Maschine zum aetzen von gegenstaenden
EP0354266B1 (de) * 1988-08-12 1993-10-20 International Business Machines Corporation Verfahren und Vorrichtung zum Ätzen eines zumindest Teilweise aus Metall bestehenden Ätzguts
US4985111A (en) * 1990-03-02 1991-01-15 Chemcut Corporation Process and apparatus for intermittent fluid application
US5200023A (en) * 1991-08-30 1993-04-06 International Business Machines Corp. Infrared thermographic method and apparatus for etch process monitoring and control
US5228949A (en) * 1991-11-07 1993-07-20 Chemcut Corporation Method and apparatus for controlled spray etching

Also Published As

Publication number Publication date
EP0599039A1 (de) 1994-06-01
KR100278702B1 (ko) 2001-02-01
DE69311267T2 (de) 1997-10-02
JPH06212456A (ja) 1994-08-02
KR940012525A (ko) 1994-06-23
EP0599039B1 (de) 1997-06-04
US5387313A (en) 1995-02-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee