DE69304359D1 - Montageanordnung - Google Patents

Montageanordnung

Info

Publication number
DE69304359D1
DE69304359D1 DE69304359T DE69304359T DE69304359D1 DE 69304359 D1 DE69304359 D1 DE 69304359D1 DE 69304359 T DE69304359 T DE 69304359T DE 69304359 T DE69304359 T DE 69304359T DE 69304359 D1 DE69304359 D1 DE 69304359D1
Authority
DE
Germany
Prior art keywords
assembly arrangement
arrangement
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69304359T
Other languages
English (en)
Inventor
Robert Frederick Stucke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69304359D1 publication Critical patent/DE69304359D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
DE69304359T 1992-01-29 1993-01-27 Montageanordnung Expired - Lifetime DE69304359D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/827,240 US5335146A (en) 1992-01-29 1992-01-29 High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors

Publications (1)

Publication Number Publication Date
DE69304359D1 true DE69304359D1 (de) 1996-10-10

Family

ID=25248684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69304359T Expired - Lifetime DE69304359D1 (de) 1992-01-29 1993-01-27 Montageanordnung

Country Status (4)

Country Link
US (1) US5335146A (de)
EP (1) EP0554077B1 (de)
JP (1) JPH07111891B2 (de)
DE (1) DE69304359D1 (de)

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US6705895B2 (en) 2002-04-25 2004-03-16 Tyco Electronics Corporation Orthogonal interface for connecting circuit boards carrying differential pairs
US6836030B2 (en) * 2002-05-31 2004-12-28 Verari Systems, Inc. Rack mountable computer component power distribution unit and method
US6867966B2 (en) * 2002-05-31 2005-03-15 Verari Systems, Inc. Method and apparatus for rack mounting computer components
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US8444436B1 (en) * 2004-07-01 2013-05-21 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
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US20090291593A1 (en) 2005-06-30 2009-11-26 Prescott Atkinson High frequency broadside-coupled electrical connector
US7914304B2 (en) * 2005-06-30 2011-03-29 Amphenol Corporation Electrical connector with conductors having diverging portions
US7239528B1 (en) * 2005-10-05 2007-07-03 Cisco Technology, Inc. Techniques for accommodating variations in chassis tolerances
US7713068B2 (en) * 2006-12-06 2010-05-11 Fusion Multisystems, Inc. Apparatus, system, and method for a scalable, composite, reconfigurable backplane
US7298625B1 (en) * 2007-01-17 2007-11-20 Inventec Corporation Expansion structure of memory module slot
US7692930B2 (en) * 2007-07-31 2010-04-06 Hewlett-Packard Development Company, L.P. Low profile DIMM board
DE202007011113U1 (de) * 2007-08-09 2007-11-08 Mc Technology Gmbh Verdrahtungsleiterplatte
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics
US8391022B2 (en) * 2008-03-06 2013-03-05 Oracle America, Inc. Multi-function mezzanine board alignment and mounting device, with integrated handle
WO2011140438A2 (en) 2010-05-07 2011-11-10 Amphenol Corporation High performance cable connector
WO2012106554A2 (en) 2011-02-02 2012-08-09 Amphenol Corporation Mezzanine connector
CN102710423A (zh) * 2012-05-14 2012-10-03 中兴通讯股份有限公司 一种atca背板
CN104704682B (zh) 2012-08-22 2017-03-22 安费诺有限公司 高频电连接器
US9716327B2 (en) * 2012-09-28 2017-07-25 Intel Corporation System, circuit module, and circuit module connector
US9826640B2 (en) * 2013-06-26 2017-11-21 E Ink Holdings Inc. Electronic apparatus
JP2015035546A (ja) * 2013-08-09 2015-02-19 東芝シュネデール・インバータ株式会社 プリント基板
DE102013217270A1 (de) * 2013-08-29 2015-03-05 Zf Friedrichshafen Ag Leiterplattenvorrichtung mit einem Steckkontakt
US9905975B2 (en) 2014-01-22 2018-02-27 Amphenol Corporation Very high speed, high density electrical interconnection system with edge to broadside transition
TW201611675A (zh) * 2014-09-01 2016-03-16 廣達電腦股份有限公司 電路板結構之改良方法
US10541482B2 (en) 2015-07-07 2020-01-21 Amphenol Fci Asia Pte. Ltd. Electrical connector with cavity between terminals
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
US10243304B2 (en) 2016-08-23 2019-03-26 Amphenol Corporation Connector configurable for high performance
US10109959B1 (en) * 2017-05-25 2018-10-23 Juniper Networks, Inc. Electrical connector with embedded processor
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN109788697B (zh) 2018-12-04 2021-04-09 华为技术有限公司 具有平行背板的电子设备及存储设备
US11652020B2 (en) * 2019-05-29 2023-05-16 Intel Corporation Thermal solutions for multi-package assemblies and methods for fabricating the same
WO2021154702A1 (en) 2020-01-27 2021-08-05 Fci Usa Llc High speed connector
US11469554B2 (en) 2020-01-27 2022-10-11 Fci Usa Llc High speed, high density direct mate orthogonal connector
CN215816516U (zh) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 电连接器
CN213636403U (zh) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 电连接器

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US4582386A (en) * 1984-11-01 1986-04-15 Elfab Corp. Connector with enlarged power contact
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FR2589286B1 (fr) * 1985-10-25 1988-05-13 Cit Alcatel Ensemble d'interconnexion de cartes de circuits imprimes orthogonales et reseaux de commutation en faisant application
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JP2626698B2 (ja) * 1989-06-15 1997-07-02 株式会社 グラフィコ 放射型・パラレル・システムバス
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US5119273A (en) * 1990-01-29 1992-06-02 The United States Of America As Represented By The Secretary Of The Navy High speed parallel backplane
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Also Published As

Publication number Publication date
JPH07111891B2 (ja) 1995-11-29
JPH05275148A (ja) 1993-10-22
US5335146A (en) 1994-08-02
EP0554077A1 (de) 1993-08-04
EP0554077B1 (de) 1996-09-04

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Legal Events

Date Code Title Description
8332 No legal effect for de